KR20260007341A - 프로브 장치, 프로브 장치의 제어 방법, 검사 시스템 및 검사 시스템의 제어 방법 - Google Patents

프로브 장치, 프로브 장치의 제어 방법, 검사 시스템 및 검사 시스템의 제어 방법

Info

Publication number
KR20260007341A
KR20260007341A KR1020257039771A KR20257039771A KR20260007341A KR 20260007341 A KR20260007341 A KR 20260007341A KR 1020257039771 A KR1020257039771 A KR 1020257039771A KR 20257039771 A KR20257039771 A KR 20257039771A KR 20260007341 A KR20260007341 A KR 20260007341A
Authority
KR
South Korea
Prior art keywords
control unit
unit
inspection system
inspection
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257039771A
Other languages
English (en)
Korean (ko)
Inventor
신고 모리타
요시노리 후지사와
요이치 시미즈
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20260007341A publication Critical patent/KR20260007341A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020257039771A 2023-05-08 2024-04-24 프로브 장치, 프로브 장치의 제어 방법, 검사 시스템 및 검사 시스템의 제어 방법 Pending KR20260007341A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-076645 2023-05-08
JP2023076645 2023-05-08
PCT/JP2024/016069 WO2024232271A1 (ja) 2023-05-08 2024-04-24 プローブ装置、プローブ装置の制御方法、検査システム及び検査システムの制御方法

Publications (1)

Publication Number Publication Date
KR20260007341A true KR20260007341A (ko) 2026-01-13

Family

ID=93429980

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257039771A Pending KR20260007341A (ko) 2023-05-08 2024-04-24 프로브 장치, 프로브 장치의 제어 방법, 검사 시스템 및 검사 시스템의 제어 방법

Country Status (6)

Country Link
US (1) US20260092969A1 (https=)
JP (1) JPWO2024232271A1 (https=)
KR (1) KR20260007341A (https=)
CN (1) CN121153107A (https=)
TW (1) TW202509489A (https=)
WO (1) WO2024232271A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007538263A (ja) 2004-05-20 2007-12-27 ナノネクサス インク 速い製作サイクルを有する高密度の相互接続システム
JP2008004940A (ja) 2006-06-20 2008-01-10 Samsung Electronics Co Ltd 仮想テストが可能な半導体テストシステム及びその半導体テスト方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
JP2018006406A (ja) * 2016-06-28 2018-01-11 東京エレクトロン株式会社 基板検査装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007538263A (ja) 2004-05-20 2007-12-27 ナノネクサス インク 速い製作サイクルを有する高密度の相互接続システム
JP2008004940A (ja) 2006-06-20 2008-01-10 Samsung Electronics Co Ltd 仮想テストが可能な半導体テストシステム及びその半導体テスト方法

Also Published As

Publication number Publication date
US20260092969A1 (en) 2026-04-02
CN121153107A (zh) 2025-12-16
WO2024232271A1 (ja) 2024-11-14
JPWO2024232271A1 (https=) 2024-11-14
TW202509489A (zh) 2025-03-01

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)