JP4914270B2 - 熱処理容器 - Google Patents
熱処理容器 Download PDFInfo
- Publication number
- JP4914270B2 JP4914270B2 JP2007092718A JP2007092718A JP4914270B2 JP 4914270 B2 JP4914270 B2 JP 4914270B2 JP 2007092718 A JP2007092718 A JP 2007092718A JP 2007092718 A JP2007092718 A JP 2007092718A JP 4914270 B2 JP4914270 B2 JP 4914270B2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- treatment container
- recesses
- pairs
- flange portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
Description
フランジ部において前記挟持部が当接しない外周面にのみ開口した複数対の凹部であって、それぞれに手指が挿入される複数対の凹部を備えたことを特徴とする。
2−石英プロセスチューブ(熱処理容器)
21−凹部
Claims (4)
- 底面に開口部を備える熱処理容器であって、前記開口部の周囲の全周にわたって半径方向に延出した固定用のフランジ部を備え、前記フランジ部を挟持部によって気密性を維持する状態で上下に挟持される熱処理容器において、
前記フランジ部において前記挟持部が当接しない外周面にのみ開口した複数対の凹部であって、それぞれに手指が挿入される複数対の凹部を備えた熱処理容器。 - 前記複数対の凹部は、各対の中点が前記フランジ部の外周面に沿って等間隔となる位置に形成した請求項1に記載の熱処理容器。
- 前記複数対の凹部は、各対が左右対称形状を呈する請求項1又は2に記載の熱処理容器。
- 前記複数対の凹部のそれぞれに左右何れの手指を挿入すべきかを認識できる表示を設けた請求項3に記載の熱処理容器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092718A JP4914270B2 (ja) | 2007-03-30 | 2007-03-30 | 熱処理容器 |
KR1020070077917A KR101306761B1 (ko) | 2007-03-30 | 2007-08-02 | 열처리용기 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092718A JP4914270B2 (ja) | 2007-03-30 | 2007-03-30 | 熱処理容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008251927A JP2008251927A (ja) | 2008-10-16 |
JP4914270B2 true JP4914270B2 (ja) | 2012-04-11 |
Family
ID=39976506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007092718A Expired - Fee Related JP4914270B2 (ja) | 2007-03-30 | 2007-03-30 | 熱処理容器 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4914270B2 (ja) |
KR (1) | KR101306761B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5410119B2 (ja) * | 2009-03-02 | 2014-02-05 | 光洋サーモシステム株式会社 | 基板の熱処理装置 |
JP5922534B2 (ja) * | 2012-09-10 | 2016-05-24 | 光洋サーモシステム株式会社 | 熱処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0510353Y2 (ja) * | 1987-01-30 | 1993-03-15 | ||
JPH01100093U (ja) * | 1987-12-24 | 1989-07-05 | ||
JP4324992B2 (ja) * | 1998-07-31 | 2009-09-02 | シンフォニアテクノロジー株式会社 | チューブ着脱用台車、及びその装置 |
JP2000296835A (ja) * | 1999-04-13 | 2000-10-24 | Dainippon Printing Co Ltd | 紙製容器 |
JP2001250787A (ja) * | 2000-03-06 | 2001-09-14 | Hitachi Kokusai Electric Inc | 基板処理装置および基板処理方法 |
JP2002110548A (ja) * | 2000-09-27 | 2002-04-12 | Hitachi Kokusai Electric Inc | 反応炉チャンバの着脱方法 |
JP3577633B2 (ja) * | 2001-07-13 | 2004-10-13 | 杉晃 草竹 | ブロック体 |
JP2005151884A (ja) * | 2003-11-26 | 2005-06-16 | Sanko Shoji:Kk | 盛器兼用調理台 |
JP4289166B2 (ja) * | 2004-01-30 | 2009-07-01 | コクヨ株式会社 | 袖構造体、デスク |
KR200352731Y1 (ko) * | 2004-03-02 | 2004-06-09 | 김의열 | 황토가마 육류구이 장치 |
-
2007
- 2007-03-30 JP JP2007092718A patent/JP4914270B2/ja not_active Expired - Fee Related
- 2007-08-02 KR KR1020070077917A patent/KR101306761B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2008251927A (ja) | 2008-10-16 |
KR101306761B1 (ko) | 2013-09-10 |
KR20080089127A (ko) | 2008-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101874673B1 (ko) | 지지 기구 및 기판 처리 장치 | |
JP4313401B2 (ja) | 縦型熱処理装置及び被処理基板移載方法 | |
KR100928840B1 (ko) | 기판처리장치 및 반응용기의 착탈 방법 | |
JPH0992625A (ja) | 熱処理用ボ−ト | |
TWI351723B (ja) | ||
KR101489548B1 (ko) | 진공 처리 장치의 조립 방법 및 진공 처리 장치 | |
TWI677051B (zh) | 晶舟支撐台及使用其之熱處理裝置 | |
KR20100029043A (ko) | 종형 열처리 장치 및 기판 지지구 | |
KR20080033878A (ko) | 열처리 장치 | |
JP4914270B2 (ja) | 熱処理容器 | |
KR101310476B1 (ko) | 석영 제품의 베이크 방법 및 석영 제품의 베이크 장치 | |
JP4168452B2 (ja) | 水蒸気アニール用治具、水蒸気アニール方法及び基板移載装置 | |
KR101562768B1 (ko) | 열처리 장치용의 챔버, 및, 열처리 장치 | |
JP4683332B2 (ja) | 熱処理装置 | |
JP2000150403A (ja) | 保温筒および縦型熱処理装置 | |
JP4384518B2 (ja) | 熱処理装置の炉口構造 | |
TW201430992A (zh) | 批量式基板處理裝置 | |
CN109722620B (zh) | 热处理设备 | |
TW201620064A (zh) | 處理腔室和包含此的基板製造裝置及基板製造方法 | |
JP5032766B2 (ja) | 基板処理装置及び基板処理装置のメンテナンス方法 | |
JP4413636B2 (ja) | 熱処理装置 | |
JP4369447B2 (ja) | ベーク用の治具及びベーク処理装置 | |
JP3761646B2 (ja) | 縦型ウエハ処理治具 | |
JP4193527B2 (ja) | 半導体熱処理装置 | |
KR100832713B1 (ko) | 수직형 퍼니스의 페데스탈 보호장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100208 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100208 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111007 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111018 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111219 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120117 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120120 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150127 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |