KR101169830B1 - 웨이퍼 검사 장치와 웨이퍼 검사 방법, 및 컴퓨터 판독가능한 기록 매체 - Google Patents

웨이퍼 검사 장치와 웨이퍼 검사 방법, 및 컴퓨터 판독가능한 기록 매체 Download PDF

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KR101169830B1
KR101169830B1 KR1020077015845A KR20077015845A KR101169830B1 KR 101169830 B1 KR101169830 B1 KR 101169830B1 KR 1020077015845 A KR1020077015845 A KR 1020077015845A KR 20077015845 A KR20077015845 A KR 20077015845A KR 101169830 B1 KR101169830 B1 KR 101169830B1
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probe needle
probe
time
elapsed time
bonding pad
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KR20070088782A (ko
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다카히토 마츠자와
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도쿄엘렉트론가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020077015845A 2005-09-22 2006-09-21 웨이퍼 검사 장치와 웨이퍼 검사 방법, 및 컴퓨터 판독가능한 기록 매체 Active KR101169830B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00275150 2005-09-22
JP2005275150A JP2007088203A (ja) 2005-09-22 2005-09-22 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
PCT/JP2006/318718 WO2007034863A1 (ja) 2005-09-22 2006-09-21 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム

Publications (2)

Publication Number Publication Date
KR20070088782A KR20070088782A (ko) 2007-08-29
KR101169830B1 true KR101169830B1 (ko) 2012-07-30

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Country Status (5)

Country Link
US (1) US7777510B2 (https=)
JP (1) JP2007088203A (https=)
KR (1) KR101169830B1 (https=)
TW (1) TW200721345A (https=)
WO (1) WO2007034863A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230170802A (ko) * 2021-06-04 2023-12-19 가부시키가이샤 도교 세이미쓰 프로버 제어 장치, 프로버 제어 방법, 및 프로버

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
JP4932618B2 (ja) * 2007-06-29 2012-05-16 東京エレクトロン株式会社 検査方法及びこの方法を記録したプログラム記録媒体
JP5074883B2 (ja) * 2007-10-25 2012-11-14 東京エレクトロン株式会社 プローブ装置に用いられる載置装置
JP2009130114A (ja) * 2007-11-22 2009-06-11 Tokyo Electron Ltd 検査装置
JP5221118B2 (ja) 2007-12-14 2013-06-26 東京エレクトロン株式会社 検査装置
KR101040285B1 (ko) * 2008-08-04 2011-06-10 주식회사 쎄믹스 웨이퍼 프로버의 ｚ축에 대한 외부압력 측정 장치
US7977956B2 (en) * 2009-04-28 2011-07-12 Formfactor, Inc. Method and apparatus for probe card alignment in a test system
JP5308948B2 (ja) * 2009-07-23 2013-10-09 ルネサスエレクトロニクス株式会社 半導体デバイスの検査装置及び方法
JP5529769B2 (ja) 2011-01-13 2014-06-25 東京エレクトロン株式会社 プローブカードの熱的安定化方法及び検査装置
JP6209376B2 (ja) * 2013-07-08 2017-10-04 株式会社日本マイクロニクス 電気的接続装置
US10481177B2 (en) * 2014-11-26 2019-11-19 Tokyo Seimitsu Co. Ltd. Wafer inspection method
FR3033412B1 (fr) * 2015-03-06 2019-04-12 Starchip Testeur de circuits integres sur une galette de silicium et circuit integre.
JP2016191563A (ja) * 2015-03-30 2016-11-10 株式会社東芝 プローブカード及びそれを含む試験装置
JP7568360B2 (ja) * 2020-08-07 2024-10-16 東京エレクトロン株式会社 検査装置の制御方法及び検査装置
CN112366149B (zh) * 2021-01-13 2021-04-02 西安奕斯伟硅片技术有限公司 一种获取晶圆接触点的方法及系统
DE112021007357T5 (de) * 2021-03-23 2024-03-21 Kioxia Corporation Kassettengehäuse, sondenvorrichtung, server-rack und lagersystem technisches gebiet
WO2023051927A1 (en) * 2021-09-30 2023-04-06 Advantest Corporation Control devices for controlling an automated test equipment (ate), ate, methods for controlling an ate, methods for operating an ate and computer programs for performing such methods, comprising a temperature estimation or determination
KR20250016165A (ko) * 2022-05-23 2025-02-03 와틀로 일렉트릭 매뉴팩츄어링 컴파니 순응성 온도 감지 시스템
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
US12332279B2 (en) * 2023-04-12 2025-06-17 Nanya Technology Corporation Preheating control system, preheating control method and non-transient computer readable storage medium
JPWO2024232271A1 (https=) * 2023-05-08 2024-11-14
US20250327850A1 (en) * 2024-04-23 2025-10-23 Ciena Corporation Fixturing Assembly and Method for Testing, Calibrating, and Validating High Speed Radio Frequency Signals on Flexible Printed Circuits

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150164A (ja) 1997-11-19 1999-06-02 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP2003273175A (ja) 2002-03-14 2003-09-26 Ricoh Co Ltd プロービング装置並びに半導体装置の検査装置及び検査方法
JP2004253716A (ja) 2003-02-21 2004-09-09 Tokyo Seimitsu Co Ltd プローブ装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270243A (ja) 1988-04-21 1989-10-27 Sumitomo Electric Ind Ltd プローバ装置
JP2879282B2 (ja) * 1992-09-11 1999-04-05 東京エレクトロン株式会社 プローブ装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US6111421A (en) 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
JPH11176893A (ja) 1997-12-15 1999-07-02 Toshiba Corp ウェーハ測定装置
JP3270421B2 (ja) 1999-04-13 2002-04-02 株式会社ダウ・イー・ジャパン 枚葉式半導体ｉｃウエハ直接通電温度試験装置
US6498504B2 (en) * 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP4551120B2 (ja) * 2004-05-21 2010-09-22 ルネサスエレクトロニクス株式会社 プローバ装置
JP4589710B2 (ja) 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
JP4594144B2 (ja) * 2005-03-28 2010-12-08 大日本スクリーン製造株式会社 検査装置および位置ずれ量取得方法
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
DE102006022475A1 (de) * 2006-05-13 2007-11-15 Infineon Technologies Ag Verfahren zum Ausgleichen einer durch eine Temperaturänderung hervorgerufenen Positionsänderung einer Nadelkarte

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150164A (ja) 1997-11-19 1999-06-02 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP2003273175A (ja) 2002-03-14 2003-09-26 Ricoh Co Ltd プロービング装置並びに半導体装置の検査装置及び検査方法
JP2004253716A (ja) 2003-02-21 2004-09-09 Tokyo Seimitsu Co Ltd プローブ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230170802A (ko) * 2021-06-04 2023-12-19 가부시키가이샤 도교 세이미쓰 프로버 제어 장치, 프로버 제어 방법, 및 프로버
KR102731815B1 (ko) 2021-06-04 2024-11-20 가부시키가이샤 도교 세이미쓰 프로버 제어 장치, 프로버 제어 방법, 및 프로버

Also Published As

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JP2007088203A (ja) 2007-04-05
TW200721345A (en) 2007-06-01
US20090128178A1 (en) 2009-05-21
WO2007034863A1 (ja) 2007-03-29
US7777510B2 (en) 2010-08-17
TWI312547B (https=) 2009-07-21
KR20070088782A (ko) 2007-08-29

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