KR101472182B1 - 접착제 조성물, 접착 필름 및 기판의 처리 방법 - Google Patents
접착제 조성물, 접착 필름 및 기판의 처리 방법 Download PDFInfo
- Publication number
- KR101472182B1 KR101472182B1 KR1020120106270A KR20120106270A KR101472182B1 KR 101472182 B1 KR101472182 B1 KR 101472182B1 KR 1020120106270 A KR1020120106270 A KR 1020120106270A KR 20120106270 A KR20120106270 A KR 20120106270A KR 101472182 B1 KR101472182 B1 KR 101472182B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- weight
- adhesive
- adhesive composition
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 0 *C(CC(O1)=O)C1=O Chemical compound *C(CC(O1)=O)C1=O 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011218070 | 2011-09-30 | ||
| JPJP-P-2011-218070 | 2011-09-30 | ||
| JP2012062145A JP5661669B2 (ja) | 2011-09-30 | 2012-03-19 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| JPJP-P-2012-062145 | 2012-03-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130035902A KR20130035902A (ko) | 2013-04-09 |
| KR101472182B1 true KR101472182B1 (ko) | 2014-12-12 |
Family
ID=47991512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120106270A Active KR101472182B1 (ko) | 2011-09-30 | 2012-09-25 | 접착제 조성물, 접착 필름 및 기판의 처리 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8809457B2 (https=) |
| JP (1) | JP5661669B2 (https=) |
| KR (1) | KR101472182B1 (https=) |
| TW (1) | TWI460247B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5680128B2 (ja) * | 2012-04-13 | 2015-03-04 | 東京応化工業株式会社 | 接着剤組成物、接着フィルム、及び貼付方法 |
| JP6128970B2 (ja) * | 2012-08-13 | 2017-05-17 | 東京応化工業株式会社 | 接着剤組成物、接着フィルム、貼付方法、および処理方法 |
| US20140299356A1 (en) * | 2013-04-04 | 2014-10-09 | Chong Zhang | Protective film with dye materials for laser absorption enhancement for via drilling |
| TW201601918A (zh) * | 2014-06-13 | 2016-01-16 | 富士軟片股份有限公司 | 暫時接著用積層體、暫時接著用積層體的製造方法以及帶有元件晶圓的積層體 |
| JP6381994B2 (ja) * | 2014-06-27 | 2018-08-29 | 東京応化工業株式会社 | 剥離用組成物及び剥離方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100280179A1 (en) * | 2007-12-14 | 2010-11-04 | Sunstar Giken Kabushiki Kaisha | Adhesive composition |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3640977A (en) | 1969-05-06 | 1972-02-08 | Schenectady Chemical | Interpolymers prepared from vinyl toluene alpha methyl styrene dicyclopentadiene and optionally an acrylic compound |
| JPS573713B2 (https=) | 1973-10-11 | 1982-01-22 | ||
| JPH03223381A (ja) | 1990-01-30 | 1991-10-02 | Mitsui Petrochem Ind Ltd | ホットメルト型粘着剤組成物 |
| JP3032366B2 (ja) * | 1992-01-14 | 2000-04-17 | 日東電工株式会社 | 表面保護フィルム |
| JPH05279554A (ja) | 1992-03-31 | 1993-10-26 | Nippon Zeon Co Ltd | ノルボルネン系開環重合樹脂組成物 |
| JPH0633027A (ja) * | 1992-05-21 | 1994-02-08 | Sekisui Chem Co Ltd | 合成樹脂ライニング用接着剤及び合成樹脂ライニング管 |
| JPH07157737A (ja) * | 1993-12-03 | 1995-06-20 | Aica Kogyo Co Ltd | 接着剤組成物 |
| JP2767196B2 (ja) | 1994-02-08 | 1998-06-18 | 日化精工株式会社 | 仮止め用接着剤 |
| JPH0869113A (ja) | 1994-08-30 | 1996-03-12 | Sony Corp | 反射防止膜形成材料、レジストパターン形成方法、及び半導体装置の製造方法 |
| JP3341954B2 (ja) | 1994-09-26 | 2002-11-05 | 三井化学株式会社 | 樹脂組成物 |
| JP2741362B2 (ja) | 1995-12-05 | 1998-04-15 | 日化精工株式会社 | ウエハ−の仮着用接着剤 |
| KR100568491B1 (ko) | 1997-07-04 | 2006-04-07 | 제온 코포레이션 | 반도체부품 접착제 |
| JP3918290B2 (ja) | 1998-03-24 | 2007-05-23 | 日本ゼオン株式会社 | 接着性樹脂組成物 |
| JP2000034454A (ja) * | 1998-07-15 | 2000-02-02 | Aica Kogyo Co Ltd | 接着剤 |
| JP3936489B2 (ja) | 1999-04-16 | 2007-06-27 | 積水化学工業株式会社 | ノルボルネン系位相差補償フィルム |
| JP2000327878A (ja) | 1999-05-21 | 2000-11-28 | Mitsui Chemicals Inc | 水性分散体およびその製造方法 |
| US6255396B1 (en) | 1999-09-09 | 2001-07-03 | Baxter International Inc. | Cycloolefin blends and method for solvent bonding polyolefins |
| JP2001187874A (ja) | 1999-10-18 | 2001-07-10 | Sanyo Chem Ind Ltd | ホットメルト接着剤 |
| JP2001279208A (ja) | 2000-01-26 | 2001-10-10 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物及びアクリル系粘着テープもしくはシート |
| US7015276B2 (en) | 2000-10-02 | 2006-03-21 | Sekisui Chemical Co., Ltd. | Melt-moldable thermoplastic norbornene resin composition and molded article and optical film both comprising the same |
| JP3833916B2 (ja) | 2000-10-02 | 2006-10-18 | 積水化学工業株式会社 | 溶融成形可能な熱可塑性ノルボルネン系樹脂組成物及びそれを用いた成形品又は光学フィルム |
| JP2003173993A (ja) | 2001-12-04 | 2003-06-20 | Sekisui Chem Co Ltd | バックグラインドテープ及び半導体ウエハの研磨方法 |
| WO2003095579A1 (en) | 2002-05-13 | 2003-11-20 | Jsr Corporation | Composition and method for temporarily fixing solid |
| JP2005290277A (ja) * | 2004-04-02 | 2005-10-20 | Sun A Kaken Co Ltd | 表面保護フィルム |
| TWI388574B (zh) | 2005-03-17 | 2013-03-11 | Dow Global Technologies Llc | 由乙烯/α-烯烴之異種共聚物製成的黏著及標記組成物 |
| US20090280318A1 (en) | 2005-12-09 | 2009-11-12 | Mitsui Chemicals, Inc. | Olefin polymer, composition thereof and adhesive resin comprising the composition |
| US8268449B2 (en) | 2006-02-06 | 2012-09-18 | Brewer Science Inc. | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
| US20080200011A1 (en) | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| US7713835B2 (en) | 2006-10-06 | 2010-05-11 | Brewer Science Inc. | Thermally decomposable spin-on bonding compositions for temporary wafer bonding |
| JP4976829B2 (ja) | 2006-11-29 | 2012-07-18 | 東京応化工業株式会社 | 接着剤組成物、及び接着フィルム |
| JP5215570B2 (ja) | 2007-02-28 | 2013-06-19 | Jx日鉱日石エネルギー株式会社 | 溶剤組成物 |
| JP5076144B2 (ja) | 2007-06-05 | 2012-11-21 | 東北リコー株式会社 | 孔版印刷装置 |
| JP5476046B2 (ja) | 2008-10-03 | 2014-04-23 | 東京応化工業株式会社 | 剥離方法、基板の接着剤、および基板を含む積層体 |
| US8092628B2 (en) | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| JP5489546B2 (ja) | 2009-06-11 | 2014-05-14 | 東京応化工業株式会社 | 貼付方法及び貼付装置 |
| JP5681502B2 (ja) | 2010-09-30 | 2015-03-11 | 東京応化工業株式会社 | 接着剤組成物 |
-
2012
- 2012-03-19 JP JP2012062145A patent/JP5661669B2/ja active Active
- 2012-09-25 KR KR1020120106270A patent/KR101472182B1/ko active Active
- 2012-09-26 TW TW101135299A patent/TWI460247B/zh active
- 2012-09-27 US US13/628,989 patent/US8809457B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100280179A1 (en) * | 2007-12-14 | 2010-11-04 | Sunstar Giken Kabushiki Kaisha | Adhesive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| US8809457B2 (en) | 2014-08-19 |
| TWI460247B (zh) | 2014-11-11 |
| KR20130035902A (ko) | 2013-04-09 |
| US20130081760A1 (en) | 2013-04-04 |
| TW201333143A (zh) | 2013-08-16 |
| JP5661669B2 (ja) | 2015-01-28 |
| JP2013082877A (ja) | 2013-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101502296B1 (ko) | 접착제 조성물, 접착 필름, 및 첩부 방법 | |
| KR101798687B1 (ko) | 접착제 조성물, 접착 필름 및 첩부 방법 | |
| JP2014037458A (ja) | 接着剤組成物、接着フィルムおよび貼付方法 | |
| KR101472182B1 (ko) | 접착제 조성물, 접착 필름 및 기판의 처리 방법 | |
| JP2014049698A (ja) | 剥離方法および剥離装置 | |
| KR101569954B1 (ko) | 접착제 조성물 | |
| JP6194394B2 (ja) | 半導体装置の製造方法 | |
| KR102148125B1 (ko) | 접착제 조성물 및 접착 필름 | |
| KR101780519B1 (ko) | 접착제 조성물 및 접착 필름 | |
| KR101799613B1 (ko) | 접착제 조성물의 제조 방법, 접착제 조성물 및 접착 필름 | |
| JP6128837B2 (ja) | 接着剤組成物の製造方法、接着剤組成物及び接着フィルム | |
| KR101777895B1 (ko) | 접착제 조성물, 접착 필름 및 기판의 처리 방법 | |
| JP6063737B2 (ja) | 接着剤組成物、接着フィルムおよび基板の処理方法 | |
| KR101809773B1 (ko) | 접착제 조성물 및 접착 필름 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| A302 | Request for accelerated examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PA0302 | Request for accelerated examination |
St.27 status event code: A-1-2-D10-D17-exm-PA0302 St.27 status event code: A-1-2-D10-D16-exm-PA0302 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20171117 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20181115 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 12 |