KR101179819B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101179819B1
KR101179819B1 KR1020100023402A KR20100023402A KR101179819B1 KR 101179819 B1 KR101179819 B1 KR 101179819B1 KR 1020100023402 A KR1020100023402 A KR 1020100023402A KR 20100023402 A KR20100023402 A KR 20100023402A KR 101179819 B1 KR101179819 B1 KR 101179819B1
Authority
KR
South Korea
Prior art keywords
substrate
frame
lower frame
processing tank
conveying
Prior art date
Application number
KR1020100023402A
Other languages
English (en)
Korean (ko)
Other versions
KR20100105447A (ko
Inventor
히데키 스에요시
히사아키 미야사코
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20100105447A publication Critical patent/KR20100105447A/ko
Application granted granted Critical
Publication of KR101179819B1 publication Critical patent/KR101179819B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
KR1020100023402A 2009-03-19 2010-03-16 기판 처리 장치 KR101179819B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-068969 2009-03-19
JP2009068969A JP2010225687A (ja) 2009-03-19 2009-03-19 基板の処理装置

Publications (2)

Publication Number Publication Date
KR20100105447A KR20100105447A (ko) 2010-09-29
KR101179819B1 true KR101179819B1 (ko) 2012-09-04

Family

ID=42744148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100023402A KR101179819B1 (ko) 2009-03-19 2010-03-16 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2010225687A (ja)
KR (1) KR101179819B1 (ja)
CN (1) CN101840848A (ja)
TW (1) TW201037782A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102674006A (zh) * 2011-03-14 2012-09-19 无锡康力电子有限公司 玻璃镀膜机用装片架
KR101796627B1 (ko) * 2013-08-28 2017-11-10 에이피시스템 주식회사 배기장치 및 이를 포함하는 기판 처리 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005286001A (ja) * 2004-03-29 2005-10-13 Shibaura Mechatronics Corp 基板の搬送装置
WO2009022589A1 (ja) * 2007-08-13 2009-02-19 Hirata Corporation 自動倉庫システム及びその容器移載方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4641168B2 (ja) * 2004-09-22 2011-03-02 芝浦メカトロニクス株式会社 基板の処理装置
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
JP4195497B2 (ja) * 2007-12-12 2008-12-10 住友重機械工業株式会社 ステージ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005286001A (ja) * 2004-03-29 2005-10-13 Shibaura Mechatronics Corp 基板の搬送装置
WO2009022589A1 (ja) * 2007-08-13 2009-02-19 Hirata Corporation 自動倉庫システム及びその容器移載方法

Also Published As

Publication number Publication date
KR20100105447A (ko) 2010-09-29
CN101840848A (zh) 2010-09-22
TW201037782A (en) 2010-10-16
JP2010225687A (ja) 2010-10-07

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A201 Request for examination
AMND Amendment
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
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LAPS Lapse due to unpaid annual fee