JP2014025817A - プローブ及び電気的接続装置 - Google Patents
プローブ及び電気的接続装置 Download PDFInfo
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- JP2014025817A JP2014025817A JP2012166539A JP2012166539A JP2014025817A JP 2014025817 A JP2014025817 A JP 2014025817A JP 2012166539 A JP2012166539 A JP 2012166539A JP 2012166539 A JP2012166539 A JP 2012166539A JP 2014025817 A JP2014025817 A JP 2014025817A
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- elastic member
- probe
- connecting member
- rear end
- elastic
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- 239000000523 sample Substances 0.000 title claims abstract description 68
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】本発明の一形態に係るプローブ5は、台座8と、所定の間隔を隔てて配置された第1及び第2の弾性部材10、11と、第1の弾性部材10と第2の弾性部材11との間に配置され、第1の弾性部材10の先端部と第2の弾性部材11の先端部とを連結する第1の連結部材12と、第1の弾性部材10と第2の弾性部材11との間に配置され、第1の弾性部材10の後端部と第2の弾性部材11の後端部とを連結する第2の連結部材13と、第1の弾性部材10における第1の連結部材12と反対側に配置された第3の連結部材14と、第3の連結部材14によって第1の弾性部材10の先端部に連結され、第3の連結部材14の反対側に突出した接触子9と、を備え、第3の連結部材14の後端縁は、第1の連結部材12の後端縁より後方に配置されている。
【選択図】図2
Description
本発明の一形態に係る電気的接続装置は、被検査体に接触する上述のプローブと、前記プローブを片持ち梁状に支持する配線基板と、を備える。
2 被検査体
3 電極
4 配線基板、4a 開口
5 プローブ
6 接続ランド
7 テスターランド
8 台座
9 接触子
10 第1の弾性部材
11 第2の弾性部材
12 第1の連結部材
13 第2の連結部材
14 第3の連結部材
15 座部
16 針先部
Claims (2)
- 台座と、
所定の間隔を隔てて配置された第1及び第2の弾性部材と、
前記第1の弾性部材と前記第2の弾性部材との間に配置され、前記第1の弾性部材の先端部と前記第2の弾性部材の先端部とを連結する第1の連結部材と、
前記第1の弾性部材と前記第2の弾性部材との間に配置され、前記第1の弾性部材の後端部と前記第2の弾性部材の後端部とを連結する第2の連結部材と、
前記第1の弾性部材における前記第1の連結部材と反対側に配置された第3の連結部材と、
前記第3の連結部材によって前記第1の弾性部材の先端部に連結され、前記第3の連結部材の反対側に突出した接触子と、を備え、
前記第3の連結部材の後端縁は、前記第1の連結部材の後端縁より後方に配置されているプローブ。 - 被検査体に接触する請求項1に記載のプローブと、
前記プローブを片持ち梁状に支持する配線基板と、
を備える電気的接続装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012166539A JP5947139B2 (ja) | 2012-07-27 | 2012-07-27 | プローブ及び電気的接続装置 |
TW102124275A TWI495879B (zh) | 2012-07-27 | 2013-07-05 | 探針及電性連接裝置 |
KR20130081371A KR101478714B1 (ko) | 2012-07-27 | 2013-07-11 | 프로브 및 전기적 접속장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012166539A JP5947139B2 (ja) | 2012-07-27 | 2012-07-27 | プローブ及び電気的接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014025817A true JP2014025817A (ja) | 2014-02-06 |
JP5947139B2 JP5947139B2 (ja) | 2016-07-06 |
Family
ID=50199594
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012166539A Active JP5947139B2 (ja) | 2012-07-27 | 2012-07-27 | プローブ及び電気的接続装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5947139B2 (ja) |
KR (1) | KR101478714B1 (ja) |
TW (1) | TWI495879B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016105059A (ja) * | 2014-12-01 | 2016-06-09 | 株式会社日本マイクロニクス | カンチレバー型プローブ、及びプローブカード |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101865756B1 (ko) * | 2017-06-28 | 2018-06-11 | (주) 마이크로프랜드 | 짧은 스크럽마크를 위한 프로브 카드의 다중 캔틸레버 빔 구조체 및 그 제조방법 |
KR20190021101A (ko) | 2017-08-22 | 2019-03-05 | 삼성전자주식회사 | 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법 |
JP7471778B2 (ja) * | 2019-03-29 | 2024-04-22 | 株式会社日本マイクロニクス | プローブカード |
JP2021028603A (ja) * | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004156993A (ja) * | 2002-11-06 | 2004-06-03 | Micronics Japan Co Ltd | プローブ及びこれを用いた電気的接続装置 |
JP2004340617A (ja) * | 2003-05-13 | 2004-12-02 | Micronics Japan Co Ltd | 通電試験用電気的接続装置 |
WO2006095441A1 (ja) * | 2005-03-07 | 2006-09-14 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ及びこれを用いた電気的接続装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001048818A1 (en) * | 1999-12-29 | 2001-07-05 | Formfactor, Inc. | Resilient interconnect structure for electronic components and method for making the same |
KR100473584B1 (ko) | 2002-12-02 | 2005-03-10 | 주식회사 아이씨멤즈 | 외팔보 형태의 프로브 카드 및 그 제조 방법 |
DE102004036407A1 (de) * | 2003-08-27 | 2005-06-09 | Japan Electronic Materials Corp., Amagasaki | Prüfkarte und Verbinder für diese |
JP2006284362A (ja) * | 2005-03-31 | 2006-10-19 | Nhk Spring Co Ltd | コンタクトプローブ |
KR20090030543A (ko) * | 2007-09-20 | 2009-03-25 | 주식회사 아이에스시테크놀러지 | 프로브 핀 및 이를 제조하는 방법 |
JP2009204393A (ja) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法 |
JP2011141126A (ja) * | 2010-01-05 | 2011-07-21 | Toshiba Corp | プローブカード |
KR101040733B1 (ko) | 2010-07-19 | 2011-06-10 | (주) 마이크로프랜드 | 프로브 카드의 다중 캔틸레버 빔 구조체 및 그 제조방법 |
-
2012
- 2012-07-27 JP JP2012166539A patent/JP5947139B2/ja active Active
-
2013
- 2013-07-05 TW TW102124275A patent/TWI495879B/zh active
- 2013-07-11 KR KR20130081371A patent/KR101478714B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004156993A (ja) * | 2002-11-06 | 2004-06-03 | Micronics Japan Co Ltd | プローブ及びこれを用いた電気的接続装置 |
JP2004340617A (ja) * | 2003-05-13 | 2004-12-02 | Micronics Japan Co Ltd | 通電試験用電気的接続装置 |
WO2006095441A1 (ja) * | 2005-03-07 | 2006-09-14 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ及びこれを用いた電気的接続装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016105059A (ja) * | 2014-12-01 | 2016-06-09 | 株式会社日本マイクロニクス | カンチレバー型プローブ、及びプローブカード |
Also Published As
Publication number | Publication date |
---|---|
TWI495879B (zh) | 2015-08-11 |
KR101478714B1 (ko) | 2015-01-05 |
JP5947139B2 (ja) | 2016-07-06 |
KR20140015188A (ko) | 2014-02-06 |
TW201405129A (zh) | 2014-02-01 |
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