KR101125775B1 - 저 비용 웨이퍼 박스 개선 - Google Patents

저 비용 웨이퍼 박스 개선 Download PDF

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Publication number
KR101125775B1
KR101125775B1 KR1020067005008A KR20067005008A KR101125775B1 KR 101125775 B1 KR101125775 B1 KR 101125775B1 KR 1020067005008 A KR1020067005008 A KR 1020067005008A KR 20067005008 A KR20067005008 A KR 20067005008A KR 101125775 B1 KR101125775 B1 KR 101125775B1
Authority
KR
South Korea
Prior art keywords
container
side wall
cover
tray
semi
Prior art date
Application number
KR1020067005008A
Other languages
English (en)
Korean (ko)
Other versions
KR20070006665A (ko
Inventor
발로리스 엘. 포시스
Original Assignee
일리노이즈 툴 워크스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일리노이즈 툴 워크스 인코포레이티드 filed Critical 일리노이즈 툴 워크스 인코포레이티드
Publication of KR20070006665A publication Critical patent/KR20070006665A/ko
Application granted granted Critical
Publication of KR101125775B1 publication Critical patent/KR101125775B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
KR1020067005008A 2003-09-23 2004-05-18 저 비용 웨이퍼 박스 개선 KR101125775B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US50517503P 2003-09-23 2003-09-23
US60/505,175 2003-09-23
US51586903P 2003-10-29 2003-10-29
US60/515,869 2003-10-29
PCT/US2004/015480 WO2005044695A1 (fr) 2003-09-23 2004-05-18 Boite de plaquettes amelioree bon marche

Publications (2)

Publication Number Publication Date
KR20070006665A KR20070006665A (ko) 2007-01-11
KR101125775B1 true KR101125775B1 (ko) 2012-03-28

Family

ID=34572862

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067005008A KR101125775B1 (ko) 2003-09-23 2004-05-18 저 비용 웨이퍼 박스 개선

Country Status (5)

Country Link
EP (1) EP1685038A4 (fr)
JP (1) JP4335921B2 (fr)
KR (1) KR101125775B1 (fr)
CN (1) CN1845860B (fr)
WO (1) WO2005044695A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005050156A1 (de) * 2005-10-19 2007-04-26 Manfred Jacob Kunststofftechnik Gmbh Verpackung für elektronische Bauteile, insbesondere für Tape-N-Reel-Spulen
KR20100080503A (ko) 2007-10-12 2010-07-08 피크 플라스틱 앤 메탈 프로덕츠 (인터내셔널) 리미티드 엇물림형 벽 구조물을 포함하는 웨이퍼 컨테이너
CN101459099B (zh) * 2007-12-13 2010-11-10 中芯国际集成电路制造(上海)有限公司 晶圆盒、半导体生产过程的监测系统和方法
CN101752281B (zh) * 2008-12-02 2013-02-13 家登精密工业股份有限公司 晶片承载装置的承载盒
US8813964B2 (en) 2009-08-26 2014-08-26 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with recessed latch
US8109390B2 (en) 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure
US8556079B2 (en) 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
DE102010018668B4 (de) * 2010-04-07 2012-11-15 Curamik Electronics Gmbh Verpackungseinheit für Metall-Keramik-Substrate
TW201233602A (en) * 2010-10-29 2012-08-16 Entegris Inc Substrate shipper
WO2013017124A1 (fr) * 2011-07-29 2013-02-07 Curamik Electronics Gmbh Emballage pour substrats et unité d'emballage comportant un tel emballage
CN102717982A (zh) * 2012-07-02 2012-10-10 深圳市华星光电技术有限公司 一种液晶玻璃的包装装置
KR102425700B1 (ko) * 2019-06-10 2022-07-28 삼성에스디아이 주식회사 이차전지 포장용 트레이

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5305878A (en) * 1993-04-01 1994-04-26 Yen Yung Tsai Packaged optical pellicle
US5441150A (en) * 1992-09-03 1995-08-15 Ma Laboratories, Inc. Memory module container
US6321911B1 (en) * 2000-01-31 2001-11-27 Display Pack, Inc. Fragility package

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256975A (en) * 1963-11-29 1966-06-21 Leaming Ind Inc Container
US3482682A (en) * 1968-10-02 1969-12-09 Monsanto Co Retaining trays for semiconductor wafers and the like
US3710975A (en) * 1971-09-20 1973-01-16 Pantasote Co Of New York Inc Trays for photographic slides
US4697701A (en) * 1986-05-30 1987-10-06 Inko Industrial Corporation Dust free storage container for a membrane assembly such as a pellicle and its method of use
JP3711778B2 (ja) * 1998-09-18 2005-11-02 セイコーエプソン株式会社 梱包方法及び梱包物
US7059475B2 (en) * 2001-10-04 2006-06-13 Entegris, Inc. System for cushioning wafer in wafer carrier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441150A (en) * 1992-09-03 1995-08-15 Ma Laboratories, Inc. Memory module container
US5305878A (en) * 1993-04-01 1994-04-26 Yen Yung Tsai Packaged optical pellicle
US6321911B1 (en) * 2000-01-31 2001-11-27 Display Pack, Inc. Fragility package

Also Published As

Publication number Publication date
CN1845860A (zh) 2006-10-11
EP1685038A4 (fr) 2008-11-26
WO2005044695A1 (fr) 2005-05-19
WO2005044695A8 (fr) 2006-06-01
EP1685038A1 (fr) 2006-08-02
JP4335921B2 (ja) 2009-09-30
KR20070006665A (ko) 2007-01-11
CN1845860B (zh) 2011-01-19
JP2007505798A (ja) 2007-03-15

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E701 Decision to grant or registration of patent right
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