KR101310476B1 - 석영 제품의 베이크 방법 및 석영 제품의 베이크 장치 - Google Patents

석영 제품의 베이크 방법 및 석영 제품의 베이크 장치 Download PDF

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Publication number
KR101310476B1
KR101310476B1 KR1020070061492A KR20070061492A KR101310476B1 KR 101310476 B1 KR101310476 B1 KR 101310476B1 KR 1020070061492 A KR1020070061492 A KR 1020070061492A KR 20070061492 A KR20070061492 A KR 20070061492A KR 101310476 B1 KR101310476 B1 KR 101310476B1
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South Korea
Prior art keywords
baking
jig
element member
quartz product
gas
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KR1020070061492A
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English (en)
Korean (ko)
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KR20070122159A (ko
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가쯔히꼬 안바이
마사유끼 오이까와
마사또 가도베
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도쿄엘렉트론가부시키가이샤
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Publication of KR20070122159A publication Critical patent/KR20070122159A/ko
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Publication of KR101310476B1 publication Critical patent/KR101310476B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Melting And Manufacturing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020070061492A 2006-06-23 2007-06-22 석영 제품의 베이크 방법 및 석영 제품의 베이크 장치 KR101310476B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006174660A JP4369448B2 (ja) 2006-06-23 2006-06-23 石英製品のベーク方法
JPJP-P-2006-00174660 2006-06-23

Publications (2)

Publication Number Publication Date
KR20070122159A KR20070122159A (ko) 2007-12-28
KR101310476B1 true KR101310476B1 (ko) 2013-09-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070061492A KR101310476B1 (ko) 2006-06-23 2007-06-22 석영 제품의 베이크 방법 및 석영 제품의 베이크 장치

Country Status (5)

Country Link
US (1) US7670138B2 (zh)
JP (1) JP4369448B2 (zh)
KR (1) KR101310476B1 (zh)
CN (1) CN101092276B (zh)
TW (1) TWI427723B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202007008520U1 (de) * 2007-02-21 2008-07-03 Dekema Dental-Keramiköfen GmbH Brenngutträger
JP5128874B2 (ja) * 2007-08-16 2013-01-23 株式会社リコー 縦型熱処理装置
DE202008002982U1 (de) * 2008-03-03 2008-06-05 Dekema Dental-Keramiköfen GmbH Brenntisch für einen Ofen
CN102432022B (zh) * 2011-08-26 2013-03-13 田辉明 利用脉石英生产超纯石英砂的方法及高温氯化装置
US20170207078A1 (en) * 2016-01-15 2017-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Atomic layer deposition apparatus and semiconductor process
JP6462161B2 (ja) * 2016-02-09 2019-01-30 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置および半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025802A (ko) * 1997-09-18 1999-04-06 윤종용 확산설비의 튜브 고정용 도구
JP2002313787A (ja) 2001-04-13 2002-10-25 Tokyo Electron Ltd 熱処理装置の石英製品の洗浄方法及び熱処理方法
KR100398042B1 (ko) 2000-12-29 2003-09-19 주식회사 하이닉스반도체 단결정 실리콘 증착 장치 및 이 장치의 석영 튜브 클리닝방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5407349A (en) * 1993-01-22 1995-04-18 International Business Machines Corporation Exhaust system for high temperature furnace
US5445522A (en) * 1993-04-26 1995-08-29 Tokyo Electron Kabushiki Kaisha Combustion device
US5603875A (en) * 1993-06-11 1997-02-18 Aerospace Coating Systems, Inc. Method for producing ceramic-based components
JPH07254591A (ja) * 1994-03-16 1995-10-03 Toshiba Corp 熱処理装置
US5741131A (en) * 1996-01-31 1998-04-21 International Business Machines Corporation Stacking system for substrates
JP3270730B2 (ja) * 1997-03-21 2002-04-02 株式会社日立国際電気 基板処理装置及び基板処理方法
US6171982B1 (en) * 1997-12-26 2001-01-09 Canon Kabushiki Kaisha Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
DE19821007A1 (de) * 1998-05-11 1999-11-25 Steag Rtp Systems Gmbh Verfahren und Vorrichtung zum thermischen Behandeln von Substraten
DE60028091T2 (de) * 2000-02-07 2006-12-21 Tokyo Electron Ltd. Quarzglasbauteil für halbleiterherstellungsanlage und verfahren zur metalluntersuchung in einem quarzglasbauteil
KR100783841B1 (ko) * 2000-05-31 2007-12-10 동경 엘렉트론 주식회사 열처리 시스템
JP2002343789A (ja) * 2001-05-16 2002-11-29 Mitsubishi Electric Corp 補助保温治具、その製造方法、板状断熱材付きウエハボート、縦型熱処理装置、縦型熱処理装置の改造方法および半導体装置の製造方法
JP3877157B2 (ja) * 2002-09-24 2007-02-07 東京エレクトロン株式会社 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025802A (ko) * 1997-09-18 1999-04-06 윤종용 확산설비의 튜브 고정용 도구
KR100398042B1 (ko) 2000-12-29 2003-09-19 주식회사 하이닉스반도체 단결정 실리콘 증착 장치 및 이 장치의 석영 튜브 클리닝방법
JP2002313787A (ja) 2001-04-13 2002-10-25 Tokyo Electron Ltd 熱処理装置の石英製品の洗浄方法及び熱処理方法

Also Published As

Publication number Publication date
US20080044785A1 (en) 2008-02-21
JP4369448B2 (ja) 2009-11-18
KR20070122159A (ko) 2007-12-28
CN101092276B (zh) 2011-04-20
TW200818372A (en) 2008-04-16
CN101092276A (zh) 2007-12-26
JP2008004850A (ja) 2008-01-10
US7670138B2 (en) 2010-03-02
TWI427723B (zh) 2014-02-21

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