KR101202270B1 - 플라즈마 처리 장치 및 플라즈마 처리 방법 - Google Patents

플라즈마 처리 장치 및 플라즈마 처리 방법 Download PDF

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KR101202270B1
KR101202270B1 KR1020107024030A KR20107024030A KR101202270B1 KR 101202270 B1 KR101202270 B1 KR 101202270B1 KR 1020107024030 A KR1020107024030 A KR 1020107024030A KR 20107024030 A KR20107024030 A KR 20107024030A KR 101202270 B1 KR101202270 B1 KR 101202270B1
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gas
flow path
gas flow
gas discharge
processing container
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KR20100126571A (ko
Inventor
마사키 히라야마
타다히로 오오미
Original Assignee
고쿠리츠다이가쿠호진 도호쿠다이가쿠
도쿄엘렉트론가부시키가이샤
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • H01J37/32449Gas control, e.g. control of the gas flow

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020107024030A 2008-06-11 2009-06-03 플라즈마 처리 장치 및 플라즈마 처리 방법 Active KR101202270B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008153379A JP5520455B2 (ja) 2008-06-11 2008-06-11 プラズマ処理装置
JPJP-P-2008-153379 2008-06-11
PCT/JP2009/060159 WO2009150979A1 (ja) 2008-06-11 2009-06-03 プラズマ処理装置及びプラズマ処理方法

Publications (2)

Publication Number Publication Date
KR20100126571A KR20100126571A (ko) 2010-12-01
KR101202270B1 true KR101202270B1 (ko) 2012-11-16

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KR1020107024030A Active KR101202270B1 (ko) 2008-06-11 2009-06-03 플라즈마 처리 장치 및 플라즈마 처리 방법

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US (1) US9196460B2 (https=)
JP (1) JP5520455B2 (https=)
KR (1) KR101202270B1 (https=)
CN (2) CN102760633B (https=)
TW (1) TW201015653A (https=)
WO (1) WO2009150979A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5520455B2 (ja) * 2008-06-11 2014-06-11 東京エレクトロン株式会社 プラズマ処理装置
JP5478058B2 (ja) * 2008-12-09 2014-04-23 国立大学法人東北大学 プラズマ処理装置
KR101327458B1 (ko) * 2012-01-10 2013-11-08 주식회사 유진테크 냉각 방식의 샤워헤드 및 이를 구비하는 기판 처리 장치
KR101206836B1 (ko) * 2012-03-14 2012-11-30 한국델파이주식회사 스티어링 기어의 랙 바 지지 장치
US9267205B1 (en) * 2012-05-30 2016-02-23 Alta Devices, Inc. Fastener system for supporting a liner plate in a gas showerhead reactor
JP2014096553A (ja) * 2012-10-09 2014-05-22 Tokyo Electron Ltd プラズマ処理方法、及びプラズマ処理装置
JP2014082354A (ja) * 2012-10-17 2014-05-08 Hitachi High-Technologies Corp プラズマ処理装置
JP5700032B2 (ja) * 2012-12-26 2015-04-15 東京エレクトロン株式会社 プラズマドーピング装置、およびプラズマドーピング方法
JP6137986B2 (ja) * 2013-08-07 2017-05-31 株式会社荏原製作所 基板洗浄及び乾燥装置
US9336997B2 (en) * 2014-03-17 2016-05-10 Applied Materials, Inc. RF multi-feed structure to improve plasma uniformity
JP6378360B2 (ja) * 2014-11-26 2018-08-22 株式会社日立ハイテクノロジーズ イオンビーム装置
JP6404111B2 (ja) * 2014-12-18 2018-10-10 東京エレクトロン株式会社 プラズマ処理装置
DE102015101461A1 (de) * 2015-02-02 2016-08-04 Aixtron Se Vorrichtung zum Beschichten eines großflächigen Substrats
US10665460B2 (en) * 2016-09-05 2020-05-26 Shin-Etsu Handotai Co., Ltd. Vapor phase growth apparatus, method of manufacturing epitaxial wafer, and attachment for vapor phase growth apparatus
JP6624110B2 (ja) * 2017-02-10 2019-12-25 株式会社豊田中央研究所 化合物単結晶製造装置、及び化合物単結晶の製造方法
CN106604514A (zh) * 2017-02-21 2017-04-26 唐山铸锐科技有限公司 排管及低温等离子体发生设备
CN107118381A (zh) * 2017-06-16 2017-09-01 南京工业大学 聚四氟乙烯亲水性改性等离子体处理装置及方法
KR102578539B1 (ko) * 2017-07-28 2023-09-13 스미토모덴키고교가부시키가이샤 샤워 헤드 및 그 제조 방법
NL2022556A (en) 2018-02-13 2019-08-19 Asml Netherlands Bv Cleaning a structure surface in an euv chamber
JP6835019B2 (ja) 2018-03-14 2021-02-24 株式会社豊田中央研究所 半導体装置及びその製造方法
JP7346698B2 (ja) * 2019-07-15 2023-09-19 アプライド マテリアルズ インコーポレイテッド フラットパネルディスプレイ用の大面積高密度プラズマ処理チャンバ
CN112349572B (zh) * 2019-08-09 2024-03-08 中微半导体设备(上海)股份有限公司 一种气体喷淋头及等离子处理装置
JP7428521B2 (ja) * 2020-01-15 2024-02-06 株式会社テクノ菱和 電極
JP7540864B2 (ja) * 2020-06-15 2024-08-27 東京エレクトロン株式会社 シャワープレート及び成膜装置
US12394604B2 (en) 2020-09-11 2025-08-19 Applied Materials, Inc. Plasma source with floating electrodes
US11776793B2 (en) 2020-11-13 2023-10-03 Applied Materials, Inc. Plasma source with ceramic electrode plate
JP7648307B2 (ja) * 2021-06-22 2025-03-18 東京エレクトロン株式会社 シャワーヘッド及びプラズマ処理装置
JP7220973B1 (ja) * 2021-12-08 2023-02-13 東芝三菱電機産業システム株式会社 活性ガス生成装置
TWI821950B (zh) * 2022-03-18 2023-11-11 韓商細美事有限公司 晶粒表面處理裝置以及其晶粒結合系統
US12327810B2 (en) 2022-04-21 2025-06-10 Semes Co., Ltd. Die surface treatment apparatus and die bonding system including the same

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114530A (ja) 1988-10-25 1990-04-26 Mitsubishi Electric Corp 薄膜形成装置
US5122251A (en) * 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5091049A (en) * 1989-06-13 1992-02-25 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
TW296534B (https=) * 1993-12-17 1997-01-21 Tokyo Electron Co Ltd
US5611864A (en) * 1994-03-24 1997-03-18 Matsushita Electric Industrial Co., Ltd. Microwave plasma processing apparatus and processing method using the same
US5620523A (en) * 1994-04-11 1997-04-15 Canon Sales Co., Inc. Apparatus for forming film
TW283250B (en) * 1995-07-10 1996-08-11 Watkins Johnson Co Plasma enhanced chemical processing reactor and method
JPH10158847A (ja) * 1996-12-06 1998-06-16 Toshiba Corp マイクロ波励起によるプラズマ処理装置
WO1998033362A1 (en) * 1997-01-29 1998-07-30 Tadahiro Ohmi Plasma device
US6042687A (en) * 1997-06-30 2000-03-28 Lam Research Corporation Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing
JP3317209B2 (ja) * 1997-08-12 2002-08-26 東京エレクトロンエイ・ティー株式会社 プラズマ処理装置及びプラズマ処理方法
US6132552A (en) * 1998-02-19 2000-10-17 Micron Technology, Inc. Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor
JP4141021B2 (ja) * 1998-09-18 2008-08-27 東京エレクトロン株式会社 プラズマ成膜方法
JP3668079B2 (ja) * 1999-05-31 2005-07-06 忠弘 大見 プラズマプロセス装置
JP3645768B2 (ja) * 1999-12-07 2005-05-11 シャープ株式会社 プラズマプロセス装置
JP3482949B2 (ja) * 2000-08-04 2004-01-06 松下電器産業株式会社 プラズマ処理方法及び装置
US7008484B2 (en) 2002-05-06 2006-03-07 Applied Materials Inc. Method and apparatus for deposition of low dielectric constant materials
US6942753B2 (en) 2003-04-16 2005-09-13 Applied Materials, Inc. Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition
JP4179041B2 (ja) * 2003-04-30 2008-11-12 株式会社島津製作所 有機el用保護膜の成膜装置、製造方法および有機el素子
WO2005086215A1 (ja) * 2004-03-03 2005-09-15 Tokyo Electron Limited プラズマ処理方法及びコンピュータ記憶媒体
KR100856159B1 (ko) * 2004-05-27 2008-09-03 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP2006128000A (ja) * 2004-10-29 2006-05-18 Advanced Lcd Technologies Development Center Co Ltd プラズマ処理装置
JP4770167B2 (ja) 2004-12-16 2011-09-14 株式会社島津製作所 表面波励起プラズマcvd装置を用いた成膜方法
JP2006310736A (ja) * 2005-03-30 2006-11-09 Tokyo Electron Ltd ゲート絶縁膜の製造方法および半導体装置の製造方法
WO2007026889A1 (ja) * 2005-09-01 2007-03-08 Matsushita Electric Industrial Co., Ltd. プラズマ処理装置、プラズマ処理方法、これに用いられる誘電体窓及びその製造方法
WO2007083795A1 (ja) 2006-01-20 2007-07-26 Tokyo Electron Limited プラズマ処理装置
US20080254220A1 (en) * 2006-01-20 2008-10-16 Tokyo Electron Limited Plasma processing apparatus
JP4683334B2 (ja) 2006-03-31 2011-05-18 株式会社島津製作所 表面波励起プラズマ処理装置
US20080081114A1 (en) 2006-10-03 2008-04-03 Novellus Systems, Inc. Apparatus and method for delivering uniform fluid flow in a chemical deposition system
JP5252613B2 (ja) * 2006-12-25 2013-07-31 国立大学法人東北大学 イオン注入装置およびイオン注入方法
US20100101728A1 (en) * 2007-03-29 2010-04-29 Tokyo Electron Limited Plasma process apparatus
KR101088876B1 (ko) * 2007-06-11 2011-12-07 고쿠리츠다이가쿠호진 도호쿠다이가쿠 플라즈마 처리 장치, 급전 장치 및 플라즈마 처리 장치의 사용 방법
TW200915931A (en) * 2007-06-11 2009-04-01 Tokyo Electron Ltd Plasma processing system and use of plasma processing system
JP2008305736A (ja) * 2007-06-11 2008-12-18 Tokyo Electron Ltd プラズマ処理装置、プラズマ処理装置の使用方法およびプラズマ処理装置のクリーニング方法
DE112008001548B4 (de) * 2007-06-11 2013-07-11 Tokyo Electron Ltd. Plasmabearbeitungsvorrichtung und Plasmabearbeitungsverfahren
US20080303744A1 (en) * 2007-06-11 2008-12-11 Tokyo Electron Limited Plasma processing system, antenna, and use of plasma processing system
JP5058727B2 (ja) * 2007-09-06 2012-10-24 東京エレクトロン株式会社 天板構造及びこれを用いたプラズマ処理装置
JP5421551B2 (ja) * 2008-06-11 2014-02-19 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP5213530B2 (ja) * 2008-06-11 2013-06-19 東京エレクトロン株式会社 プラズマ処理装置
JP5520455B2 (ja) * 2008-06-11 2014-06-11 東京エレクトロン株式会社 プラズマ処理装置
US20110114600A1 (en) * 2008-06-11 2011-05-19 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5478058B2 (ja) * 2008-12-09 2014-04-23 国立大学法人東北大学 プラズマ処理装置
JP5222744B2 (ja) * 2009-01-21 2013-06-26 国立大学法人東北大学 プラズマ処理装置
KR101747158B1 (ko) * 2009-11-06 2017-06-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치를 제작하기 위한 방법
US20140368110A1 (en) * 2012-02-17 2014-12-18 Tohoku University Plasma processing apparatus and plasma processing method
US9343291B2 (en) * 2013-05-15 2016-05-17 Tokyo Electron Limited Method for forming an interfacial layer on a semiconductor using hydrogen plasma

Also Published As

Publication number Publication date
CN102760633B (zh) 2015-09-02
TW201015653A (en) 2010-04-16
US20110180213A1 (en) 2011-07-28
CN102057465A (zh) 2011-05-11
KR20100126571A (ko) 2010-12-01
JP5520455B2 (ja) 2014-06-11
CN102760633A (zh) 2012-10-31
US9196460B2 (en) 2015-11-24
WO2009150979A1 (ja) 2009-12-17
JP2009302205A (ja) 2009-12-24

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