JP2007088203A - ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム - Google Patents

ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム Download PDF

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Publication number
JP2007088203A
JP2007088203A JP2005275150A JP2005275150A JP2007088203A JP 2007088203 A JP2007088203 A JP 2007088203A JP 2005275150 A JP2005275150 A JP 2005275150A JP 2005275150 A JP2005275150 A JP 2005275150A JP 2007088203 A JP2007088203 A JP 2007088203A
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JP
Japan
Prior art keywords
probe
probe needle
bonding pad
semiconductor wafer
wafer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2005275150A
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English (en)
Japanese (ja)
Inventor
Takahito Matsuzawa
貴仁 松沢
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005275150A priority Critical patent/JP2007088203A/ja
Priority to US12/065,621 priority patent/US7777510B2/en
Priority to PCT/JP2006/318718 priority patent/WO2007034863A1/ja
Priority to KR1020077015845A priority patent/KR101169830B1/ko
Priority to TW095135314A priority patent/TW200721345A/zh
Publication of JP2007088203A publication Critical patent/JP2007088203A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005275150A 2005-09-22 2005-09-22 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム Pending JP2007088203A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005275150A JP2007088203A (ja) 2005-09-22 2005-09-22 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
US12/065,621 US7777510B2 (en) 2005-09-22 2006-09-21 Wafer inspecting apparatus, wafer inspecting method and computer program
PCT/JP2006/318718 WO2007034863A1 (ja) 2005-09-22 2006-09-21 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
KR1020077015845A KR101169830B1 (ko) 2005-09-22 2006-09-21 웨이퍼 검사 장치와 웨이퍼 검사 방법, 및 컴퓨터 판독가능한 기록 매체
TW095135314A TW200721345A (en) 2005-09-22 2006-09-22 Wafer inspecting apparatus, wafer inspecting method and computer program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005275150A JP2007088203A (ja) 2005-09-22 2005-09-22 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム

Publications (1)

Publication Number Publication Date
JP2007088203A true JP2007088203A (ja) 2007-04-05

Family

ID=37888906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005275150A Pending JP2007088203A (ja) 2005-09-22 2005-09-22 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム

Country Status (5)

Country Link
US (1) US7777510B2 (https=)
JP (1) JP2007088203A (https=)
KR (1) KR101169830B1 (https=)
TW (1) TW200721345A (https=)
WO (1) WO2007034863A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009014350A (ja) * 2007-06-29 2009-01-22 Tokyo Electron Ltd 検査方法及びこの方法を記録したプログラム記録媒体
JP2009105313A (ja) * 2007-10-25 2009-05-14 Tokyo Electron Ltd プローブ装置に用いられる載置装置
JP2009130114A (ja) * 2007-11-22 2009-06-11 Tokyo Electron Ltd 検査装置
KR101032506B1 (ko) 2007-12-14 2011-05-04 도쿄엘렉트론가부시키가이샤 검사 장치
KR20130141631A (ko) 2011-01-13 2013-12-26 도쿄엘렉트론가부시키가이샤 프로브 카드의 열적 안정화 방법 및 검사 장치
TWI502204B (zh) * 2013-07-08 2015-10-01 Nihon Micronics Kk 電連接裝置
JP2023547033A (ja) * 2021-09-30 2023-11-09 株式会社アドバンテスト 自動試験装置（ａｔｅ）を制御するための制御装置、ａｔｅ、ａｔｅを制御するための方法、ａｔｅを操作するための方法、および温度の推定または判定を含むそのような方法を実行するためのコンピュータプログラム

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
KR101040285B1 (ko) * 2008-08-04 2011-06-10 주식회사 쎄믹스 웨이퍼 프로버의 ｚ축에 대한 외부압력 측정 장치
US7977956B2 (en) * 2009-04-28 2011-07-12 Formfactor, Inc. Method and apparatus for probe card alignment in a test system
JP5308948B2 (ja) * 2009-07-23 2013-10-09 ルネサスエレクトロニクス株式会社 半導体デバイスの検査装置及び方法
US10481177B2 (en) * 2014-11-26 2019-11-19 Tokyo Seimitsu Co. Ltd. Wafer inspection method
FR3033412B1 (fr) * 2015-03-06 2019-04-12 Starchip Testeur de circuits integres sur une galette de silicium et circuit integre.
JP2016191563A (ja) * 2015-03-30 2016-11-10 株式会社東芝 プローブカード及びそれを含む試験装置
JP7568360B2 (ja) * 2020-08-07 2024-10-16 東京エレクトロン株式会社 検査装置の制御方法及び検査装置
CN112366149B (zh) * 2021-01-13 2021-04-02 西安奕斯伟硅片技术有限公司 一种获取晶圆接触点的方法及系统
DE112021007357T5 (de) * 2021-03-23 2024-03-21 Kioxia Corporation Kassettengehäuse, sondenvorrichtung, server-rack und lagersystem technisches gebiet
JP7727169B2 (ja) * 2021-06-04 2025-08-21 株式会社東京精密 プローバ制御装置、プローバ制御方法、及びプローバ
KR20250016165A (ko) * 2022-05-23 2025-02-03 와틀로 일렉트릭 매뉴팩츄어링 컴파니 순응성 온도 감지 시스템
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
US12332279B2 (en) * 2023-04-12 2025-06-17 Nanya Technology Corporation Preheating control system, preheating control method and non-transient computer readable storage medium
JPWO2024232271A1 (https=) * 2023-05-08 2024-11-14
US20250327850A1 (en) * 2024-04-23 2025-10-23 Ciena Corporation Fixturing Assembly and Method for Testing, Calibrating, and Validating High Speed Radio Frequency Signals on Flexible Printed Circuits

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697243A (ja) * 1992-09-11 1994-04-08 Tokyo Electron Yamanashi Kk プローブ装置
JP2005333045A (ja) * 2004-05-21 2005-12-02 Nec Electronics Corp プローバ装置
WO2007034863A1 (ja) * 2005-09-22 2007-03-29 Tokyo Electron Limited ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270243A (ja) 1988-04-21 1989-10-27 Sumitomo Electric Ind Ltd プローバ装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
JP3424011B2 (ja) 1997-11-19 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
US6111421A (en) 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
JPH11176893A (ja) 1997-12-15 1999-07-02 Toshiba Corp ウェーハ測定装置
JP3270421B2 (ja) 1999-04-13 2002-04-02 株式会社ダウ・イー・ジャパン 枚葉式半導体ｉｃウエハ直接通電温度試験装置
US6498504B2 (en) * 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP3898074B2 (ja) 2002-03-14 2007-03-28 株式会社リコー プロービング装置並びに半導体装置の検査装置及び検査方法
JP2004253716A (ja) 2003-02-21 2004-09-09 Tokyo Seimitsu Co Ltd プローブ装置
JP4589710B2 (ja) 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
JP4594144B2 (ja) * 2005-03-28 2010-12-08 大日本スクリーン製造株式会社 検査装置および位置ずれ量取得方法
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
DE102006022475A1 (de) * 2006-05-13 2007-11-15 Infineon Technologies Ag Verfahren zum Ausgleichen einer durch eine Temperaturänderung hervorgerufenen Positionsänderung einer Nadelkarte

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697243A (ja) * 1992-09-11 1994-04-08 Tokyo Electron Yamanashi Kk プローブ装置
JP2005333045A (ja) * 2004-05-21 2005-12-02 Nec Electronics Corp プローバ装置
WO2007034863A1 (ja) * 2005-09-22 2007-03-29 Tokyo Electron Limited ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009014350A (ja) * 2007-06-29 2009-01-22 Tokyo Electron Ltd 検査方法及びこの方法を記録したプログラム記録媒体
US7702475B2 (en) 2007-06-29 2010-04-20 Tokyo Electron Limited Method for inspecting electrical characteristics of chips and a storage medium for storing a program of the method
JP2009105313A (ja) * 2007-10-25 2009-05-14 Tokyo Electron Ltd プローブ装置に用いられる載置装置
JP2009130114A (ja) * 2007-11-22 2009-06-11 Tokyo Electron Ltd 検査装置
KR101032506B1 (ko) 2007-12-14 2011-05-04 도쿄엘렉트론가부시키가이샤 검사 장치
KR20130141631A (ko) 2011-01-13 2013-12-26 도쿄엘렉트론가부시키가이샤 프로브 카드의 열적 안정화 방법 및 검사 장치
US9030218B2 (en) 2011-01-13 2015-05-12 Tokyo Electron Limited Method for thermal stabilization of probe card and inspection apparatus
TWI502204B (zh) * 2013-07-08 2015-10-01 Nihon Micronics Kk 電連接裝置
JP2023547033A (ja) * 2021-09-30 2023-11-09 株式会社アドバンテスト 自動試験装置（ａｔｅ）を制御するための制御装置、ａｔｅ、ａｔｅを制御するための方法、ａｔｅを操作するための方法、および温度の推定または判定を含むそのような方法を実行するためのコンピュータプログラム
JP7457208B2 (ja) 2021-09-30 2024-03-27 株式会社アドバンテスト 自動試験装置（ａｔｅ）を制御するための制御装置、ａｔｅ、ａｔｅを制御するための方法、ａｔｅを操作するための方法、および温度の推定または判定を含むそのような方法を実行するためのコンピュータプログラム

Also Published As

Publication number Publication date
KR101169830B1 (ko) 2012-07-30
TW200721345A (en) 2007-06-01
US20090128178A1 (en) 2009-05-21
WO2007034863A1 (ja) 2007-03-29
US7777510B2 (en) 2010-08-17
TWI312547B (https=) 2009-07-21
KR20070088782A (ko) 2007-08-29

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