KR101151113B1 - 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법 - Google Patents

유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법 Download PDF

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Publication number
KR101151113B1
KR101151113B1 KR1020047013434A KR20047013434A KR101151113B1 KR 101151113 B1 KR101151113 B1 KR 101151113B1 KR 1020047013434 A KR1020047013434 A KR 1020047013434A KR 20047013434 A KR20047013434 A KR 20047013434A KR 101151113 B1 KR101151113 B1 KR 101151113B1
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South Korea
Prior art keywords
adhesive composition
alkyl
substituted
adhesive
group
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KR1020047013434A
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English (en)
Korean (ko)
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KR20040094746A (ko
Inventor
리차드 재거
베네딕토 델로스산토스
제임스 티 훈크
푸웨이 리우
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헨켈 코포레이션
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Publication of KR101151113B1 publication Critical patent/KR101151113B1/ko
Assigned to 헨켈 유에스 아이피 엘엘씨 reassignment 헨켈 유에스 아이피 엘엘씨 권리의 전부이전등록 Assignors: 헨켈 코포레이션
Assigned to 헨켈 아이피 앤드 홀딩 게엠베하 reassignment 헨켈 아이피 앤드 홀딩 게엠베하 권리의 전부이전등록 Assignors: 헨켈 유에스 아이피 엘엘씨
Assigned to 헨켈 아게 운트 코. 카게아아 reassignment 헨켈 아게 운트 코. 카게아아 권리의 전부이전등록 Assignors: 헨켈 아이피 앤드 홀딩 게엠베하
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020047013434A 2002-02-28 2003-02-28 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법 Expired - Lifetime KR101151113B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/087,191 US6806309B2 (en) 2002-02-28 2002-02-28 Adhesive compositions containing organic spacers and methods for use thereof
US10/087,191 2002-02-28
PCT/US2003/006284 WO2003072673A2 (en) 2002-02-28 2003-02-28 Adhesive compositions containing organic spacers and methods for use thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020127008294A Division KR101223385B1 (ko) 2002-02-28 2003-02-28 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법

Publications (2)

Publication Number Publication Date
KR20040094746A KR20040094746A (ko) 2004-11-10
KR101151113B1 true KR101151113B1 (ko) 2012-06-01

Family

ID=27765358

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020047013434A Expired - Lifetime KR101151113B1 (ko) 2002-02-28 2003-02-28 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법
KR1020127008294A Expired - Lifetime KR101223385B1 (ko) 2002-02-28 2003-02-28 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127008294A Expired - Lifetime KR101223385B1 (ko) 2002-02-28 2003-02-28 유기 스페이서를 함유하는 접착 조성물 및 그의 사용 방법

Country Status (6)

Country Link
US (1) US6806309B2 (https=)
JP (1) JP2005519150A (https=)
KR (2) KR101151113B1 (https=)
CN (1) CN100393834C (https=)
AU (1) AU2003225625A1 (https=)
WO (1) WO2003072673A2 (https=)

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TW546795B (en) * 2002-06-04 2003-08-11 Siliconware Precision Industries Co Ltd Multichip module and manufacturing method thereof
WO2004037878A2 (en) * 2002-10-22 2004-05-06 Henkel Corporation Co-curable compositions
US20040113483A1 (en) * 2002-12-11 2004-06-17 Sylvester Michael S. Method of adhering decorative wheel cover to automobile wheel
JP4325531B2 (ja) * 2004-10-15 2009-09-02 住友ベークライト株式会社 樹脂封止型半導体装置
DE102005048826B3 (de) * 2005-10-10 2007-04-12 Infineon Technologies Ag Halbleiterbauteil mit Halbleiterchip und Klebstofffolie und Verfahren zur Herstellung des Halbleiterchips und Halbleiterbauteils
KR101323522B1 (ko) * 2006-08-14 2013-10-29 브로제 파르초이크타일레 게엠베하 운트 코. 카게, 뷔르츠부르크 전기 모터용 로터
JP4988531B2 (ja) * 2006-12-18 2012-08-01 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2008226946A (ja) * 2007-03-09 2008-09-25 Nec Corp 半導体装置およびその製造方法
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
KR100926747B1 (ko) * 2007-11-12 2009-11-16 한국전자통신연구원 도전 접착제 및 이를 이용한 플립칩 본딩 방법
US8269300B2 (en) * 2008-04-29 2012-09-18 Omnivision Technologies, Inc. Apparatus and method for using spacer paste to package an image sensor
KR101990258B1 (ko) * 2008-08-08 2019-06-17 헨켈 아이피 앤드 홀딩 게엠베하 저온 경화 조성물
GB0823063D0 (en) * 2008-12-18 2009-01-28 Bostik Ltd Sealant tape comprising offsetting particles
US8362120B2 (en) * 2009-02-02 2013-01-29 Lord Corporation Structural adhesives containing maleimide terminated polyimides
JP5304592B2 (ja) * 2009-10-27 2013-10-02 住友ベークライト株式会社 樹脂封止型半導体装置
US8454789B2 (en) 2010-11-05 2013-06-04 Raytheon Company Disposable bond gap control structures
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
CN104204121A (zh) * 2012-01-25 2014-12-10 汉高美国知识产权有限责任公司 氰基丙烯酸酯组合物
JP2013048295A (ja) * 2012-11-21 2013-03-07 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
WO2017136669A1 (en) * 2016-02-04 2017-08-10 Henkel IP & Holding GmbH Debondable adhesives and the high temperature use thereof
CN105910985A (zh) * 2016-06-02 2016-08-31 廊坊立邦涂料有限公司 建筑用腻子、防水涂料粘结强度的测试方法和高强度粘结剂及应用
CN106010349A (zh) * 2016-07-21 2016-10-12 苏州泰仑电子材料有限公司 耐高温聚氨酯压敏胶保护膜
JP6424868B2 (ja) * 2016-09-07 2018-11-21 信越化学工業株式会社 シラン変性共重合体、その製造方法および密着向上剤
WO2019218268A1 (en) 2018-05-16 2019-11-21 Henkel Ag & Co., Kgaa Curable adhesive composition for die attach
JP6971362B1 (ja) * 2020-07-17 2021-11-24 京都エレックス株式会社 導電性接着剤組成物

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JPH11189765A (ja) * 1997-12-26 1999-07-13 Toshiba Chem Corp 絶縁性接着剤

Also Published As

Publication number Publication date
KR20120056287A (ko) 2012-06-01
AU2003225625A8 (en) 2003-09-09
KR20040094746A (ko) 2004-11-10
JP2005519150A (ja) 2005-06-30
WO2003072673A3 (en) 2004-03-11
AU2003225625A1 (en) 2003-09-09
CN100393834C (zh) 2008-06-11
KR101223385B1 (ko) 2013-01-16
CN1643095A (zh) 2005-07-20
WO2003072673A2 (en) 2003-09-04
US20030230814A1 (en) 2003-12-18
US6806309B2 (en) 2004-10-19

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