JP2010085398A - 基板検査用の検査治具 - Google Patents

基板検査用の検査治具 Download PDF

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Publication number
JP2010085398A
JP2010085398A JP2009205083A JP2009205083A JP2010085398A JP 2010085398 A JP2010085398 A JP 2010085398A JP 2009205083 A JP2009205083 A JP 2009205083A JP 2009205083 A JP2009205083 A JP 2009205083A JP 2010085398 A JP2010085398 A JP 2010085398A
Authority
JP
Japan
Prior art keywords
inspection
substrate
head
jig
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009205083A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010085398A5 (enrdf_load_stackoverflow
Inventor
Makoto Fujino
真 藤野
Tadakazu Miyatake
忠数 宮武
Minoru Kato
穣 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2009205083A priority Critical patent/JP2010085398A/ja
Publication of JP2010085398A publication Critical patent/JP2010085398A/ja
Publication of JP2010085398A5 publication Critical patent/JP2010085398A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2009205083A 2008-09-05 2009-09-04 基板検査用の検査治具 Pending JP2010085398A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009205083A JP2010085398A (ja) 2008-09-05 2009-09-04 基板検査用の検査治具

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008229111 2008-09-05
JP2009205083A JP2010085398A (ja) 2008-09-05 2009-09-04 基板検査用の検査治具

Publications (2)

Publication Number Publication Date
JP2010085398A true JP2010085398A (ja) 2010-04-15
JP2010085398A5 JP2010085398A5 (enrdf_load_stackoverflow) 2012-09-27

Family

ID=42179469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009205083A Pending JP2010085398A (ja) 2008-09-05 2009-09-04 基板検査用の検査治具

Country Status (3)

Country Link
JP (1) JP2010085398A (enrdf_load_stackoverflow)
KR (1) KR101192209B1 (enrdf_load_stackoverflow)
TW (1) TWI427297B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113965A (ko) 2015-03-23 2016-10-04 오르간 하리 가부시키가이샤 와이어 프로브용 지그

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102955122A (zh) * 2011-08-18 2013-03-06 鸿富锦精密工业（深圳）有限公司 电路板测试装置
JP6527042B2 (ja) * 2015-07-13 2019-06-05 オルガン針株式会社 ワイヤープローブの保持構造
KR102688319B1 (ko) * 2019-09-30 2024-07-24 미쓰비시덴키 가부시키가이샤 검사 지그
KR102844124B1 (ko) * 2020-04-22 2025-08-08 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
CN115372790B (zh) * 2022-08-04 2023-09-01 国网冀北电力有限公司廊坊供电公司 一种电气检测装置及方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176866A (ja) * 1985-01-31 1986-08-08 Anritsu Corp プリント配線板の導通検査用アダプタ装置
JPS6267471A (ja) * 1985-09-16 1987-03-27 マニア・エレクトロニツク・アウトマテイザチオン・エントビツクルンク・ウント・ゲレ−テバウ・ゲ−エムベ−ハ− 印刷回路板等の電子的試験装置
JPH02309579A (ja) * 1989-05-22 1990-12-25 Enplas Corp 検査用ｉｃソケット
JPH0436465U (enrdf_load_stackoverflow) * 1990-07-24 1992-03-26
JPH04278476A (ja) * 1991-03-05 1992-10-05 Corp Of Herumesu:Kk プリント基板テスト用アダプタ
JPH06273484A (ja) * 1993-03-18 1994-09-30 I C T:Kk 半導体素子の検査装置
JPH1068758A (ja) * 1996-06-21 1998-03-10 Fujitsu Ltd 半導体装置の支持装置、半導体装置の試験用キャリア、半導体装置の固定方法、半導体装置の支持装置からの離脱方法及び試験用キャリアへの半導体装置の取付方法
US5835220A (en) * 1995-10-27 1998-11-10 Nkk Corporation Method and apparatus for detecting surface flaws
JP2002090410A (ja) * 2000-09-13 2002-03-27 Nidec-Read Corp 基板検査用検査治具および該検査治具を備えた基板検査装置
JP2004219282A (ja) * 2003-01-16 2004-08-05 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275358A (ja) * 1985-09-30 1987-04-07 Yokowo Mfg Co Ltd 回路基板検査装置
JP2609860B2 (ja) 1987-04-23 1997-05-14 東京エレクトロン株式会社 プリント基板検査治具用ピン
JP2002181868A (ja) 2000-12-12 2002-06-26 Totsuka Densi Kk プリント配線基板の検査治具
JP2007322179A (ja) 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査用治具及びこの治具を備える基板検査装置
JP5176368B2 (ja) 2007-03-30 2013-04-03 日本電産リード株式会社 基板検査装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176866A (ja) * 1985-01-31 1986-08-08 Anritsu Corp プリント配線板の導通検査用アダプタ装置
JPS6267471A (ja) * 1985-09-16 1987-03-27 マニア・エレクトロニツク・アウトマテイザチオン・エントビツクルンク・ウント・ゲレ−テバウ・ゲ−エムベ−ハ− 印刷回路板等の電子的試験装置
JPH02309579A (ja) * 1989-05-22 1990-12-25 Enplas Corp 検査用ｉｃソケット
JPH0436465U (enrdf_load_stackoverflow) * 1990-07-24 1992-03-26
JPH04278476A (ja) * 1991-03-05 1992-10-05 Corp Of Herumesu:Kk プリント基板テスト用アダプタ
JPH06273484A (ja) * 1993-03-18 1994-09-30 I C T:Kk 半導体素子の検査装置
US5835220A (en) * 1995-10-27 1998-11-10 Nkk Corporation Method and apparatus for detecting surface flaws
JPH1068758A (ja) * 1996-06-21 1998-03-10 Fujitsu Ltd 半導体装置の支持装置、半導体装置の試験用キャリア、半導体装置の固定方法、半導体装置の支持装置からの離脱方法及び試験用キャリアへの半導体装置の取付方法
JP2002090410A (ja) * 2000-09-13 2002-03-27 Nidec-Read Corp 基板検査用検査治具および該検査治具を備えた基板検査装置
JP2004219282A (ja) * 2003-01-16 2004-08-05 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113965A (ko) 2015-03-23 2016-10-04 오르간 하리 가부시키가이샤 와이어 프로브용 지그

Also Published As

Publication number Publication date
TW201011305A (en) 2010-03-16
KR101192209B1 (ko) 2012-10-17
KR20100029035A (ko) 2010-03-15
TWI427297B (zh) 2014-02-21

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