JP5360703B2 - エッチング液 - Google Patents

エッチング液 Download PDF

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Publication number
JP5360703B2
JP5360703B2 JP2008262945A JP2008262945A JP5360703B2 JP 5360703 B2 JP5360703 B2 JP 5360703B2 JP 2008262945 A JP2008262945 A JP 2008262945A JP 2008262945 A JP2008262945 A JP 2008262945A JP 5360703 B2 JP5360703 B2 JP 5360703B2
Authority
JP
Japan
Prior art keywords
group
polymer
etching solution
nickel
repeating unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008262945A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009185377A (ja
Inventor
大輔 片山
雅代 栗井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Priority to JP2008262945A priority Critical patent/JP5360703B2/ja
Priority to TW097144320A priority patent/TWI464301B/zh
Priority to CN2008101857971A priority patent/CN101481801B/zh
Priority to KR1020090001887A priority patent/KR101462286B1/ko
Publication of JP2009185377A publication Critical patent/JP2009185377A/ja
Application granted granted Critical
Publication of JP5360703B2 publication Critical patent/JP5360703B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
JP2008262945A 2008-01-11 2008-10-09 エッチング液 Active JP5360703B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008262945A JP5360703B2 (ja) 2008-01-11 2008-10-09 エッチング液
TW097144320A TWI464301B (zh) 2008-01-11 2008-11-17 Etching solution
CN2008101857971A CN101481801B (zh) 2008-01-11 2008-12-10 蚀刻液
KR1020090001887A KR101462286B1 (ko) 2008-01-11 2009-01-09 에칭액

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008004707 2008-01-11
JP2008004707 2008-01-11
JP2008262945A JP5360703B2 (ja) 2008-01-11 2008-10-09 エッチング液

Publications (2)

Publication Number Publication Date
JP2009185377A JP2009185377A (ja) 2009-08-20
JP5360703B2 true JP5360703B2 (ja) 2013-12-04

Family

ID=40879087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008262945A Active JP5360703B2 (ja) 2008-01-11 2008-10-09 エッチング液

Country Status (4)

Country Link
JP (1) JP5360703B2 (zh)
KR (1) KR101462286B1 (zh)
CN (1) CN101481801B (zh)
TW (1) TWI464301B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102230178B (zh) * 2011-04-29 2012-09-05 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
KR101298766B1 (ko) * 2011-05-20 2013-08-21 주식회사 익스톨 니켈, 크롬, 니켈-크롬 합금의 에칭 용액 조성물 및 이를 이용한 에칭 방법
CN103281863B (zh) * 2013-04-28 2016-04-20 胜宏科技（惠州）股份有限公司 一种线路板镀金手指的返工方法
KR101590258B1 (ko) * 2014-07-04 2016-02-01 오씨아이 주식회사 니켈을 포함하는 금속층의 식각용 조성물
CN105506628B (zh) * 2015-12-03 2018-01-12 苏州鑫德杰电子有限公司 一种大叶海藻浸提物蚀刻液及其制备方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
CN107740101A (zh) * 2017-09-19 2018-02-27 合肥惠科金扬科技有限公司 一种用于amoled阵列基板铜导线的蚀刻液
CN108754498A (zh) * 2018-06-15 2018-11-06 西安微电子技术研究所 一种低温化学镍槽体沉积镍层褪除溶液及褪镍层的方法
CN113957442A (zh) * 2021-02-01 2022-01-21 江苏悦锌达新材料有限公司 一种用于电镀镍抗蚀层的褪镍药水及制备方法、化学褪镍工艺
CN113773840B (zh) * 2021-08-13 2022-08-02 晶瑞电子材料股份有限公司 一种蚀刻液及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3540887B2 (ja) * 1996-02-26 2004-07-07 荏原ユージライト株式会社 選択的ニッケル剥離液およびこれを用いる剥離方法
US6630074B1 (en) * 1997-04-04 2003-10-07 International Business Machines Corporation Etching composition and use thereof
JP4241018B2 (ja) * 2002-12-06 2009-03-18 メック株式会社 エッチング液
US7176041B2 (en) * 2003-07-01 2007-02-13 Samsung Electronics Co., Ltd. PAA-based etchant, methods of using same, and resultant structures
KR101230817B1 (ko) * 2004-12-13 2013-02-07 동우 화인켐 주식회사 알루미늄, 니켈, 첨가금속으로 구성된 단일금속 합금막식각액 조성물
JP2007180172A (ja) * 2005-12-27 2007-07-12 Mec Kk 基板の製造方法

Also Published As

Publication number Publication date
TWI464301B (zh) 2014-12-11
CN101481801B (zh) 2012-09-26
JP2009185377A (ja) 2009-08-20
KR20090077718A (ko) 2009-07-15
TW200930839A (en) 2009-07-16
CN101481801A (zh) 2009-07-15
KR101462286B1 (ko) 2014-11-14

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