KR101422566B1 - 프로브 및 프로브 카드 - Google Patents

프로브 및 프로브 카드 Download PDF

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Publication number
KR101422566B1
KR101422566B1 KR1020130027116A KR20130027116A KR101422566B1 KR 101422566 B1 KR101422566 B1 KR 101422566B1 KR 1020130027116 A KR1020130027116 A KR 1020130027116A KR 20130027116 A KR20130027116 A KR 20130027116A KR 101422566 B1 KR101422566 B1 KR 101422566B1
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KR
South Korea
Prior art keywords
probe
main body
body portion
proximal end
elastic support
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KR1020130027116A
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English (en)
Korean (ko)
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KR20130110027A (ko
Inventor
미노루 사토
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가부시키가이샤 니혼 마이크로닉스
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020130027116A 2012-03-27 2013-03-14 프로브 및 프로브 카드 Active KR101422566B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-072014 2012-03-27
JP2012072014A JP5868239B2 (ja) 2012-03-27 2012-03-27 プローブ及びプローブカード

Publications (2)

Publication Number Publication Date
KR20130110027A KR20130110027A (ko) 2013-10-08
KR101422566B1 true KR101422566B1 (ko) 2014-07-25

Family

ID=48095544

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130027116A Active KR101422566B1 (ko) 2012-03-27 2013-03-14 프로브 및 프로브 카드

Country Status (5)

Country Link
US (1) US9194886B2 (https=)
EP (1) EP2645113B1 (https=)
JP (1) JP5868239B2 (https=)
KR (1) KR101422566B1 (https=)
TW (1) TWI503550B (https=)

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AT515629B1 (de) * 2014-04-14 2020-07-15 Dr Gaggl Rainer Nadelkarte
JP6407672B2 (ja) * 2014-11-18 2018-10-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6484137B2 (ja) * 2014-11-26 2019-03-13 株式会社日本マイクロニクス プローブ及び接触検査装置
EP3292415B1 (en) * 2015-05-07 2020-04-01 Technoprobe S.p.A Testing head having vertical probes, in particular for reduced pitch applications
JP6484136B2 (ja) * 2015-07-27 2019-03-13 株式会社日本マイクロニクス 接触検査装置
TWI626452B (zh) * 2017-01-09 2018-06-11 Probe head architecture for vertical probes and their probe cards
TWI630393B (zh) * 2017-09-04 2018-07-21 中華精測科技股份有限公司 探針卡裝置及其矩形探針
TWI638166B (zh) * 2018-01-24 2018-10-11 中華精測科技股份有限公司 探針卡裝置及矩形探針
US11454650B2 (en) * 2018-07-18 2022-09-27 Nidec-Read Corporation Probe, inspection jig, inspection device, and method for manufacturing probe
US10608356B2 (en) * 2018-08-30 2020-03-31 L-3 Technologies, Inc. Multiple node bus bar contacts for high-power electronic assemblies
TWI766154B (zh) * 2019-03-27 2022-06-01 旺矽科技股份有限公司 探針頭及探針卡
IT201900014208A1 (it) 2019-08-07 2021-02-07 Technoprobe Spa Testa di misura di dispositivi elettronici e relativa scheda di misura
KR102329790B1 (ko) * 2019-12-26 2021-11-23 주식회사 에스디에이 가변형 mems 프로브 카드 및 이의 조립방법
US12332278B2 (en) 2020-09-15 2025-06-17 Japan Electronic Materials Corporation Probe card
CN112098813B (zh) * 2020-10-11 2021-04-02 强一半导体（苏州）有限公司 一种调幅探针卡及其探针和调幅结构
CN114545042B (zh) * 2020-11-24 2025-07-18 台湾中华精测科技股份有限公司 探针卡装置及自对准探针
KR102509525B1 (ko) * 2021-02-22 2023-03-14 (주)포인트엔지니어링 전기 전도성 접촉핀 및 그 어셈블리
KR102321081B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브 조립체
KR102951744B1 (ko) 2021-08-30 2026-04-13 (주)포인트엔지니어링 수직형 프로브 카드
IT202100032882A1 (it) * 2021-12-29 2023-06-29 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura
CN118302678A (zh) * 2022-03-31 2024-07-05 日本电子材料株式会社 探针插通方法以及探针
KR102897696B1 (ko) * 2023-05-02 2025-12-09 (주)티에스이 저항구조체를 갖는 반도체 소자 테스트용 프로브 헤드
KR102834165B1 (ko) * 2023-12-21 2025-07-17 주식회사 메가터치 스프링 핀, 그 스프링 핀을 구비한 포고핀, 그 스프링 핀 및 그 포고핀의 제조 방법
KR102834159B1 (ko) * 2023-12-21 2025-07-17 주식회사 메가터치 포고핀

Citations (4)

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JPH09251034A (ja) * 1996-03-13 1997-09-22 Tokusoo Riken:Kk 配線検査板
JP2000501241A (ja) * 1995-11-30 2000-02-02 ザ ウィタカー コーポレーション 電子パッケージ用表面実装型ソケット及びそれに用いられるコンタクト
JP2008292327A (ja) * 2007-05-25 2008-12-04 Hioki Ee Corp プローブユニットおよび回路基板検査装置
KR20090122620A (ko) * 2008-05-26 2009-12-01 윌테크놀러지(주) 프로브

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JPH0541417A (ja) * 1991-07-12 1993-02-19 Nec Corp プローブカード
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
JP2811295B2 (ja) * 1995-08-10 1998-10-15 日本電子材料株式会社 垂直型プローブカード
JP2000249721A (ja) * 1999-03-02 2000-09-14 Sony Corp プローブカード
JP2000292439A (ja) * 1999-04-06 2000-10-20 Japan Electronic Materials Corp 垂直作動型プローブカード
WO2003007003A1 (en) * 2001-07-11 2003-01-23 Formfactor, Inc. Method of manufacturing a probe card
JP3791689B2 (ja) * 2004-01-09 2006-06-28 日本電子材料株式会社 プローブカード
JP2006010629A (ja) * 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード
JP2006084450A (ja) 2004-09-17 2006-03-30 Sumitomo Electric Ind Ltd コンタクトプローブおよびプローブカード
JP2006226702A (ja) * 2005-02-15 2006-08-31 Nidec-Read Corp 基板検査用治具、基板検査装置及び検査用接触子
JP2006242774A (ja) * 2005-03-03 2006-09-14 Tokyo Electron Ltd プローブ及びプローブカード
TWI261672B (en) * 2005-03-15 2006-09-11 Mjc Probe Inc Elastic micro probe and method of making same
KR100653636B1 (ko) * 2005-08-03 2006-12-05 주식회사 파이컴 수직형 프로브, 그 제조 방법 및 프로브의 본딩 방법
KR100701498B1 (ko) 2006-02-20 2007-03-29 주식회사 새한마이크로텍 반도체 검사용 프로브핀 조립체 및 그 제조방법
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JP5364581B2 (ja) * 2007-09-27 2013-12-11 株式会社東芝 プローブ針素材とそれを用いたプローブ針およびプローブカード、ならびに検査方法
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
JP5341456B2 (ja) * 2008-10-06 2013-11-13 日本電子材料株式会社 プローブカード
JP2010197092A (ja) * 2009-02-23 2010-09-09 Nhk Spring Co Ltd コンタクトプローブおよびプローブユニット
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Publication number Priority date Publication date Assignee Title
JP2000501241A (ja) * 1995-11-30 2000-02-02 ザ ウィタカー コーポレーション 電子パッケージ用表面実装型ソケット及びそれに用いられるコンタクト
JPH09251034A (ja) * 1996-03-13 1997-09-22 Tokusoo Riken:Kk 配線検査板
JP2008292327A (ja) * 2007-05-25 2008-12-04 Hioki Ee Corp プローブユニットおよび回路基板検査装置
KR20090122620A (ko) * 2008-05-26 2009-12-01 윌테크놀러지(주) 프로브

Also Published As

Publication number Publication date
TW201350858A (zh) 2013-12-16
TWI503550B (zh) 2015-10-11
EP2645113A2 (en) 2013-10-02
JP2013205098A (ja) 2013-10-07
US9194886B2 (en) 2015-11-24
US20130265074A1 (en) 2013-10-10
EP2645113A3 (en) 2017-12-20
EP2645113B1 (en) 2026-03-18
JP5868239B2 (ja) 2016-02-24
KR20130110027A (ko) 2013-10-08

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