KR101114318B1 - 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법 - Google Patents

박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법 Download PDF

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KR101114318B1
KR101114318B1 KR1020090033138A KR20090033138A KR101114318B1 KR 101114318 B1 KR101114318 B1 KR 101114318B1 KR 1020090033138 A KR1020090033138 A KR 1020090033138A KR 20090033138 A KR20090033138 A KR 20090033138A KR 101114318 B1 KR101114318 B1 KR 101114318B1
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KR
South Korea
Prior art keywords
printed circuit
circuit board
epoxy resin
resin composition
peel strength
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KR1020090033138A
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English (en)
Korean (ko)
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KR20100114655A (ko
Inventor
이화영
오준록
임성택
박문수
조재춘
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삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020090033138A priority Critical patent/KR101114318B1/ko
Priority to JP2009285549A priority patent/JP2010251700A/ja
Priority to CN2009102613837A priority patent/CN101864151B/zh
Publication of KR20100114655A publication Critical patent/KR20100114655A/ko
Application granted granted Critical
Publication of KR101114318B1 publication Critical patent/KR101114318B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020090033138A 2009-04-16 2009-04-16 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법 KR101114318B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020090033138A KR101114318B1 (ko) 2009-04-16 2009-04-16 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법
JP2009285549A JP2010251700A (ja) 2009-04-16 2009-12-16 剥離強度が強化された印刷回路基板用難燃性樹脂組成物、これを用いた印刷回路基板およびその製造方法
CN2009102613837A CN101864151B (zh) 2009-04-16 2009-12-23 用于高剥离强化印刷电路板的阻燃树脂组合物、利用其的印刷电路板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090033138A KR101114318B1 (ko) 2009-04-16 2009-04-16 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법

Publications (2)

Publication Number Publication Date
KR20100114655A KR20100114655A (ko) 2010-10-26
KR101114318B1 true KR101114318B1 (ko) 2012-03-14

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Application Number Title Priority Date Filing Date
KR1020090033138A KR101114318B1 (ko) 2009-04-16 2009-04-16 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법

Country Status (3)

Country Link
JP (1) JP2010251700A (ja)
KR (1) KR101114318B1 (ja)
CN (1) CN101864151B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8840967B2 (en) 2006-10-11 2014-09-23 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing printed circuit board including flame retardant insulation layer
KR20120046492A (ko) * 2010-11-02 2012-05-10 삼성전기주식회사 광감응성 조성물 및 이를 포함하는 빌드업 절연 필름, 그리고 상기 빌드업 절연 필름을 이용한 회로기판의 제조 방법
KR101228734B1 (ko) * 2010-11-05 2013-02-01 삼성전기주식회사 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판
JP5412550B2 (ja) * 2011-09-16 2014-02-12 サムソン エレクトロ−メカニックス カンパニーリミテッド． 印刷回路基板の製造方法
KR101339510B1 (ko) * 2011-10-20 2013-12-10 삼성전기주식회사 인쇄회로기판용 수지조성물 및 이를 포함하는 인쇄회로기판
CN103045143A (zh) * 2012-11-14 2013-04-17 浙江华正新材料股份有限公司 无卤环氧胶粘剂及使用其制备的覆盖膜
KR20140086294A (ko) * 2012-12-28 2014-07-08 삼성전기주식회사 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판
CN103102711A (zh) * 2013-01-28 2013-05-15 广东生益科技股份有限公司 一种改善pn固化板材孔铜分离的方法
CN104626331A (zh) * 2013-11-06 2015-05-20 哈尔滨隆迪建材有限公司 一种环保装饰板材及其生产方法
CN104448693B (zh) * 2014-11-20 2020-04-10 徐东 环氧树脂组合物及其制备方法、应用
CN105498148B (zh) * 2015-12-28 2018-10-23 广州市优伟家居用品有限公司 一种瑜伽垫及其制造方法
US20190345325A1 (en) * 2018-05-11 2019-11-14 Samsung Electronics Co., Ltd. Resin composition for printed circuit board and integrated circuit package, and product using the same
KR102048320B1 (ko) * 2018-05-11 2020-01-08 삼성전자주식회사 인쇄회로기판 및 ic 패키지용 수지 조성물, 및 이를 이용한 제품
US20190345323A1 (en) * 2018-05-11 2019-11-14 Samsung Electronics Co., Ltd. Resin composition for printed circuit board and integrated circuit package, and product using the same
CN115488986B (zh) * 2022-09-26 2023-07-21 徐州安联木业有限公司 一种阻燃防水型可回收环保板材

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KR100771331B1 (ko) * 2006-05-16 2007-10-29 삼성전기주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄회로기판

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Publication number Publication date
CN101864151B (zh) 2013-03-13
JP2010251700A (ja) 2010-11-04
CN101864151A (zh) 2010-10-20
KR20100114655A (ko) 2010-10-26

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