TW200721345A - Wafer inspecting apparatus, wafer inspecting method and computer program - Google Patents

Wafer inspecting apparatus, wafer inspecting method and computer program

Info

Publication number
TW200721345A
TW200721345A TW095135314A TW95135314A TW200721345A TW 200721345 A TW200721345 A TW 200721345A TW 095135314 A TW095135314 A TW 095135314A TW 95135314 A TW95135314 A TW 95135314A TW 200721345 A TW200721345 A TW 200721345A
Authority
TW
Taiwan
Prior art keywords
wafer
probe
contact
bonding pad
probe needle
Prior art date
Application number
TW095135314A
Other languages
English (en)
Chinese (zh)
Other versions
TWI312547B (https=
Inventor
Takahito Matsuzawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200721345A publication Critical patent/TW200721345A/zh
Application granted granted Critical
Publication of TWI312547B publication Critical patent/TWI312547B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095135314A 2005-09-22 2006-09-22 Wafer inspecting apparatus, wafer inspecting method and computer program TW200721345A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005275150A JP2007088203A (ja) 2005-09-22 2005-09-22 ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム

Publications (2)

Publication Number Publication Date
TW200721345A true TW200721345A (en) 2007-06-01
TWI312547B TWI312547B (https=) 2009-07-21

Family

ID=37888906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135314A TW200721345A (en) 2005-09-22 2006-09-22 Wafer inspecting apparatus, wafer inspecting method and computer program

Country Status (5)

Country Link
US (1) US7777510B2 (https=)
JP (1) JP2007088203A (https=)
KR (1) KR101169830B1 (https=)
TW (1) TW200721345A (https=)
WO (1) WO2007034863A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI864842B (zh) * 2023-04-12 2024-12-01 南亞科技股份有限公司 預熱控制系統、預熱控制方法及非暫態電腦可讀取儲存媒體
TWI872551B (zh) * 2022-05-23 2025-02-11 美商瓦特洛威電子製造公司 順應式溫度感測系統
TWI878579B (zh) * 2020-08-07 2025-04-01 日商東京威力科創股份有限公司 檢查裝置的控制方法及檢查裝置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
JP4932618B2 (ja) * 2007-06-29 2012-05-16 東京エレクトロン株式会社 検査方法及びこの方法を記録したプログラム記録媒体
JP5074883B2 (ja) * 2007-10-25 2012-11-14 東京エレクトロン株式会社 プローブ装置に用いられる載置装置
JP2009130114A (ja) * 2007-11-22 2009-06-11 Tokyo Electron Ltd 検査装置
JP5221118B2 (ja) 2007-12-14 2013-06-26 東京エレクトロン株式会社 検査装置
KR101040285B1 (ko) * 2008-08-04 2011-06-10 주식회사 쎄믹스 웨이퍼 프로버의 ｚ축에 대한 외부압력 측정 장치
US7977956B2 (en) * 2009-04-28 2011-07-12 Formfactor, Inc. Method and apparatus for probe card alignment in a test system
JP5308948B2 (ja) * 2009-07-23 2013-10-09 ルネサスエレクトロニクス株式会社 半導体デバイスの検査装置及び方法
JP5529769B2 (ja) 2011-01-13 2014-06-25 東京エレクトロン株式会社 プローブカードの熱的安定化方法及び検査装置
JP6209376B2 (ja) * 2013-07-08 2017-10-04 株式会社日本マイクロニクス 電気的接続装置
US10481177B2 (en) * 2014-11-26 2019-11-19 Tokyo Seimitsu Co. Ltd. Wafer inspection method
FR3033412B1 (fr) * 2015-03-06 2019-04-12 Starchip Testeur de circuits integres sur une galette de silicium et circuit integre.
JP2016191563A (ja) * 2015-03-30 2016-11-10 株式会社東芝 プローブカード及びそれを含む試験装置
CN112366149B (zh) * 2021-01-13 2021-04-02 西安奕斯伟硅片技术有限公司 一种获取晶圆接触点的方法及系统
DE112021007357T5 (de) * 2021-03-23 2024-03-21 Kioxia Corporation Kassettengehäuse, sondenvorrichtung, server-rack und lagersystem technisches gebiet
JP7727169B2 (ja) * 2021-06-04 2025-08-21 株式会社東京精密 プローバ制御装置、プローバ制御方法、及びプローバ
WO2023051927A1 (en) * 2021-09-30 2023-04-06 Advantest Corporation Control devices for controlling an automated test equipment (ate), ate, methods for controlling an ate, methods for operating an ate and computer programs for performing such methods, comprising a temperature estimation or determination
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
JPWO2024232271A1 (https=) * 2023-05-08 2024-11-14
US20250327850A1 (en) * 2024-04-23 2025-10-23 Ciena Corporation Fixturing Assembly and Method for Testing, Calibrating, and Validating High Speed Radio Frequency Signals on Flexible Printed Circuits

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270243A (ja) 1988-04-21 1989-10-27 Sumitomo Electric Ind Ltd プローバ装置
JP2879282B2 (ja) * 1992-09-11 1999-04-05 東京エレクトロン株式会社 プローブ装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
JP3424011B2 (ja) 1997-11-19 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
US6111421A (en) 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
JPH11176893A (ja) 1997-12-15 1999-07-02 Toshiba Corp ウェーハ測定装置
JP3270421B2 (ja) 1999-04-13 2002-04-02 株式会社ダウ・イー・ジャパン 枚葉式半導体ｉｃウエハ直接通電温度試験装置
US6498504B2 (en) * 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP3898074B2 (ja) 2002-03-14 2007-03-28 株式会社リコー プロービング装置並びに半導体装置の検査装置及び検査方法
JP2004253716A (ja) 2003-02-21 2004-09-09 Tokyo Seimitsu Co Ltd プローブ装置
JP4551120B2 (ja) * 2004-05-21 2010-09-22 ルネサスエレクトロニクス株式会社 プローバ装置
JP4589710B2 (ja) 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
JP4594144B2 (ja) * 2005-03-28 2010-12-08 大日本スクリーン製造株式会社 検査装置および位置ずれ量取得方法
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
DE102006022475A1 (de) * 2006-05-13 2007-11-15 Infineon Technologies Ag Verfahren zum Ausgleichen einer durch eine Temperaturänderung hervorgerufenen Positionsänderung einer Nadelkarte

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878579B (zh) * 2020-08-07 2025-04-01 日商東京威力科創股份有限公司 檢查裝置的控制方法及檢查裝置
TWI872551B (zh) * 2022-05-23 2025-02-11 美商瓦特洛威電子製造公司 順應式溫度感測系統
TWI864842B (zh) * 2023-04-12 2024-12-01 南亞科技股份有限公司 預熱控制系統、預熱控制方法及非暫態電腦可讀取儲存媒體
TWI906095B (zh) * 2023-04-12 2025-11-21 南亞科技股份有限公司 預熱控制系統、預熱控制方法及非暫態電腦可讀取儲存媒體

Also Published As

Publication number Publication date
KR101169830B1 (ko) 2012-07-30
JP2007088203A (ja) 2007-04-05
US20090128178A1 (en) 2009-05-21
WO2007034863A1 (ja) 2007-03-29
US7777510B2 (en) 2010-08-17
TWI312547B (https=) 2009-07-21
KR20070088782A (ko) 2007-08-29

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