EP1685038A1 - Boite de plaquettes amelioree bon marche - Google Patents

Boite de plaquettes amelioree bon marche

Info

Publication number
EP1685038A1
EP1685038A1 EP04752489A EP04752489A EP1685038A1 EP 1685038 A1 EP1685038 A1 EP 1685038A1 EP 04752489 A EP04752489 A EP 04752489A EP 04752489 A EP04752489 A EP 04752489A EP 1685038 A1 EP1685038 A1 EP 1685038A1
Authority
EP
European Patent Office
Prior art keywords
container
side walls
semiconductor wafers
cover
tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04752489A
Other languages
German (de)
English (en)
Other versions
EP1685038A4 (fr
Inventor
Valoris L. Forsyth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of EP1685038A1 publication Critical patent/EP1685038A1/fr
Publication of EP1685038A4 publication Critical patent/EP1685038A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

L'invention concerne une boîte de plaquettes comprenant un plateau (10) et un couvercle (62). Ledit plateau (10) comprend une configuration de parois intérieures (34, 36, 38, 40) et extérieures (24, 26, 28, 30), des canaux horizontaux (48, 50, 52, 54) semi-circulaires étant disposés entre lesdites parois afin de fournie un espacement, un renforcement et des fonctions d'absorption de choc horizontal. Le plateau comprend (10) également une cavité de plaquette (42) formée dans la paroi intérieure (34, 36, 38, 40). Cette cavité de plaquette (42) comprend un treillis (46) de nervures disposées sur le fond de ladite cavité afin de fournir une fonction d'absorption de choc vertical. La paroi (76, 78, 80, 82) du couvercle (62) coopère et correspond avec la paroi extérieure (24, 26, 28, 30) du plateau (10) formant ainsi une configuration à paroi double. Une configuration de piédestal (90, 92) est formée sur les coins et les éléments médians de la partie supérieure du couvercle (62) afin de fournir un espace d'écartement entre les boîtes empilées et de limiter ou de supprimer la transmission d'un choc ou d'une vibration à travers une configuration d'empilement.
EP04752489A 2003-09-23 2004-05-18 Boite de plaquettes amelioree bon marche Withdrawn EP1685038A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50517503P 2003-09-23 2003-09-23
US51586903P 2003-10-29 2003-10-29
PCT/US2004/015480 WO2005044695A1 (fr) 2003-09-23 2004-05-18 Boite de plaquettes amelioree bon marche

Publications (2)

Publication Number Publication Date
EP1685038A1 true EP1685038A1 (fr) 2006-08-02
EP1685038A4 EP1685038A4 (fr) 2008-11-26

Family

ID=34572862

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04752489A Withdrawn EP1685038A4 (fr) 2003-09-23 2004-05-18 Boite de plaquettes amelioree bon marche

Country Status (5)

Country Link
EP (1) EP1685038A4 (fr)
JP (1) JP4335921B2 (fr)
KR (1) KR101125775B1 (fr)
CN (1) CN1845860B (fr)
WO (1) WO2005044695A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005050156A1 (de) * 2005-10-19 2007-04-26 Manfred Jacob Kunststofftechnik Gmbh Verpackung für elektronische Bauteile, insbesondere für Tape-N-Reel-Spulen
KR20100080503A (ko) 2007-10-12 2010-07-08 피크 플라스틱 앤 메탈 프로덕츠 (인터내셔널) 리미티드 엇물림형 벽 구조물을 포함하는 웨이퍼 컨테이너
CN101459099B (zh) * 2007-12-13 2010-11-10 中芯国际集成电路制造(上海)有限公司 晶圆盒、半导体生产过程的监测系统和方法
CN101752281B (zh) * 2008-12-02 2013-02-13 家登精密工业股份有限公司 晶片承载装置的承载盒
US8109390B2 (en) 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure
US8813964B2 (en) 2009-08-26 2014-08-26 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with recessed latch
US8556079B2 (en) 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
DE102010018668B4 (de) * 2010-04-07 2012-11-15 Curamik Electronics Gmbh Verpackungseinheit für Metall-Keramik-Substrate
WO2012058678A2 (fr) * 2010-10-29 2012-05-03 Entegris, Inc. Conteneur de transport de substrat
US9054143B2 (en) * 2011-07-29 2015-06-09 Rogers Germany Gmbh Packaging for substrates and packaging unit having such packaging
CN102717982A (zh) * 2012-07-02 2012-10-10 深圳市华星光电技术有限公司 一种液晶玻璃的包装装置
KR102425700B1 (ko) * 2019-06-10 2022-07-28 삼성에스디아이 주식회사 이차전지 포장용 트레이

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003029113A2 (fr) * 2001-10-04 2003-04-10 Entegris, Inc. Systeme assurant l'amortissement de plaquettes dans un porte-plaquettes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256975A (en) * 1963-11-29 1966-06-21 Leaming Ind Inc Container
US3482682A (en) * 1968-10-02 1969-12-09 Monsanto Co Retaining trays for semiconductor wafers and the like
US3710975A (en) * 1971-09-20 1973-01-16 Pantasote Co Of New York Inc Trays for photographic slides
US4697701A (en) * 1986-05-30 1987-10-06 Inko Industrial Corporation Dust free storage container for a membrane assembly such as a pellicle and its method of use
US5441150A (en) * 1992-09-03 1995-08-15 Ma Laboratories, Inc. Memory module container
US5305878A (en) * 1993-04-01 1994-04-26 Yen Yung Tsai Packaged optical pellicle
JP3711778B2 (ja) * 1998-09-18 2005-11-02 セイコーエプソン株式会社 梱包方法及び梱包物
US6321911B1 (en) * 2000-01-31 2001-11-27 Display Pack, Inc. Fragility package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003029113A2 (fr) * 2001-10-04 2003-04-10 Entegris, Inc. Systeme assurant l'amortissement de plaquettes dans un porte-plaquettes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005044695A1 *

Also Published As

Publication number Publication date
CN1845860A (zh) 2006-10-11
JP4335921B2 (ja) 2009-09-30
KR101125775B1 (ko) 2012-03-28
WO2005044695A1 (fr) 2005-05-19
WO2005044695A8 (fr) 2006-06-01
EP1685038A4 (fr) 2008-11-26
CN1845860B (zh) 2011-01-19
KR20070006665A (ko) 2007-01-11
JP2007505798A (ja) 2007-03-15

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20060317

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20081024

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/68 20060101AFI20081020BHEP

Ipc: B65D 85/30 20060101ALI20081020BHEP

Ipc: B65D 21/00 20060101ALI20081020BHEP

Ipc: B65D 85/48 20060101ALI20081020BHEP

17Q First examination report despatched

Effective date: 20101020

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20110301