KR101198427B1 - 기판 처리 시스템용 가열 장치의 승온 제어 방법, 컴퓨터 기록 매체 및 기판 처리 시스템 - Google Patents

기판 처리 시스템용 가열 장치의 승온 제어 방법, 컴퓨터 기록 매체 및 기판 처리 시스템 Download PDF

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Publication number
KR101198427B1
KR101198427B1 KR1020117026678A KR20117026678A KR101198427B1 KR 101198427 B1 KR101198427 B1 KR 101198427B1 KR 1020117026678 A KR1020117026678 A KR 1020117026678A KR 20117026678 A KR20117026678 A KR 20117026678A KR 101198427 B1 KR101198427 B1 KR 101198427B1
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KR
South Korea
Prior art keywords
heating
temperature
substrate
processing
wafer
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KR1020117026678A
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English (en)
Korean (ko)
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KR20120026491A (ko
Inventor
겐타로 가리노
세이지 고자와
아키라 미야타
아키라 간바야시
야스시 하야시다
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도쿄엘렉트론가부시키가이샤
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Publication of KR20120026491A publication Critical patent/KR20120026491A/ko
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Publication of KR101198427B1 publication Critical patent/KR101198427B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020117026678A 2009-06-16 2010-06-11 기판 처리 시스템용 가열 장치의 승온 제어 방법, 컴퓨터 기록 매체 및 기판 처리 시스템 KR101198427B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-143498 2009-06-16
JP2009143498A JP4887404B2 (ja) 2009-06-16 2009-06-16 基板処理システム用加熱装置の昇温制御方法、プログラム、コンピュータ記録媒体及び基板処理システム
PCT/JP2010/059924 WO2010147057A1 (ja) 2009-06-16 2010-06-11 基板処理システム用加熱装置の昇温制御方法、コンピュータ記録媒体及び基板処理システム

Publications (2)

Publication Number Publication Date
KR20120026491A KR20120026491A (ko) 2012-03-19
KR101198427B1 true KR101198427B1 (ko) 2012-11-06

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KR1020117026678A KR101198427B1 (ko) 2009-06-16 2010-06-11 기판 처리 시스템용 가열 장치의 승온 제어 방법, 컴퓨터 기록 매체 및 기판 처리 시스템

Country Status (4)

Country Link
JP (1) JP4887404B2 (ja)
KR (1) KR101198427B1 (ja)
TW (1) TWI381422B (ja)
WO (1) WO2010147057A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5810674B2 (ja) * 2011-06-28 2015-11-11 オムロン株式会社 制御装置、加熱装置制御システム、制御方法、プログラムおよび記録媒体
TWI523134B (zh) * 2011-09-22 2016-02-21 東京威力科創股份有限公司 基板處理系統、基板搬運方法、及電腦記憶媒體
KR102117599B1 (ko) 2012-08-02 2020-06-01 도쿄엘렉트론가부시키가이샤 열처리 장치, 열처리 방법 및 컴퓨터 기억 매체
JP6001961B2 (ja) 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP2014053496A (ja) * 2012-09-07 2014-03-20 Tokyo Electron Ltd プログラム、演算装置及び演算方法
JP6868376B2 (ja) * 2016-11-25 2021-05-12 東京エレクトロン株式会社 基板処理装置及び基板処理システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274026A (ja) 1998-03-19 1999-10-08 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP2007520082A (ja) 2004-01-30 2007-07-19 東京エレクトロン株式会社 レチクル／マスクシステムの適合リアルタイム制御

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2885602B2 (ja) * 1993-03-11 1999-04-26 大日本スクリーン製造株式会社 多段式熱処理装置
US6469283B1 (en) * 1999-03-04 2002-10-22 Applied Materials, Inc. Method and apparatus for reducing thermal gradients within a substrate support
JP2003257813A (ja) * 2002-02-27 2003-09-12 Kyocera Corp ウエハ加熱装置
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274026A (ja) 1998-03-19 1999-10-08 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP2007520082A (ja) 2004-01-30 2007-07-19 東京エレクトロン株式会社 レチクル／マスクシステムの適合リアルタイム制御

Also Published As

Publication number Publication date
KR20120026491A (ko) 2012-03-19
WO2010147057A1 (ja) 2010-12-23
TW201117257A (en) 2011-05-16
JP2011003601A (ja) 2011-01-06
JP4887404B2 (ja) 2012-02-29
TWI381422B (zh) 2013-01-01

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