KR101226784B1 - 기판 처리 장치 및 이재 방법 - Google Patents

기판 처리 장치 및 이재 방법 Download PDF

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Publication number
KR101226784B1
KR101226784B1 KR1020100109047A KR20100109047A KR101226784B1 KR 101226784 B1 KR101226784 B1 KR 101226784B1 KR 1020100109047 A KR1020100109047 A KR 1020100109047A KR 20100109047 A KR20100109047 A KR 20100109047A KR 101226784 B1 KR101226784 B1 KR 101226784B1
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KR
South Korea
Prior art keywords
substrate
board
roller
conveyance
conveyance direction
Prior art date
Application number
KR1020100109047A
Other languages
English (en)
Korean (ko)
Other versions
KR20110109784A (ko
Inventor
요시노리 다카기
마사오 츠지
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
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Publication date
Priority claimed from JP2010074259A external-priority patent/JP5165718B2/ja
Priority claimed from JP2010074370A external-priority patent/JP5254269B2/ja
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20110109784A publication Critical patent/KR20110109784A/ko
Application granted granted Critical
Publication of KR101226784B1 publication Critical patent/KR101226784B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100109047A 2010-03-29 2010-11-04 기판 처리 장치 및 이재 방법 KR101226784B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2010-074259 2010-03-29
JPJP-P-2010-074370 2010-03-29
JP2010074259A JP5165718B2 (ja) 2010-03-29 2010-03-29 基板処理装置
JP2010074370A JP5254269B2 (ja) 2010-03-29 2010-03-29 基板処理装置および移載方法

Publications (2)

Publication Number Publication Date
KR20110109784A KR20110109784A (ko) 2011-10-06
KR101226784B1 true KR101226784B1 (ko) 2013-01-25

Family

ID=44695021

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100109047A KR101226784B1 (ko) 2010-03-29 2010-11-04 기판 처리 장치 및 이재 방법

Country Status (3)

Country Link
KR (1) KR101226784B1 (zh)
CN (2) CN102205911B (zh)
TW (1) TWI462215B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101365049B1 (ko) * 2012-08-02 2014-02-20 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 롤링 브레이크 장치
KR101794875B1 (ko) * 2015-01-30 2017-11-07 가부시키가이샤 하리즈 투명판 검사 장치 및 투명판 청소 검사 시스템
KR102347409B1 (ko) * 2015-05-27 2022-01-05 세메스 주식회사 인쇄 장치
JP6595276B2 (ja) * 2015-09-18 2019-10-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI630059B (zh) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench
TWI800584B (zh) * 2018-01-11 2023-05-01 日商日本碍子股份有限公司 熱處理爐及其製造方法
CN111217149B (zh) * 2018-11-23 2024-08-27 合肥欣奕华智能机器股份有限公司 一种基板校准装置、基板校准方法及基板搬运装置
JP7408612B2 (ja) * 2021-10-21 2024-01-05 株式会社Ｓｃｒｅｅｎホールディングス 現像装置
CN114313431A (zh) * 2021-12-07 2022-04-12 深圳创视智能视觉技术股份有限公司 分料装置及智能理袋机器人
CN114334723A (zh) * 2021-12-21 2022-04-12 成都中建材光电材料有限公司 一种避免基板底面污染的单侧湿法系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001233452A (ja) 2000-02-24 2001-08-28 Toray Eng Co Ltd 薄板状材の定点搬送装置
JP2006269498A (ja) 2005-03-22 2006-10-05 Olympus Corp 基板保持装置及び基板の保持方法
JP2008166348A (ja) 2006-12-27 2008-07-17 Olympus Corp 基板搬送装置
JP2010064857A (ja) 2008-09-11 2010-03-25 Tokyo Electron Ltd 基板処理装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3070006B2 (ja) * 1997-02-07 2000-07-24 株式会社オーク製作所 薄板状ワークの搬送方法
JP2000277587A (ja) * 1999-03-29 2000-10-06 Kokusai Electric Co Ltd 基板搬送システム
TW569288B (en) * 2001-06-19 2004-01-01 Tokyo Electron Ltd Substrate processing apparatus, liquid processing apparatus and liquid processing method
JP3926593B2 (ja) * 2001-09-14 2007-06-06 大日本スクリーン製造株式会社 基板処理装置
JP4563191B2 (ja) * 2005-01-17 2010-10-13 大日本スクリーン製造株式会社 基板処理装置
JP4554397B2 (ja) * 2005-02-23 2010-09-29 東京エレクトロン株式会社 ステージ装置および塗布処理装置
KR100618918B1 (ko) * 2005-04-12 2006-09-01 주식회사 디엠에스 적층형 기판 이송장치
JP4745040B2 (ja) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
JP4853204B2 (ja) * 2006-09-28 2012-01-11 大日本印刷株式会社 板状物の搬送方法および板状物の搬送装置
JP2008159644A (ja) * 2006-12-21 2008-07-10 Shinkawa Ltd ボンディング装置及びボンディング装置における回路基板の吸着方法
JP2009049232A (ja) * 2007-08-21 2009-03-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2009094184A (ja) * 2007-10-05 2009-04-30 Toray Ind Inc 基板処理装置および処理方法
JP2009176858A (ja) * 2008-01-23 2009-08-06 Toppan Printing Co Ltd 基板受渡装置
JP5300288B2 (ja) * 2008-03-12 2013-09-25 大日本スクリーン製造株式会社 基板搬送装置および基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001233452A (ja) 2000-02-24 2001-08-28 Toray Eng Co Ltd 薄板状材の定点搬送装置
JP2006269498A (ja) 2005-03-22 2006-10-05 Olympus Corp 基板保持装置及び基板の保持方法
JP2008166348A (ja) 2006-12-27 2008-07-17 Olympus Corp 基板搬送装置
JP2010064857A (ja) 2008-09-11 2010-03-25 Tokyo Electron Ltd 基板処理装置

Also Published As

Publication number Publication date
TWI462215B (zh) 2014-11-21
CN102205911B (zh) 2013-10-30
TW201133681A (en) 2011-10-01
CN102205911A (zh) 2011-10-05
KR20110109784A (ko) 2011-10-06
CN103177991B (zh) 2017-07-14
CN103177991A (zh) 2013-06-26

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