KR101184668B1 - 기판반송장치 - Google Patents

기판반송장치 Download PDF

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Publication number
KR101184668B1
KR101184668B1 KR1020100013624A KR20100013624A KR101184668B1 KR 101184668 B1 KR101184668 B1 KR 101184668B1 KR 1020100013624 A KR1020100013624 A KR 1020100013624A KR 20100013624 A KR20100013624 A KR 20100013624A KR 101184668 B1 KR101184668 B1 KR 101184668B1
Authority
KR
South Korea
Prior art keywords
slide
base member
horizontal
vertical
rail
Prior art date
Application number
KR1020100013624A
Other languages
English (en)
Korean (ko)
Other versions
KR20100093497A (ko
Inventor
토시히코 미쯔요시
Original Assignee
아텔 카부시키카이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아텔 카부시키카이샤 filed Critical 아텔 카부시키카이샤
Publication of KR20100093497A publication Critical patent/KR20100093497A/ko
Application granted granted Critical
Publication of KR101184668B1 publication Critical patent/KR101184668B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/025—Arms extensible telescopic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020100013624A 2009-02-16 2010-02-12 기판반송장치 KR101184668B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-032436 2009-02-16
JP2009032436A JP5185853B2 (ja) 2009-02-16 2009-02-16 基板搬送装置

Publications (2)

Publication Number Publication Date
KR20100093497A KR20100093497A (ko) 2010-08-25
KR101184668B1 true KR101184668B1 (ko) 2012-09-21

Family

ID=42757883

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100013624A KR101184668B1 (ko) 2009-02-16 2010-02-12 기판반송장치

Country Status (3)

Country Link
JP (1) JP5185853B2 (ja)
KR (1) KR101184668B1 (ja)
TW (1) TWI469245B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2882746B2 (ja) 1994-02-23 1999-04-12 大日本スクリーン製造株式会社 基板搬送装置
JP2001300883A (ja) * 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット
JP3928902B2 (ja) * 1998-02-20 2007-06-13 平田機工株式会社 基板製造ラインおよび基板製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29521292U1 (de) * 1995-06-01 1997-02-13 Samsung Electronics Co Ltd Geschwindigkeits-Erhöhungsvorrichtung für eine geradlinige Bewegung eines Orthogonalkoordinaten-Roboters
JP3342803B2 (ja) * 1996-05-30 2002-11-11 東京エレクトロン株式会社 処理装置及び基板搬送方法
JPH10157847A (ja) * 1996-11-29 1998-06-16 Canon Sales Co Inc 基板搬送ロボット装置およびこれを用いた基板処理装置ならびに半導体製造装置
JPH1126550A (ja) * 1997-07-04 1999-01-29 Tokyo Electron Ltd 基板搬送装置およびそれを用いた基板処理装置
US6281516B1 (en) * 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface
JP2000200810A (ja) * 1999-01-07 2000-07-18 Micronics Japan Co Ltd プロ―バ
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
US20060078408A1 (en) * 2004-10-08 2006-04-13 Samsung Electronics Co., Ltd. System for manufacturing a flat panel display
JPWO2008140093A1 (ja) * 2007-05-15 2010-08-05 株式会社アルバック 搬送装置及びこれを用いた真空処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2882746B2 (ja) 1994-02-23 1999-04-12 大日本スクリーン製造株式会社 基板搬送装置
JP3928902B2 (ja) * 1998-02-20 2007-06-13 平田機工株式会社 基板製造ラインおよび基板製造方法
JP2001300883A (ja) * 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット

Also Published As

Publication number Publication date
JP2010192505A (ja) 2010-09-02
TWI469245B (zh) 2015-01-11
JP5185853B2 (ja) 2013-04-17
TW201032283A (en) 2010-09-01
KR20100093497A (ko) 2010-08-25

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