KR101258444B1 - 다이싱 장치 및 다이싱 방법 - Google Patents

다이싱 장치 및 다이싱 방법 Download PDF

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Publication number
KR101258444B1
KR101258444B1 KR1020110026926A KR20110026926A KR101258444B1 KR 101258444 B1 KR101258444 B1 KR 101258444B1 KR 1020110026926 A KR1020110026926 A KR 1020110026926A KR 20110026926 A KR20110026926 A KR 20110026926A KR 101258444 B1 KR101258444 B1 KR 101258444B1
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KR
South Korea
Prior art keywords
workpiece
work
work table
dicing
frame
Prior art date
Application number
KR1020110026926A
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English (en)
Korean (ko)
Other versions
KR20110109921A (ko
Inventor
마사유끼 아즈마
유수케 아라이
다카시 후지타
Original Assignee
가부시키가이샤 토쿄 세이미쯔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 토쿄 세이미쯔 filed Critical 가부시키가이샤 토쿄 세이미쯔
Publication of KR20110109921A publication Critical patent/KR20110109921A/ko
Application granted granted Critical
Publication of KR101258444B1 publication Critical patent/KR101258444B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Control Of Cutting Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020110026926A 2010-03-29 2011-03-25 다이싱 장치 및 다이싱 방법 KR101258444B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2010-075302 2010-03-29
JP2010075302 2010-03-29
JP2011032224A JP4761088B1 (ja) 2010-03-29 2011-02-17 ダイシング装置及びダイシング方法
JPJP-P-2011-032224 2011-02-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120118433A Division KR101419317B1 (ko) 2010-03-29 2012-10-24 다이싱 장치 및 다이싱 방법

Publications (2)

Publication Number Publication Date
KR20110109921A KR20110109921A (ko) 2011-10-06
KR101258444B1 true KR101258444B1 (ko) 2013-04-26

Family

ID=44597199

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020110026926A KR101258444B1 (ko) 2010-03-29 2011-03-25 다이싱 장치 및 다이싱 방법
KR1020120118433A KR101419317B1 (ko) 2010-03-29 2012-10-24 다이싱 장치 및 다이싱 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020120118433A KR101419317B1 (ko) 2010-03-29 2012-10-24 다이싱 장치 및 다이싱 방법

Country Status (3)

Country Link
JP (4) JP4761088B1 (ja)
KR (2) KR101258444B1 (ja)
CN (1) CN102205562B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143323A (ja) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 加工装置
KR101333115B1 (ko) * 2013-03-08 2013-11-26 주식회사 베셀 패널 노치부 연마장치
JP2016195155A (ja) * 2015-03-31 2016-11-17 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法
CN108318971A (zh) * 2018-01-12 2018-07-24 浙江富春江光电科技有限公司 一种光波导芯片免研抛方法
JP7265430B2 (ja) * 2019-07-02 2023-04-26 株式会社ディスコ 処理装置
CN114454344A (zh) * 2020-11-09 2022-05-10 上海东河机电科技有限公司 一种防倒片机构和切割设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244220A (ja) * 2000-02-29 2001-09-07 Tokyo Seimitsu Co Ltd ダイシング装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647220B2 (ja) * 1987-05-18 1994-06-22 株式会社東京精密 ダイシング装置におけるワ−ク搬送方法及び装置
JPH0352248A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 搬送アーム
JPH04324338A (ja) * 1991-04-25 1992-11-13 Hitachi Ltd 常圧ガス分析チャンバおよび常圧ガス分析装置
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
JP3485816B2 (ja) * 1998-12-09 2004-01-13 太陽誘電株式会社 ダイシング装置
JP2001168067A (ja) * 1999-12-09 2001-06-22 Sony Corp ダイシング装置
JP4032778B2 (ja) * 2002-03-07 2008-01-16 セイコーエプソン株式会社 板状部材の搬送装置
JP2006059861A (ja) * 2004-08-17 2006-03-02 Lintec Corp 脆質部材の転着装置
JP2006156633A (ja) * 2004-11-29 2006-06-15 Lintec Corp 脆質部材の処理装置
JP4564832B2 (ja) * 2004-11-30 2010-10-20 株式会社ディスコ 矩形基板の分割装置
JP4698519B2 (ja) * 2006-07-31 2011-06-08 日東電工株式会社 半導体ウエハマウント装置
JP4953738B2 (ja) * 2006-09-07 2012-06-13 日東電工株式会社 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP4876819B2 (ja) * 2006-09-25 2012-02-15 株式会社東京精密 ダイシング装置及びダイシング方法
JP5068611B2 (ja) * 2007-09-13 2012-11-07 株式会社ディスコ 加工装置における加工水の確認方法及び確認装置
JP5257890B2 (ja) * 2007-12-04 2013-08-07 上野精機株式会社 ウエハリング供給排出装置
JP5169557B2 (ja) * 2008-07-09 2013-03-27 株式会社Ｉｈｉ 基板昇降移送装置及び基板処理移送システム
JP5187366B2 (ja) * 2010-08-31 2013-04-24 三星ダイヤモンド工業株式会社 基板ブレーク装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244220A (ja) * 2000-02-29 2001-09-07 Tokyo Seimitsu Co Ltd ダイシング装置

Also Published As

Publication number Publication date
KR20120120927A (ko) 2012-11-02
JP2011228641A (ja) 2011-11-10
JP5807757B2 (ja) 2015-11-10
CN102205562A (zh) 2011-10-05
JP2014045203A (ja) 2014-03-13
JP2011228726A (ja) 2011-11-10
KR101419317B1 (ko) 2014-08-13
JP4761088B1 (ja) 2011-08-31
CN102205562B (zh) 2015-06-24
JP4915485B2 (ja) 2012-04-11
JP2011254111A (ja) 2011-12-15
KR20110109921A (ko) 2011-10-06
JP5387924B2 (ja) 2014-01-15

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