JP5661669B2 - 接着剤組成物、接着フィルムおよび基板の処理方法 - Google Patents

接着剤組成物、接着フィルムおよび基板の処理方法 Download PDF

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Publication number
JP5661669B2
JP5661669B2 JP2012062145A JP2012062145A JP5661669B2 JP 5661669 B2 JP5661669 B2 JP 5661669B2 JP 2012062145 A JP2012062145 A JP 2012062145A JP 2012062145 A JP2012062145 A JP 2012062145A JP 5661669 B2 JP5661669 B2 JP 5661669B2
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Japan
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groups
adhesive composition
adhesive
group
film
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JP2012062145A
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English (en)
Japanese (ja)
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JP2013082877A5 (https=
JP2013082877A (ja
Inventor
洋文 今井
洋文 今井
弘毅 田村
弘毅 田村
安通史 久保
安通史 久保
孝広 吉岡
孝広 吉岡
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2012062145A priority Critical patent/JP5661669B2/ja
Priority to KR1020120106270A priority patent/KR101472182B1/ko
Priority to TW101135299A priority patent/TWI460247B/zh
Priority to US13/628,989 priority patent/US8809457B2/en
Publication of JP2013082877A publication Critical patent/JP2013082877A/ja
Publication of JP2013082877A5 publication Critical patent/JP2013082877A5/ja
Application granted granted Critical
Publication of JP5661669B2 publication Critical patent/JP5661669B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012062145A 2011-09-30 2012-03-19 接着剤組成物、接着フィルムおよび基板の処理方法 Active JP5661669B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012062145A JP5661669B2 (ja) 2011-09-30 2012-03-19 接着剤組成物、接着フィルムおよび基板の処理方法
KR1020120106270A KR101472182B1 (ko) 2011-09-30 2012-09-25 접착제 조성물, 접착 필름 및 기판의 처리 방법
TW101135299A TWI460247B (zh) 2011-09-30 2012-09-26 接著劑組成物、接著薄膜及基板之處理方法
US13/628,989 US8809457B2 (en) 2011-09-30 2012-09-27 Adhesive composition, adhesive film, and method for treating substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011218070 2011-09-30
JP2011218070 2011-09-30
JP2012062145A JP5661669B2 (ja) 2011-09-30 2012-03-19 接着剤組成物、接着フィルムおよび基板の処理方法

Publications (3)

Publication Number Publication Date
JP2013082877A JP2013082877A (ja) 2013-05-09
JP2013082877A5 JP2013082877A5 (https=) 2014-07-10
JP5661669B2 true JP5661669B2 (ja) 2015-01-28

Family

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Family Applications (1)

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JP2012062145A Active JP5661669B2 (ja) 2011-09-30 2012-03-19 接着剤組成物、接着フィルムおよび基板の処理方法

Country Status (4)

Country Link
US (1) US8809457B2 (https=)
JP (1) JP5661669B2 (https=)
KR (1) KR101472182B1 (https=)
TW (1) TWI460247B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5680128B2 (ja) * 2012-04-13 2015-03-04 東京応化工業株式会社 接着剤組成物、接着フィルム、及び貼付方法
JP6128970B2 (ja) * 2012-08-13 2017-05-17 東京応化工業株式会社 接着剤組成物、接着フィルム、貼付方法、および処理方法
US20140299356A1 (en) * 2013-04-04 2014-10-09 Chong Zhang Protective film with dye materials for laser absorption enhancement for via drilling
TW201601918A (zh) * 2014-06-13 2016-01-16 富士軟片股份有限公司 暫時接著用積層體、暫時接著用積層體的製造方法以及帶有元件晶圓的積層體
JP6381994B2 (ja) * 2014-06-27 2018-08-29 東京応化工業株式会社 剥離用組成物及び剥離方法

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JPS573713B2 (https=) 1973-10-11 1982-01-22
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Also Published As

Publication number Publication date
US8809457B2 (en) 2014-08-19
TWI460247B (zh) 2014-11-11
KR101472182B1 (ko) 2014-12-12
KR20130035902A (ko) 2013-04-09
US20130081760A1 (en) 2013-04-04
TW201333143A (zh) 2013-08-16
JP2013082877A (ja) 2013-05-09

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