KR101138077B1 - 광소자의 수지 밀봉 성형 방법 - Google Patents

광소자의 수지 밀봉 성형 방법 Download PDF

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Publication number
KR101138077B1
KR101138077B1 KR1020107027347A KR20107027347A KR101138077B1 KR 101138077 B1 KR101138077 B1 KR 101138077B1 KR 1020107027347 A KR1020107027347 A KR 1020107027347A KR 20107027347 A KR20107027347 A KR 20107027347A KR 101138077 B1 KR101138077 B1 KR 101138077B1
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South Korea
Prior art keywords
mold
substrate
resin
lens
cavity
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KR1020107027347A
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English (en)
Korean (ko)
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KR20100132563A (ko
Inventor
카즈키 카와쿠보
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토와 가부시기가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0029—Translucent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020107027347A 2006-01-16 2006-12-15 광소자의 수지 밀봉 성형 방법 Active KR101138077B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006006922A JP5192646B2 (ja) 2006-01-16 2006-01-16 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法
JPJP-P-2006-006922 2006-01-16
PCT/JP2006/325039 WO2007080742A1 (ja) 2006-01-16 2006-12-15 光素子の樹脂封止成形方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020087017304A Division KR20080078901A (ko) 2006-01-16 2006-12-15 광소자의 수지 밀봉 성형 방법

Publications (2)

Publication Number Publication Date
KR20100132563A KR20100132563A (ko) 2010-12-17
KR101138077B1 true KR101138077B1 (ko) 2012-04-24

Family

ID=38256154

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020107027347A Active KR101138077B1 (ko) 2006-01-16 2006-12-15 광소자의 수지 밀봉 성형 방법
KR1020087017304A Ceased KR20080078901A (ko) 2006-01-16 2006-12-15 광소자의 수지 밀봉 성형 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020087017304A Ceased KR20080078901A (ko) 2006-01-16 2006-12-15 광소자의 수지 밀봉 성형 방법

Country Status (8)

Country Link
US (1) US20090091048A1 (https=)
EP (1) EP1976028A1 (https=)
JP (1) JP5192646B2 (https=)
KR (2) KR101138077B1 (https=)
CN (2) CN102820234A (https=)
MY (1) MY151939A (https=)
TW (1) TW200733431A (https=)
WO (1) WO2007080742A1 (https=)

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JP2009117536A (ja) * 2007-11-05 2009-05-28 Towa Corp 樹脂封止発光体及びその製造方法
US20090230409A1 (en) * 2008-03-17 2009-09-17 Philips Lumileds Lighting Company, Llc Underfill process for flip-chip leds
DE102008025159A1 (de) * 2008-05-26 2009-12-10 Osram Opto Semiconductors Gmbh Halbleiterbauelement, Reflexlichtschranke und Verfahren zur Herstellung eines Gehäuses
TWI416674B (zh) * 2008-11-05 2013-11-21 日月光半導體製造股份有限公司 封膠模具與封膠方法
TWI381496B (zh) 2009-01-23 2013-01-01 億光電子工業股份有限公司 封裝基板結構與晶片封裝結構及其製程
US20100209670A1 (en) * 2009-02-17 2010-08-19 Nitto Denko Corporation Sheet for photosemiconductor encapsulation
JP5173940B2 (ja) * 2009-06-02 2013-04-03 アピックヤマダ株式会社 半導体パッケージの製造方法及び切断装置
KR20110011405A (ko) * 2009-07-28 2011-02-08 한미반도체 주식회사 반도체 패키지 제조용 패키지 집합체
JP5894723B2 (ja) * 2009-12-29 2016-03-30 株式会社朝日ラバー 半導体発光装置の製造方法
US10500770B2 (en) * 2010-03-02 2019-12-10 So-Semi Technologies, Llc LED packaging with integrated optics and methods of manufacturing the same
JP5563918B2 (ja) * 2010-07-22 2014-07-30 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置の製造方法
JP5697919B2 (ja) * 2010-07-29 2015-04-08 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
WO2012031703A1 (de) * 2010-09-06 2012-03-15 Heraeus Noblelight Gmbh Beschichtungsverfahren für ein optoelektronisches chip-on-board-modul
JP5744697B2 (ja) * 2011-10-17 2015-07-08 Ｔｏｗａ株式会社 光電子部品及びその製造方法
RU2617880C2 (ru) * 2012-02-10 2017-04-28 Конинклейке Филипс Н.В. Прессованная линза, формирующая led-модуль масштаба интегральной схемы, и способ ее изготовления
CN104160522B (zh) * 2012-03-06 2017-12-22 飞利浦灯具控股公司 发光模块和制造发光模块的方法
CN103437632A (zh) * 2013-08-31 2013-12-11 德清科迪特安保设备有限公司 防潮保险柜
CN104051669B (zh) * 2014-05-28 2016-02-03 京东方科技集团股份有限公司 封装基板、封装方法、显示面板
KR101638125B1 (ko) * 2014-10-23 2016-07-11 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
CN106688115B (zh) 2014-09-12 2019-06-14 世迈克琉明有限公司 半导体发光元件的制造方法
JP6356581B2 (ja) * 2014-11-19 2018-07-11 信越化学工業株式会社 半導体装置の製造方法
JP6598723B2 (ja) * 2016-04-06 2019-10-30 株式会社ディスコ パッケージウェーハの製造方法
KR20170136158A (ko) * 2016-06-01 2017-12-11 주식회사 라이트전자 Uv 플립칩 led 면광원 모듈
JP6672113B2 (ja) * 2016-09-09 2020-03-25 Ｔｏｗａ株式会社 電子回路装置及び電子回路装置の製造方法
CN108417699B (zh) * 2018-05-18 2024-11-08 深德彩科技(深圳)股份有限公司 Led光源的塑封模具
CN108807649B (zh) * 2018-06-13 2020-09-11 深德彩光电(深圳)有限公司 一种led光源塑封方法
CN108547839B (zh) * 2018-06-14 2024-11-15 深德彩科技(深圳)股份有限公司 封胶装置
CN109560181B (zh) * 2018-11-16 2020-04-17 重庆秉为科技有限公司 一种led封装结构

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JP2005305954A (ja) * 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法

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JP2005305954A (ja) * 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法

Also Published As

Publication number Publication date
WO2007080742A1 (ja) 2007-07-19
EP1976028A1 (en) 2008-10-01
JP2007189116A (ja) 2007-07-26
CN101361201B (zh) 2013-04-03
JP5192646B2 (ja) 2013-05-08
CN101361201A (zh) 2009-02-04
MY151939A (en) 2014-07-31
KR20100132563A (ko) 2010-12-17
KR20080078901A (ko) 2008-08-28
CN102820234A (zh) 2012-12-12
TW200733431A (en) 2007-09-01
TWI325643B (https=) 2010-06-01
US20090091048A1 (en) 2009-04-09

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