JP5947139B2 - プローブ及び電気的接続装置 - Google Patents
プローブ及び電気的接続装置 Download PDFInfo
- Publication number
- JP5947139B2 JP5947139B2 JP2012166539A JP2012166539A JP5947139B2 JP 5947139 B2 JP5947139 B2 JP 5947139B2 JP 2012166539 A JP2012166539 A JP 2012166539A JP 2012166539 A JP2012166539 A JP 2012166539A JP 5947139 B2 JP5947139 B2 JP 5947139B2
- Authority
- JP
- Japan
- Prior art keywords
- elastic member
- probe
- connecting member
- end edge
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims description 67
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000007689 inspection Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
本発明の一形態に係る電気的接続装置は、被検査体に接触する上述のプローブと、前記プローブを片持ち梁状に支持する配線基板と、を備える。
2 被検査体
3 電極
4 配線基板、4a 開口
5 プローブ
6 接続ランド
7 テスターランド
8 台座
9 接触子
10 第1の弾性部材
11 第2の弾性部材
12 第1の連結部材
13 第2の連結部材
14 第3の連結部材
15 座部
16 針先部
Claims (2)
- 基板上に配置される台座と、
長手方向がプローブの前後方向に配置され、前記基板上から離れる方向において、所定の間隔を隔てて配置された第1及び第2の弾性部材と、
前記第1の弾性部材と前記第2の弾性部材との間に配置され、前記第2の弾性部材の一方の端部が前記台座に固定され、前記台座に固定された固定端部側と反対に位置する自由端部側で前記第1の弾性部材と前記第2の弾性部材とを連結する第1の連結部材と、
前記第1の弾性部材と前記第2の弾性部材との間に配置され、前記第1の弾性部材と前記第2の弾性部材とを前記固定端部側で連結する第2の連結部材と、
前記第1の弾性部材における前記第1の連結部材に対して反対側に配置された第3の連結部材と、
前記第3の連結部材において前記第1の弾性部材に対して反対側に突出した接触部と、を備え、
前記第2の弾性部材の前記固定端部側の方向に位置する前記第3の連結部材の後端縁は、前記第1の連結部材の前記固定端部側の方向に位置する後端縁より前記固定端部側に近い位置に配置され、
前記第2の弾性部材の前記自由端部側の方向に位置する前記第3の連結部材の前端縁は、前記第1の連結部材の前記自由端部側の方向に位置する前端縁より前記自由端部側の方向に超えて配置され、
前記第2の弾性部材の前記自由端部側の方向に位置する前記第1の弾性部材の前端縁は、前記プローブの前後方向において前記第1の連結部材の前端縁と前記第3の連結部材の前端縁との間に配置されているプローブ。 - 被検査体に接触する請求項1に記載のプローブを備える電気的接続装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012166539A JP5947139B2 (ja) | 2012-07-27 | 2012-07-27 | プローブ及び電気的接続装置 |
TW102124275A TWI495879B (zh) | 2012-07-27 | 2013-07-05 | 探針及電性連接裝置 |
KR20130081371A KR101478714B1 (ko) | 2012-07-27 | 2013-07-11 | 프로브 및 전기적 접속장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012166539A JP5947139B2 (ja) | 2012-07-27 | 2012-07-27 | プローブ及び電気的接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014025817A JP2014025817A (ja) | 2014-02-06 |
JP5947139B2 true JP5947139B2 (ja) | 2016-07-06 |
Family
ID=50199594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012166539A Active JP5947139B2 (ja) | 2012-07-27 | 2012-07-27 | プローブ及び電気的接続装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5947139B2 (ja) |
KR (1) | KR101478714B1 (ja) |
TW (1) | TWI495879B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101865756B1 (ko) * | 2017-06-28 | 2018-06-11 | (주) 마이크로프랜드 | 짧은 스크럽마크를 위한 프로브 카드의 다중 캔틸레버 빔 구조체 및 그 제조방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6472228B2 (ja) * | 2014-12-01 | 2019-02-20 | 株式会社日本マイクロニクス | カンチレバー型プローブ、及びプローブカード |
KR20190021101A (ko) | 2017-08-22 | 2019-03-05 | 삼성전자주식회사 | 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법 |
JP7471778B2 (ja) * | 2019-03-29 | 2024-04-22 | 株式会社日本マイクロニクス | プローブカード |
JP2021028603A (ja) * | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001048818A1 (en) * | 1999-12-29 | 2001-07-05 | Formfactor, Inc. | Resilient interconnect structure for electronic components and method for making the same |
JP2004156993A (ja) * | 2002-11-06 | 2004-06-03 | Micronics Japan Co Ltd | プローブ及びこれを用いた電気的接続装置 |
KR100473584B1 (ko) | 2002-12-02 | 2005-03-10 | 주식회사 아이씨멤즈 | 외팔보 형태의 프로브 카드 및 그 제조 방법 |
JP2004340617A (ja) * | 2003-05-13 | 2004-12-02 | Micronics Japan Co Ltd | 通電試験用電気的接続装置 |
DE102004036407A1 (de) * | 2003-08-27 | 2005-06-09 | Japan Electronic Materials Corp., Amagasaki | Prüfkarte und Verbinder für diese |
WO2006095441A1 (ja) * | 2005-03-07 | 2006-09-14 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ及びこれを用いた電気的接続装置 |
JP2006284362A (ja) * | 2005-03-31 | 2006-10-19 | Nhk Spring Co Ltd | コンタクトプローブ |
KR20090030543A (ko) * | 2007-09-20 | 2009-03-25 | 주식회사 아이에스시테크놀러지 | 프로브 핀 및 이를 제조하는 방법 |
JP2009204393A (ja) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法 |
JP2011141126A (ja) * | 2010-01-05 | 2011-07-21 | Toshiba Corp | プローブカード |
KR101040733B1 (ko) | 2010-07-19 | 2011-06-10 | (주) 마이크로프랜드 | 프로브 카드의 다중 캔틸레버 빔 구조체 및 그 제조방법 |
-
2012
- 2012-07-27 JP JP2012166539A patent/JP5947139B2/ja active Active
-
2013
- 2013-07-05 TW TW102124275A patent/TWI495879B/zh active
- 2013-07-11 KR KR20130081371A patent/KR101478714B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101865756B1 (ko) * | 2017-06-28 | 2018-06-11 | (주) 마이크로프랜드 | 짧은 스크럽마크를 위한 프로브 카드의 다중 캔틸레버 빔 구조체 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20140015188A (ko) | 2014-02-06 |
KR101478714B1 (ko) | 2015-01-05 |
JP2014025817A (ja) | 2014-02-06 |
TWI495879B (zh) | 2015-08-11 |
TW201405129A (zh) | 2014-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5868239B2 (ja) | プローブ及びプローブカード | |
JP4583766B2 (ja) | 接触子及び電気的接続装置 | |
JP5947139B2 (ja) | プローブ及び電気的接続装置 | |
JP5008005B2 (ja) | プローブカード | |
KR101049767B1 (ko) | 전기적 접속장치 | |
JP2009162483A (ja) | 電気的接続装置 | |
KR20060124562A (ko) | 통전시험용 프로브 | |
KR20090094841A (ko) | 강화 접촉 요소 | |
JP2006189370A (ja) | 通電試験用プローブ | |
JP5096825B2 (ja) | プローブ及び電気的接続装置 | |
JP5075585B2 (ja) | 電気的接続装置 | |
JP2001099863A (ja) | プローブ及びそれを用いたプローブカード | |
JP2010043957A (ja) | プローブカード | |
JP4734187B2 (ja) | 半導体検査装置 | |
JP4571007B2 (ja) | 通電試験用プローブ | |
JP2006337080A (ja) | 通電試験用プローブ | |
CN112526178A (zh) | 探针及测试装置 | |
JP6770798B2 (ja) | コンタクトプローブ | |
CN211263556U (zh) | 探针及测试装置 | |
JP5504310B2 (ja) | 電気的接続装置に用いる接触子の使用方法 | |
JP5186508B2 (ja) | 電気的接続装置及びこの電気的接続装置に用いる接触子 | |
JP5055149B2 (ja) | 電気的接続装置 | |
JP2009025267A (ja) | 電気的接続装置 | |
JP2013019686A (ja) | 配線検査治具及び配線検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150409 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160119 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160310 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160524 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160602 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5947139 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |