AU2003225625A1 - Adhesive compositions containing organic spacers and methods for use thereof - Google Patents

Adhesive compositions containing organic spacers and methods for use thereof

Info

Publication number
AU2003225625A1
AU2003225625A1 AU2003225625A AU2003225625A AU2003225625A1 AU 2003225625 A1 AU2003225625 A1 AU 2003225625A1 AU 2003225625 A AU2003225625 A AU 2003225625A AU 2003225625 A AU2003225625 A AU 2003225625A AU 2003225625 A1 AU2003225625 A1 AU 2003225625A1
Authority
AU
Australia
Prior art keywords
methods
compositions containing
containing organic
adhesive compositions
organic spacers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003225625A
Other languages
English (en)
Other versions
AU2003225625A8 (en
Inventor
Benedicto Delos Santos
James T. Huneke
Richard Jaeger
Puwei Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Corp
Original Assignee
Henkel Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Loctite Corp filed Critical Henkel Loctite Corp
Publication of AU2003225625A1 publication Critical patent/AU2003225625A1/en
Publication of AU2003225625A8 publication Critical patent/AU2003225625A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
AU2003225625A 2002-02-28 2003-02-28 Adhesive compositions containing organic spacers and methods for use thereof Abandoned AU2003225625A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/087,191 US6806309B2 (en) 2002-02-28 2002-02-28 Adhesive compositions containing organic spacers and methods for use thereof
US10/087,191 2002-02-28
PCT/US2003/006284 WO2003072673A2 (en) 2002-02-28 2003-02-28 Adhesive compositions containing organic spacers and methods for use thereof

Publications (2)

Publication Number Publication Date
AU2003225625A1 true AU2003225625A1 (en) 2003-09-09
AU2003225625A8 AU2003225625A8 (en) 2003-09-09

Family

ID=27765358

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003225625A Abandoned AU2003225625A1 (en) 2002-02-28 2003-02-28 Adhesive compositions containing organic spacers and methods for use thereof

Country Status (6)

Country Link
US (1) US6806309B2 (https=)
JP (1) JP2005519150A (https=)
KR (2) KR101223385B1 (https=)
CN (1) CN100393834C (https=)
AU (1) AU2003225625A1 (https=)
WO (1) WO2003072673A2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW546795B (en) * 2002-06-04 2003-08-11 Siliconware Precision Industries Co Ltd Multichip module and manufacturing method thereof
US20050288457A1 (en) * 2002-10-22 2005-12-29 Puwei Liu Co-curable compositions
US20040113483A1 (en) * 2002-12-11 2004-06-17 Sylvester Michael S. Method of adhering decorative wheel cover to automobile wheel
JP4325531B2 (ja) * 2004-10-15 2009-09-02 住友ベークライト株式会社 樹脂封止型半導体装置
DE102005048826B3 (de) * 2005-10-10 2007-04-12 Infineon Technologies Ag Halbleiterbauteil mit Halbleiterchip und Klebstofffolie und Verfahren zur Herstellung des Halbleiterchips und Halbleiterbauteils
KR101323522B1 (ko) * 2006-08-14 2013-10-29 브로제 파르초이크타일레 게엠베하 운트 코. 카게, 뷔르츠부르크 전기 모터용 로터
JP4988531B2 (ja) * 2006-12-18 2012-08-01 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2008226946A (ja) * 2007-03-09 2008-09-25 Nec Corp 半導体装置およびその製造方法
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
KR100926747B1 (ko) * 2007-11-12 2009-11-16 한국전자통신연구원 도전 접착제 및 이를 이용한 플립칩 본딩 방법
US8269300B2 (en) * 2008-04-29 2012-09-18 Omnivision Technologies, Inc. Apparatus and method for using spacer paste to package an image sensor
KR101990258B1 (ko) * 2008-08-08 2019-06-17 헨켈 아이피 앤드 홀딩 게엠베하 저온 경화 조성물
GB0823063D0 (en) * 2008-12-18 2009-01-28 Bostik Ltd Sealant tape comprising offsetting particles
CN102300950A (zh) * 2009-02-02 2011-12-28 洛德公司 含有马来酰亚胺封端的聚酰亚胺的结构粘合剂
JP5304592B2 (ja) * 2009-10-27 2013-10-02 住友ベークライト株式会社 樹脂封止型半導体装置
US8454789B2 (en) 2010-11-05 2013-06-04 Raytheon Company Disposable bond gap control structures
WO2013112315A1 (en) * 2012-01-25 2013-08-01 Henkel Corporation Cyanoacrylate compositions
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
JP2013048295A (ja) * 2012-11-21 2013-03-07 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
WO2017136669A1 (en) * 2016-02-04 2017-08-10 Henkel IP & Holding GmbH Debondable adhesives and the high temperature use thereof
CN105910985A (zh) * 2016-06-02 2016-08-31 廊坊立邦涂料有限公司 建筑用腻子、防水涂料粘结强度的测试方法和高强度粘结剂及应用
CN106010349A (zh) * 2016-07-21 2016-10-12 苏州泰仑电子材料有限公司 耐高温聚氨酯压敏胶保护膜
JP6424868B2 (ja) * 2016-09-07 2018-11-21 信越化学工業株式会社 シラン変性共重合体、その製造方法および密着向上剤
WO2019218268A1 (en) 2018-05-16 2019-11-21 Henkel Ag & Co., Kgaa Curable adhesive composition for die attach
JP6971362B1 (ja) * 2020-07-17 2021-11-24 京都エレックス株式会社 導電性接着剤組成物

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3406053A (en) 1964-06-01 1968-10-15 Whittaker Corp Adhesive composition
US3655482A (en) 1969-12-23 1972-04-11 Edo Corp Bonding method and product
US4054714A (en) 1976-06-07 1977-10-18 E. I. Du Pont De Nemours And Company Electrically conductive adhesive composition
US5232962A (en) * 1991-10-09 1993-08-03 Quantum Materials, Inc. Adhesive bonding composition with bond line limiting spacer system
US5358992A (en) 1993-02-26 1994-10-25 Quantum Materials, Inc. Die-attach composition comprising polycyanate ester monomer
JP2983816B2 (ja) * 1993-10-29 1999-11-29 住友ベークライト株式会社 導電性樹脂ペースト
US6034194A (en) * 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
EP1453087B1 (en) * 1994-09-02 2012-02-22 Henkel Corporation Microelectronic assembly
JPH08319461A (ja) * 1995-03-20 1996-12-03 Sumitomo Bakelite Co Ltd 半導体装置
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
US6288170B1 (en) 1997-05-05 2001-09-11 3M Innovative Properties Company Removable adhesive of polyepoxide, curing agent and microspheres
JPH11158448A (ja) * 1997-11-28 1999-06-15 Sony Corp 導電性接着剤およびこれを用いた電子部品
JPH11189765A (ja) * 1997-12-26 1999-07-13 Toshiba Chem Corp 絶縁性接着剤
DE19817193B4 (de) * 1998-04-17 2006-04-13 Robert Bosch Gmbh Strahlungs- und/oder wärmehärtbarer Klebstoff mit hoher Wärmeleitfähigkeit und seine Verwendung
JP2000036502A (ja) * 1998-07-17 2000-02-02 Sony Corp 接合材及びその接合物
US6472758B1 (en) 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires

Also Published As

Publication number Publication date
US20030230814A1 (en) 2003-12-18
US6806309B2 (en) 2004-10-19
KR101223385B1 (ko) 2013-01-16
JP2005519150A (ja) 2005-06-30
CN100393834C (zh) 2008-06-11
KR20120056287A (ko) 2012-06-01
WO2003072673A3 (en) 2004-03-11
KR20040094746A (ko) 2004-11-10
WO2003072673A2 (en) 2003-09-04
CN1643095A (zh) 2005-07-20
KR101151113B1 (ko) 2012-06-01
AU2003225625A8 (en) 2003-09-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase