KR101472920B1 - 폴리이미드계 접착제 조성물, 경화물, 접착 시트, 적층체, 플렉서블 프린트 기판 - Google Patents

폴리이미드계 접착제 조성물, 경화물, 접착 시트, 적층체, 플렉서블 프린트 기판 Download PDF

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KR101472920B1
KR101472920B1 KR1020130020139A KR20130020139A KR101472920B1 KR 101472920 B1 KR101472920 B1 KR 101472920B1 KR 1020130020139 A KR1020130020139 A KR 1020130020139A KR 20130020139 A KR20130020139 A KR 20130020139A KR 101472920 B1 KR101472920 B1 KR 101472920B1
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South Korea
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component
polyimide
group
resin
diamine
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KR1020130020139A
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English (en)
Korean (ko)
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KR20130097688A (ko
Inventor
타카시 타자키
쥰 시오타니
히데키 고다
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아라까와 가가꾸 고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020130020139A 2012-02-24 2013-02-25 폴리이미드계 접착제 조성물, 경화물, 접착 시트, 적층체, 플렉서블 프린트 기판 KR101472920B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2012-039140 2012-02-24
JP2012039139 2012-02-24
JP2012039140 2012-02-24
JPJP-P-2012-039139 2012-02-24

Publications (2)

Publication Number Publication Date
KR20130097688A KR20130097688A (ko) 2013-09-03
KR101472920B1 true KR101472920B1 (ko) 2014-12-24

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KR1020130020139A KR101472920B1 (ko) 2012-02-24 2013-02-25 폴리이미드계 접착제 조성물, 경화물, 접착 시트, 적층체, 플렉서블 프린트 기판

Country Status (3)

Country Link
KR (1) KR101472920B1 (zh)
CN (1) CN103289633B (zh)
TW (1) TWI493007B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
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KR20170038740A (ko) * 2015-09-30 2017-04-07 아라까와 가가꾸 고교 가부시끼가이샤 수지 조성물, 접착제, 필름형 접착 기재, 접착 시트, 다층 배선판, 수지 부착 동박, 동장 적층판, 프린트 배선판
KR20190003328A (ko) 2017-06-30 2019-01-09 에스케이씨코오롱피아이 주식회사 폴리이미드 전구체 조성물, 이의 제조방법 및 이로부터 제조된 폴리이미드 기재
KR102090193B1 (ko) * 2018-09-11 2020-03-17 (주)이녹스첨단소재 폴리아믹산 수지 조성물, 이를 포함하는 폴리이미드 수지, 이를 포함하는 연성동박적층필름용 접착제 및 이의 제조방법

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KR20150077317A (ko) * 2013-12-27 2015-07-07 신닛테츠 수미킨 가가쿠 가부시키가이샤 폴리아미드산 조성물, 폴리이미드, 수지 필름 및 금속 피복 적층체
KR20160037793A (ko) * 2014-09-29 2016-04-06 아라까와 가가꾸 고교 가부시끼가이샤 폴리이미드 수지 조성물, 접착제 조성물, 프라이머 조성물, 적층체 및 수지 부착 동박
WO2016114287A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板
TWI696680B (zh) * 2015-03-30 2020-06-21 日商荒川化學工業股份有限公司 聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、覆銅積層板及印刷線路板、以及多層線路板及其製造方法
JP6593649B2 (ja) * 2015-03-31 2019-10-23 荒川化学工業株式会社 接着剤組成物、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、フレキシブル銅張積層板、プリント配線板、フレキシブルプリント配線板、多層配線板、プリント回路板、及びフレキシブルプリント回路板
TWI557180B (zh) * 2015-05-27 2016-11-11 台虹科技股份有限公司 用以形成可溶性聚醯亞胺的組成物、覆蓋膜及其製造方法
TWI724033B (zh) * 2015-09-30 2021-04-11 日商荒川化學工業股份有限公司 改質聚醯亞胺、黏著劑組成物、附有樹脂之銅箔、覆銅積層板、印刷線路板及多層基板
TWI701272B (zh) * 2015-09-30 2020-08-11 日商荒川化學工業股份有限公司 樹脂組成物、黏著劑、薄膜狀黏著材料、黏著薄片、多層線路板、附有樹脂之銅箔、覆銅積層板、印刷線路板
KR102653701B1 (ko) * 2015-09-30 2024-04-01 아라까와 가가꾸 고교 가부시끼가이샤 변성 폴리이미드, 접착제 조성물, 수지 부착 동박, 동장 적층판, 프린트 배선판 및 다층 기판
JP6790816B2 (ja) * 2015-12-28 2020-11-25 荒川化学工業株式会社 ポリイミド系接着剤
JP6825368B2 (ja) * 2016-01-05 2021-02-03 荒川化学工業株式会社 銅張積層体及びプリント配線板
KR102211591B1 (ko) * 2016-03-30 2021-02-02 아라까와 가가꾸 고교 가부시끼가이샤 폴리이미드, 폴리이미드계 접착제, 필름상 접착재, 접착층, 접착 시트, 수지부 동박, 동피복 적층판 및 프린트 배선판, 그리고 다층 배선판 및 그 제조 방법
JP7102691B2 (ja) * 2016-09-05 2022-07-20 荒川化学工業株式会社 フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
KR20190059872A (ko) 2016-09-29 2019-05-31 세키스이가가쿠 고교가부시키가이샤 층간 절연 재료 및 다층 프린트 배선판
JP7003795B2 (ja) * 2017-03-29 2022-01-21 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
KR20190133022A (ko) * 2017-03-29 2019-11-29 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
JP7003794B2 (ja) * 2017-03-29 2022-01-21 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP7114983B2 (ja) * 2017-03-29 2022-08-09 荒川化学工業株式会社 接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
TWI627251B (zh) * 2017-04-10 2018-06-21 台虹科技股份有限公司 暫時性接著用組成物、暫時性接著用溶液以及暫時性接著用膜材
TWI781239B (zh) * 2017-10-27 2022-10-21 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、及接著膜
JP6844570B2 (ja) * 2018-03-29 2021-03-17 信越化学工業株式会社 シリコーンゴム−シリコーン変性ポリイミド樹脂積層体
TWI753196B (zh) * 2018-09-04 2022-01-21 日商日鐵化學材料股份有限公司 覆金屬層疊板、黏接片、黏接性聚醯亞胺樹脂組合物及電路基板
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KR20080075031A (ko) * 2006-01-23 2008-08-13 히다치 가세고교 가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착시트, 및 그것을이용한 반도체장치
KR20110063428A (ko) * 2008-10-01 2011-06-10 토요 보세키 가부시기가이샤 폴리아미드이미드 수지, 이의 수지 조성물, 난연성 접착제 조성물 및 이 조성물을 포함하는 접착제 시트, 커버레이 필름 및 인쇄 배선판
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KR20080075031A (ko) * 2006-01-23 2008-08-13 히다치 가세고교 가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착시트, 및 그것을이용한 반도체장치
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170038740A (ko) * 2015-09-30 2017-04-07 아라까와 가가꾸 고교 가부시끼가이샤 수지 조성물, 접착제, 필름형 접착 기재, 접착 시트, 다층 배선판, 수지 부착 동박, 동장 적층판, 프린트 배선판
KR102524336B1 (ko) * 2015-09-30 2023-04-20 아라까와 가가꾸 고교 가부시끼가이샤 수지 조성물, 접착제, 필름형 접착 기재, 접착 시트, 다층 배선판, 수지 부착 동박, 동장 적층판, 프린트 배선판
KR20190003328A (ko) 2017-06-30 2019-01-09 에스케이씨코오롱피아이 주식회사 폴리이미드 전구체 조성물, 이의 제조방법 및 이로부터 제조된 폴리이미드 기재
KR102090193B1 (ko) * 2018-09-11 2020-03-17 (주)이녹스첨단소재 폴리아믹산 수지 조성물, 이를 포함하는 폴리이미드 수지, 이를 포함하는 연성동박적층필름용 접착제 및 이의 제조방법

Also Published As

Publication number Publication date
TWI493007B (zh) 2015-07-21
CN103289633B (zh) 2015-05-20
KR20130097688A (ko) 2013-09-03
CN103289633A (zh) 2013-09-11
TW201402751A (zh) 2014-01-16

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