JPWO2024232271A1 - - Google Patents
Info
- Publication number
- JPWO2024232271A1 JPWO2024232271A1 JP2025519382A JP2025519382A JPWO2024232271A1 JP WO2024232271 A1 JPWO2024232271 A1 JP WO2024232271A1 JP 2025519382 A JP2025519382 A JP 2025519382A JP 2025519382 A JP2025519382 A JP 2025519382A JP WO2024232271 A1 JPWO2024232271 A1 JP WO2024232271A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/27—Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023076645 | 2023-05-08 | ||
| PCT/JP2024/016069 WO2024232271A1 (ja) | 2023-05-08 | 2024-04-24 | プローブ装置、プローブ装置の制御方法、検査システム及び検査システムの制御方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024232271A1 true JPWO2024232271A1 (https=) | 2024-11-14 |
Family
ID=93429980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025519382A Pending JPWO2024232271A1 (https=) | 2023-05-08 | 2024-04-24 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260092969A1 (https=) |
| JP (1) | JPWO2024232271A1 (https=) |
| KR (1) | KR20260007341A (https=) |
| CN (1) | CN121153107A (https=) |
| TW (1) | TW202509489A (https=) |
| WO (1) | WO2024232271A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
| JP2007088203A (ja) * | 2005-09-22 | 2007-04-05 | Tokyo Electron Ltd | ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム |
| KR100809598B1 (ko) | 2006-06-20 | 2008-03-04 | 삼성전자주식회사 | 가상 테스트가 가능한 반도체 테스트 시스템 및 그것의반도체 테스트 방법 |
| JP2018006406A (ja) * | 2016-06-28 | 2018-01-11 | 東京エレクトロン株式会社 | 基板検査装置 |
-
2024
- 2024-04-24 JP JP2025519382A patent/JPWO2024232271A1/ja active Pending
- 2024-04-24 WO PCT/JP2024/016069 patent/WO2024232271A1/ja not_active Ceased
- 2024-04-24 KR KR1020257039771A patent/KR20260007341A/ko active Pending
- 2024-04-24 CN CN202480029410.0A patent/CN121153107A/zh active Pending
- 2024-04-29 TW TW113115878A patent/TW202509489A/zh unknown
-
2025
- 2025-10-28 US US19/371,540 patent/US20260092969A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260092969A1 (en) | 2026-04-02 |
| KR20260007341A (ko) | 2026-01-13 |
| CN121153107A (zh) | 2025-12-16 |
| WO2024232271A1 (ja) | 2024-11-14 |
| TW202509489A (zh) | 2025-03-01 |