KR101139252B1 - 본딩장치 - Google Patents

본딩장치 Download PDF

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Publication number
KR101139252B1
KR101139252B1 KR1020060114809A KR20060114809A KR101139252B1 KR 101139252 B1 KR101139252 B1 KR 101139252B1 KR 1020060114809 A KR1020060114809 A KR 1020060114809A KR 20060114809 A KR20060114809 A KR 20060114809A KR 101139252 B1 KR101139252 B1 KR 101139252B1
Authority
KR
South Korea
Prior art keywords
bonding
frame
liquid crystal
crystal display
integrated circuit
Prior art date
Application number
KR1020060114809A
Other languages
English (en)
Korean (ko)
Other versions
KR20080045570A (ko
Inventor
김동제
심현식
문홍주
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020060114809A priority Critical patent/KR101139252B1/ko
Priority to JP2007027567A priority patent/JP4500821B2/ja
Priority to CN200710078879A priority patent/CN100594402C/zh
Publication of KR20080045570A publication Critical patent/KR20080045570A/ko
Application granted granted Critical
Publication of KR101139252B1 publication Critical patent/KR101139252B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
KR1020060114809A 2006-11-20 2006-11-20 본딩장치 KR101139252B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020060114809A KR101139252B1 (ko) 2006-11-20 2006-11-20 본딩장치
JP2007027567A JP4500821B2 (ja) 2006-11-20 2007-02-07 ボンディング装置
CN200710078879A CN100594402C (zh) 2006-11-20 2007-02-16 接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060114809A KR101139252B1 (ko) 2006-11-20 2006-11-20 본딩장치

Publications (2)

Publication Number Publication Date
KR20080045570A KR20080045570A (ko) 2008-05-23
KR101139252B1 true KR101139252B1 (ko) 2012-05-14

Family

ID=39480197

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060114809A KR101139252B1 (ko) 2006-11-20 2006-11-20 본딩장치

Country Status (3)

Country Link
JP (1) JP4500821B2 (ja)
KR (1) KR101139252B1 (ja)
CN (1) CN100594402C (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256669A (ja) * 2009-04-27 2010-11-11 Hitachi High-Technologies Corp パネル処理装置およびその方法
JP5583283B2 (ja) * 2010-09-20 2014-09-03 ヒ ハン、ドン パネル姿勢調節装置及びこれを備えたパネル取付装置
CN104035216B (zh) * 2014-04-18 2017-01-25 深圳市华星光电技术有限公司 一种用于压接覆晶薄膜的压块及压接装置
CN107180770A (zh) * 2016-03-10 2017-09-19 致伸科技股份有限公司 热压设备
CN106199988B (zh) * 2016-08-31 2020-06-16 京东方科技集团股份有限公司 一种调节结构、3d显示装置及其控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224165A (ja) * 2002-01-29 2003-08-08 Matsushita Electric Ind Co Ltd 電子部品のボンディング装置およびボンディング方法
JP2003282653A (ja) 2002-03-27 2003-10-03 Matsushita Electric Ind Co Ltd 電子部品のボンディング装置およびボンディング方法
KR100632378B1 (ko) 2005-07-07 2006-10-11 세광테크 주식회사 인라인 자동 ｆｏｇ 본딩장치
JP2006287011A (ja) * 2005-04-01 2006-10-19 Hitachi High-Technologies Corp 熱圧着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224165A (ja) * 2002-01-29 2003-08-08 Matsushita Electric Ind Co Ltd 電子部品のボンディング装置およびボンディング方法
JP2003282653A (ja) 2002-03-27 2003-10-03 Matsushita Electric Ind Co Ltd 電子部品のボンディング装置およびボンディング方法
JP2006287011A (ja) * 2005-04-01 2006-10-19 Hitachi High-Technologies Corp 熱圧着装置
KR100632378B1 (ko) 2005-07-07 2006-10-11 세광테크 주식회사 인라인 자동 ｆｏｇ 본딩장치

Also Published As

Publication number Publication date
KR20080045570A (ko) 2008-05-23
CN100594402C (zh) 2010-03-17
JP2008131028A (ja) 2008-06-05
JP4500821B2 (ja) 2010-07-14
CN101187741A (zh) 2008-05-28

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