CN100393834C - 含有机间隔剂的粘合剂组合物及其应用方法 - Google Patents

含有机间隔剂的粘合剂组合物及其应用方法 Download PDF

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Publication number
CN100393834C
CN100393834C CNB03806216XA CN03806216A CN100393834C CN 100393834 C CN100393834 C CN 100393834C CN B03806216X A CNB03806216X A CN B03806216XA CN 03806216 A CN03806216 A CN 03806216A CN 100393834 C CN100393834 C CN 100393834C
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CN
China
Prior art keywords
adhesive composition
alkyl
substrate
adhesive
group
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Expired - Fee Related
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CNB03806216XA
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English (en)
Chinese (zh)
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CN1643095A (zh
Inventor
R·杰格尔
B·迪勒斯桑托斯
J·T·汉尼克
刘圃伟
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Henkel Corp
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Henkel Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
CNB03806216XA 2002-02-28 2003-02-28 含有机间隔剂的粘合剂组合物及其应用方法 Expired - Fee Related CN100393834C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/087,191 US6806309B2 (en) 2002-02-28 2002-02-28 Adhesive compositions containing organic spacers and methods for use thereof
US10/087,191 2002-02-28

Publications (2)

Publication Number Publication Date
CN1643095A CN1643095A (zh) 2005-07-20
CN100393834C true CN100393834C (zh) 2008-06-11

Family

ID=27765358

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB03806216XA Expired - Fee Related CN100393834C (zh) 2002-02-28 2003-02-28 含有机间隔剂的粘合剂组合物及其应用方法

Country Status (6)

Country Link
US (1) US6806309B2 (https=)
JP (1) JP2005519150A (https=)
KR (2) KR101223385B1 (https=)
CN (1) CN100393834C (https=)
AU (1) AU2003225625A1 (https=)
WO (1) WO2003072673A2 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW546795B (en) * 2002-06-04 2003-08-11 Siliconware Precision Industries Co Ltd Multichip module and manufacturing method thereof
US20050288457A1 (en) * 2002-10-22 2005-12-29 Puwei Liu Co-curable compositions
US20040113483A1 (en) * 2002-12-11 2004-06-17 Sylvester Michael S. Method of adhering decorative wheel cover to automobile wheel
JP4325531B2 (ja) * 2004-10-15 2009-09-02 住友ベークライト株式会社 樹脂封止型半導体装置
DE102005048826B3 (de) * 2005-10-10 2007-04-12 Infineon Technologies Ag Halbleiterbauteil mit Halbleiterchip und Klebstofffolie und Verfahren zur Herstellung des Halbleiterchips und Halbleiterbauteils
KR101323522B1 (ko) * 2006-08-14 2013-10-29 브로제 파르초이크타일레 게엠베하 운트 코. 카게, 뷔르츠부르크 전기 모터용 로터
JP4988531B2 (ja) * 2006-12-18 2012-08-01 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2008226946A (ja) * 2007-03-09 2008-09-25 Nec Corp 半導体装置およびその製造方法
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
KR100926747B1 (ko) * 2007-11-12 2009-11-16 한국전자통신연구원 도전 접착제 및 이를 이용한 플립칩 본딩 방법
US8269300B2 (en) * 2008-04-29 2012-09-18 Omnivision Technologies, Inc. Apparatus and method for using spacer paste to package an image sensor
KR101990258B1 (ko) * 2008-08-08 2019-06-17 헨켈 아이피 앤드 홀딩 게엠베하 저온 경화 조성물
GB0823063D0 (en) * 2008-12-18 2009-01-28 Bostik Ltd Sealant tape comprising offsetting particles
CN102300950A (zh) * 2009-02-02 2011-12-28 洛德公司 含有马来酰亚胺封端的聚酰亚胺的结构粘合剂
JP5304592B2 (ja) * 2009-10-27 2013-10-02 住友ベークライト株式会社 樹脂封止型半導体装置
US8454789B2 (en) 2010-11-05 2013-06-04 Raytheon Company Disposable bond gap control structures
WO2013112315A1 (en) * 2012-01-25 2013-08-01 Henkel Corporation Cyanoacrylate compositions
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
JP2013048295A (ja) * 2012-11-21 2013-03-07 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
WO2017136669A1 (en) * 2016-02-04 2017-08-10 Henkel IP & Holding GmbH Debondable adhesives and the high temperature use thereof
CN105910985A (zh) * 2016-06-02 2016-08-31 廊坊立邦涂料有限公司 建筑用腻子、防水涂料粘结强度的测试方法和高强度粘结剂及应用
CN106010349A (zh) * 2016-07-21 2016-10-12 苏州泰仑电子材料有限公司 耐高温聚氨酯压敏胶保护膜
JP6424868B2 (ja) * 2016-09-07 2018-11-21 信越化学工業株式会社 シラン変性共重合体、その製造方法および密着向上剤
WO2019218268A1 (en) 2018-05-16 2019-11-21 Henkel Ag & Co., Kgaa Curable adhesive composition for die attach
JP6971362B1 (ja) * 2020-07-17 2021-11-24 京都エレックス株式会社 導電性接着剤組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232962A (en) * 1991-10-09 1993-08-03 Quantum Materials, Inc. Adhesive bonding composition with bond line limiting spacer system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3406053A (en) 1964-06-01 1968-10-15 Whittaker Corp Adhesive composition
US3655482A (en) 1969-12-23 1972-04-11 Edo Corp Bonding method and product
US4054714A (en) 1976-06-07 1977-10-18 E. I. Du Pont De Nemours And Company Electrically conductive adhesive composition
US5358992A (en) 1993-02-26 1994-10-25 Quantum Materials, Inc. Die-attach composition comprising polycyanate ester monomer
JP2983816B2 (ja) * 1993-10-29 1999-11-29 住友ベークライト株式会社 導電性樹脂ペースト
US6034194A (en) * 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
EP1453087B1 (en) * 1994-09-02 2012-02-22 Henkel Corporation Microelectronic assembly
JPH08319461A (ja) * 1995-03-20 1996-12-03 Sumitomo Bakelite Co Ltd 半導体装置
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
US6288170B1 (en) 1997-05-05 2001-09-11 3M Innovative Properties Company Removable adhesive of polyepoxide, curing agent and microspheres
JPH11158448A (ja) * 1997-11-28 1999-06-15 Sony Corp 導電性接着剤およびこれを用いた電子部品
JPH11189765A (ja) * 1997-12-26 1999-07-13 Toshiba Chem Corp 絶縁性接着剤
DE19817193B4 (de) * 1998-04-17 2006-04-13 Robert Bosch Gmbh Strahlungs- und/oder wärmehärtbarer Klebstoff mit hoher Wärmeleitfähigkeit und seine Verwendung
JP2000036502A (ja) * 1998-07-17 2000-02-02 Sony Corp 接合材及びその接合物
US6472758B1 (en) 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232962A (en) * 1991-10-09 1993-08-03 Quantum Materials, Inc. Adhesive bonding composition with bond line limiting spacer system

Also Published As

Publication number Publication date
US20030230814A1 (en) 2003-12-18
US6806309B2 (en) 2004-10-19
KR101223385B1 (ko) 2013-01-16
AU2003225625A1 (en) 2003-09-09
JP2005519150A (ja) 2005-06-30
KR20120056287A (ko) 2012-06-01
WO2003072673A3 (en) 2004-03-11
KR20040094746A (ko) 2004-11-10
WO2003072673A2 (en) 2003-09-04
CN1643095A (zh) 2005-07-20
KR101151113B1 (ko) 2012-06-01
AU2003225625A8 (en) 2003-09-09

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Granted publication date: 20080611