KR101462286B1 - 에칭액 - Google Patents

에칭액 Download PDF

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Publication number
KR101462286B1
KR101462286B1 KR1020090001887A KR20090001887A KR101462286B1 KR 101462286 B1 KR101462286 B1 KR 101462286B1 KR 1020090001887 A KR1020090001887 A KR 1020090001887A KR 20090001887 A KR20090001887 A KR 20090001887A KR 101462286 B1 KR101462286 B1 KR 101462286B1
Authority
KR
South Korea
Prior art keywords
nickel
etching solution
polymer
repeating unit
iii
Prior art date
Application number
KR1020090001887A
Other languages
English (en)
Korean (ko)
Other versions
KR20090077718A (ko
Inventor
다이스께 카따야마
마사요 크리
Original Assignee
멕크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 멕크 가부시키가이샤 filed Critical 멕크 가부시키가이샤
Publication of KR20090077718A publication Critical patent/KR20090077718A/ko
Application granted granted Critical
Publication of KR101462286B1 publication Critical patent/KR101462286B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
KR1020090001887A 2008-01-11 2009-01-09 에칭액 KR101462286B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008004707 2008-01-11
JPJP-P-2008-004707 2008-01-11
JPJP-P-2008-262945 2008-10-09
JP2008262945A JP5360703B2 (ja) 2008-01-11 2008-10-09 エッチング液

Publications (2)

Publication Number Publication Date
KR20090077718A KR20090077718A (ko) 2009-07-15
KR101462286B1 true KR101462286B1 (ko) 2014-11-14

Family

ID=40879087

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090001887A KR101462286B1 (ko) 2008-01-11 2009-01-09 에칭액

Country Status (4)

Country Link
JP (1) JP5360703B2 (zh)
KR (1) KR101462286B1 (zh)
CN (1) CN101481801B (zh)
TW (1) TWI464301B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102230178B (zh) * 2011-04-29 2012-09-05 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
KR101298766B1 (ko) * 2011-05-20 2013-08-21 주식회사 익스톨 니켈, 크롬, 니켈-크롬 합금의 에칭 용액 조성물 및 이를 이용한 에칭 방법
CN103281863B (zh) * 2013-04-28 2016-04-20 胜宏科技（惠州）股份有限公司 一种线路板镀金手指的返工方法
KR101590258B1 (ko) * 2014-07-04 2016-02-01 오씨아이 주식회사 니켈을 포함하는 금속층의 식각용 조성물
CN105506628B (zh) * 2015-12-03 2018-01-12 苏州鑫德杰电子有限公司 一种大叶海藻浸提物蚀刻液及其制备方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
CN107740101A (zh) * 2017-09-19 2018-02-27 合肥惠科金扬科技有限公司 一种用于amoled阵列基板铜导线的蚀刻液
CN108754498A (zh) * 2018-06-15 2018-11-06 西安微电子技术研究所 一种低温化学镍槽体沉积镍层褪除溶液及褪镍层的方法
CN113957442A (zh) * 2021-02-01 2022-01-21 江苏悦锌达新材料有限公司 一种用于电镀镍抗蚀层的褪镍药水及制备方法、化学褪镍工艺
CN113773840B (zh) * 2021-08-13 2022-08-02 晶瑞电子材料股份有限公司 一种蚀刻液及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040049816A (ko) * 2002-12-06 2004-06-12 멧쿠 가부시키가이샤 에칭액
KR20060066349A (ko) * 2004-12-13 2006-06-16 동우 화인켐 주식회사 알루미늄, 니켈, 첨가금속으로 구성된 단일금속 합금막식각액 조성물

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3540887B2 (ja) * 1996-02-26 2004-07-07 荏原ユージライト株式会社 選択的ニッケル剥離液およびこれを用いる剥離方法
US6630074B1 (en) * 1997-04-04 2003-10-07 International Business Machines Corporation Etching composition and use thereof
US7176041B2 (en) * 2003-07-01 2007-02-13 Samsung Electronics Co., Ltd. PAA-based etchant, methods of using same, and resultant structures
JP2007180172A (ja) * 2005-12-27 2007-07-12 Mec Kk 基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040049816A (ko) * 2002-12-06 2004-06-12 멧쿠 가부시키가이샤 에칭액
KR20060066349A (ko) * 2004-12-13 2006-06-16 동우 화인켐 주식회사 알루미늄, 니켈, 첨가금속으로 구성된 단일금속 합금막식각액 조성물

Also Published As

Publication number Publication date
TWI464301B (zh) 2014-12-11
CN101481801B (zh) 2012-09-26
JP2009185377A (ja) 2009-08-20
KR20090077718A (ko) 2009-07-15
TW200930839A (en) 2009-07-16
CN101481801A (zh) 2009-07-15
JP5360703B2 (ja) 2013-12-04

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