KR101192209B1 - 기판검사용 검사치구 - Google Patents

기판검사용 검사치구 Download PDF

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Publication number
KR101192209B1
KR101192209B1 KR1020090081951A KR20090081951A KR101192209B1 KR 101192209 B1 KR101192209 B1 KR 101192209B1 KR 1020090081951 A KR1020090081951 A KR 1020090081951A KR 20090081951 A KR20090081951 A KR 20090081951A KR 101192209 B1 KR101192209 B1 KR 101192209B1
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KR
South Korea
Prior art keywords
inspection
substrate
head portion
tip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020090081951A
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English (en)
Korean (ko)
Other versions
KR20100029035A (ko
Inventor
마코토 후지노
다다카즈 미야타케
미노루 가토
Original Assignee
니혼덴산리드가부시키가이샤
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Publication date
Application filed by 니혼덴산리드가부시키가이샤 filed Critical 니혼덴산리드가부시키가이샤
Publication of KR20100029035A publication Critical patent/KR20100029035A/ko
Application granted granted Critical
Publication of KR101192209B1 publication Critical patent/KR101192209B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020090081951A 2008-09-05 2009-09-01 기판검사용 검사치구 Expired - Fee Related KR101192209B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008229111 2008-09-05
JPJP-P-2008-229111 2008-09-05

Publications (2)

Publication Number Publication Date
KR20100029035A KR20100029035A (ko) 2010-03-15
KR101192209B1 true KR101192209B1 (ko) 2012-10-17

Family

ID=42179469

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090081951A Expired - Fee Related KR101192209B1 (ko) 2008-09-05 2009-09-01 기판검사용 검사치구

Country Status (3)

Country Link
JP (1) JP2010085398A (enrdf_load_stackoverflow)
KR (1) KR101192209B1 (enrdf_load_stackoverflow)
TW (1) TWI427297B (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102955122A (zh) * 2011-08-18 2013-03-06 鸿富锦精密工业（深圳）有限公司 电路板测试装置
JP6537315B2 (ja) 2015-03-23 2019-07-03 オルガン針株式会社 ワイヤープローブ用治具
JP6527042B2 (ja) * 2015-07-13 2019-06-05 オルガン針株式会社 ワイヤープローブの保持構造
KR102688319B1 (ko) * 2019-09-30 2024-07-24 미쓰비시덴키 가부시키가이샤 검사 지그
KR102844124B1 (ko) * 2020-04-22 2025-08-08 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
CN115372790B (zh) * 2022-08-04 2023-09-01 国网冀北电力有限公司廊坊供电公司 一种电气检测装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265179A (ja) 1987-04-23 1988-11-01 Tokyo Electron Ltd プリント基板検査治具用ピン
JP2002181868A (ja) 2000-12-12 2002-06-26 Totsuka Densi Kk プリント配線基板の検査治具
JP2007322179A (ja) 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査用治具及びこの治具を備える基板検査装置
JP2008256361A (ja) 2007-03-30 2008-10-23 Nidec-Read Corp プローブ及び基板検査装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176866A (ja) * 1985-01-31 1986-08-08 Anritsu Corp プリント配線板の導通検査用アダプタ装置
EP0215146B1 (de) * 1985-09-16 1988-08-03 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Vorrichtung zum elektronischen Prüfen von Leiterplatten oder dergleichen
JPS6275358A (ja) * 1985-09-30 1987-04-07 Yokowo Mfg Co Ltd 回路基板検査装置
JPH07114136B2 (ja) * 1989-05-22 1995-12-06 第一精工株式会社 検査用ｉｃソケット
JPH0436465U (enrdf_load_stackoverflow) * 1990-07-24 1992-03-26
JPH04278476A (ja) * 1991-03-05 1992-10-05 Corp Of Herumesu:Kk プリント基板テスト用アダプタ
JPH06273484A (ja) * 1993-03-18 1994-09-30 I C T:Kk 半導体素子の検査装置
JP4162058B2 (ja) * 1996-06-21 2008-10-08 富士通株式会社 半導体装置の支持装置、半導体装置の固定方法及び半導体装置の支持装置からの離脱方法
US5835220A (en) * 1995-10-27 1998-11-10 Nkk Corporation Method and apparatus for detecting surface flaws
JP3505495B2 (ja) * 2000-09-13 2004-03-08 日本電産リード株式会社 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
JP2004219282A (ja) * 2003-01-16 2004-08-05 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265179A (ja) 1987-04-23 1988-11-01 Tokyo Electron Ltd プリント基板検査治具用ピン
JP2002181868A (ja) 2000-12-12 2002-06-26 Totsuka Densi Kk プリント配線基板の検査治具
JP2007322179A (ja) 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査用治具及びこの治具を備える基板検査装置
JP2008256361A (ja) 2007-03-30 2008-10-23 Nidec-Read Corp プローブ及び基板検査装置

Also Published As

Publication number Publication date
JP2010085398A (ja) 2010-04-15
TW201011305A (en) 2010-03-16
KR20100029035A (ko) 2010-03-15
TWI427297B (zh) 2014-02-21

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