KR101061912B1 - 기판 세정 장치, 기판 세정 방법 및 기억 매체 - Google Patents

기판 세정 장치, 기판 세정 방법 및 기억 매체 Download PDF

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Publication number
KR101061912B1
KR101061912B1 KR1020070134132A KR20070134132A KR101061912B1 KR 101061912 B1 KR101061912 B1 KR 101061912B1 KR 1020070134132 A KR1020070134132 A KR 1020070134132A KR 20070134132 A KR20070134132 A KR 20070134132A KR 101061912 B1 KR101061912 B1 KR 101061912B1
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KR
South Korea
Prior art keywords
substrate
cleaning
back surface
holding means
wafer
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KR1020070134132A
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English (en)
Korean (ko)
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KR20080058223A (ko
Inventor
야스시 다키구치
다로 야마모토
아키히로 후지모토
슈우이치 니시키도
다이 구마가이
나오토 요시타카
다카히로 기타노
요이치 도쿠나가
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20080058223A publication Critical patent/KR20080058223A/ko
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Publication of KR101061912B1 publication Critical patent/KR101061912B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020070134132A 2006-12-20 2007-12-20 기판 세정 장치, 기판 세정 방법 및 기억 매체 Active KR101061912B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00343309 2006-12-20
JP2006343309 2006-12-20
JPJP-P-2007-00303453 2007-11-22
JP2007303453A JP4983565B2 (ja) 2006-12-20 2007-11-22 基板洗浄装置、基板洗浄方法及び記憶媒体

Publications (2)

Publication Number Publication Date
KR20080058223A KR20080058223A (ko) 2008-06-25
KR101061912B1 true KR101061912B1 (ko) 2011-09-02

Family

ID=39567093

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070134132A Active KR101061912B1 (ko) 2006-12-20 2007-12-20 기판 세정 장치, 기판 세정 방법 및 기억 매체

Country Status (4)

Country Link
JP (3) JP4983565B2 (enExample)
KR (1) KR101061912B1 (enExample)
CN (1) CN100580871C (enExample)
TW (2) TWI390589B (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058085B2 (ja) * 2008-07-02 2012-10-24 東京エレクトロン株式会社 基板洗浄装置
JP5084656B2 (ja) * 2008-07-29 2012-11-28 東京エレクトロン株式会社 現像処理方法及び現像処理装置
CN101447415A (zh) * 2008-12-19 2009-06-03 上海集成电路研发中心有限公司 半导体硅片清洗装置及其清洗方法
JP5349944B2 (ja) * 2008-12-24 2013-11-20 株式会社荏原製作所 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法
JP5254120B2 (ja) * 2009-04-22 2013-08-07 東京エレクトロン株式会社 液処理装置および液処理方法
JP2010287686A (ja) * 2009-06-10 2010-12-24 Tokyo Electron Ltd 塗布、現像装置及び基板の裏面洗浄方法。
CN102211095B (zh) * 2010-04-02 2013-11-06 中芯国际集成电路制造(上海)有限公司 一种晶片清洗方法
JP5397399B2 (ja) * 2010-07-09 2014-01-22 東京エレクトロン株式会社 塗布、現像装置
CN102357477B (zh) * 2011-09-23 2013-10-02 北京七星华创电子股份有限公司 防污染装置
JP5637974B2 (ja) * 2011-11-28 2014-12-10 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
CN103506339B (zh) * 2012-06-28 2017-04-19 盛美半导体设备（上海）有限公司 晶圆背面清洗装置及清洗方法
CN102779772A (zh) * 2012-07-16 2012-11-14 北京七星华创电子股份有限公司 晶片背面清洗装置
JP5887227B2 (ja) * 2012-08-07 2016-03-16 株式会社荏原製作所 ドレッサーディスク洗浄用ブラシ、洗浄装置及び洗浄方法
JP6001961B2 (ja) 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP5973901B2 (ja) * 2012-12-13 2016-08-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP6415662B2 (ja) * 2013-11-13 2018-10-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6210935B2 (ja) 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP6442582B2 (ja) * 2014-03-05 2018-12-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP2016051727A (ja) * 2014-08-28 2016-04-11 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
JP6386424B2 (ja) 2015-08-06 2018-09-05 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6671459B2 (ja) * 2016-03-22 2020-03-25 東京エレクトロン株式会社 基板洗浄装置
JP6740066B2 (ja) * 2016-09-13 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置および基板洗浄方法
JP6783624B2 (ja) * 2016-10-27 2020-11-11 株式会社ディスコ 洗浄装置
TWI821887B (zh) * 2016-11-29 2023-11-11 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體
WO2018124211A1 (ja) * 2016-12-28 2018-07-05 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US10410936B2 (en) 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
CN109426085A (zh) * 2017-08-25 2019-03-05 台湾积体电路制造股份有限公司 用于清洁光刻设备的集光镜的装置及方法
KR102628175B1 (ko) * 2017-11-14 2024-01-23 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法
TWI865303B (zh) * 2017-12-13 2024-12-01 日商東京威力科創股份有限公司 基板處理裝置
CN109031717A (zh) * 2018-08-10 2018-12-18 昆山弘锦威电子有限公司 Tft-lcd模块的加工工艺
JP7222721B2 (ja) * 2019-01-17 2023-02-15 株式会社ディスコ 洗浄機構
CN110148573B (zh) * 2019-04-17 2020-12-04 湖州达立智能设备制造有限公司 一种半导体设备工艺腔的晶圆升降装置
CN110459493B (zh) * 2019-08-21 2022-03-22 北京北方华创微电子装备有限公司 抽真空腔室及抽真空方法
CN114401800B (zh) * 2019-09-17 2024-06-18 株式会社斯库林集团 衬底洗净装置
CN111085954A (zh) * 2019-12-24 2020-05-01 深圳市华星光电半导体显示技术有限公司 基板吸附装置
JP7504421B2 (ja) * 2020-02-28 2024-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102835055B1 (ko) * 2020-04-09 2025-07-18 주식회사 제우스 기판처리장치
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
TWI781763B (zh) * 2020-09-18 2022-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法
JP7491805B2 (ja) * 2020-10-05 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN112051679A (zh) * 2020-10-15 2020-12-08 深圳市金晓时代科技有限公司 一种液晶显示屏的制程设备及其制程工艺
JP7635572B2 (ja) 2021-02-22 2025-02-26 東京エレクトロン株式会社 基板洗浄方法及び基板洗浄装置
JP7730272B2 (ja) * 2021-07-05 2025-08-27 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP7740832B2 (ja) * 2021-11-18 2025-09-17 東京エレクトロン株式会社 加工装置、及び加工方法
US11688600B1 (en) * 2021-12-03 2023-06-27 Pulseforge, Inc. Method and apparatus for removing particles from the surface of a semiconductor wafer
CN117497401A (zh) * 2024-01-02 2024-02-02 宁波润华全芯微电子设备有限公司 一种晶圆背面清洗方法和装置
CN119517833A (zh) * 2025-01-21 2025-02-25 苏州芯慧联半导体科技有限公司 一种基于伯努利卡盘的晶圆吸附装置
CN120741510B (zh) * 2025-09-04 2025-10-31 柯尔微电子装备(厦门)有限公司 晶圆检测设备及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100341010B1 (ko) 1997-02-28 2002-11-29 동경 엘렉트론 주식회사 기판의 양면세정방법 및 양면세정장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155622A (ja) * 1986-12-18 1988-06-28 Nec Corp 半導体基板洗浄装置
JPH04278518A (ja) * 1991-03-07 1992-10-05 Fujitsu Ltd 半導体装置の製造方法と半導体製造装置
JPH0684857A (ja) * 1992-08-31 1994-03-25 Nikon Corp 基板の洗浄方法
JPH09298181A (ja) * 1996-05-07 1997-11-18 Tokyo Ohka Kogyo Co Ltd 基板の裏面洗浄装置
JP3673329B2 (ja) * 1996-07-05 2005-07-20 大日本スクリーン製造株式会社 基板処理装置および洗浄方法
JPH11301849A (ja) * 1998-04-22 1999-11-02 Shin Etsu Handotai Co Ltd ウェーハチャック装置及びウェーハ洗浄システム
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes
JP2001332606A (ja) * 2000-05-19 2001-11-30 Nec Kyushu Ltd 半導体装置の製造装置および製造方法
JP2001343755A (ja) * 2000-06-01 2001-12-14 Nikon Corp 静電チャック保護方法及びデバイス製造方法
JP2002353183A (ja) * 2001-05-28 2002-12-06 Nisso Engineering Co Ltd ウエハ洗浄装置
JP2003068695A (ja) * 2001-08-29 2003-03-07 Hitachi Ltd 半導体集積回路装置の製造方法
JP3959612B2 (ja) * 2002-01-22 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4357943B2 (ja) * 2003-12-02 2009-11-04 エス・イー・エス株式会社 基板処理法及び基板処理装置
WO2005098919A1 (ja) * 2004-04-06 2005-10-20 Tokyo Electron Limited 基板洗浄装置、基板洗浄方法及びその方法に使用するプログラムを記録した媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100341010B1 (ko) 1997-02-28 2002-11-29 동경 엘렉트론 주식회사 기판의 양면세정방법 및 양면세정장치

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TW200841378A (en) 2008-10-16
JP5641110B2 (ja) 2014-12-17
JP4983565B2 (ja) 2012-07-25
JP2012191215A (ja) 2012-10-04
TWI390590B (zh) 2013-03-21
CN101207007A (zh) 2008-06-25
TWI390589B (zh) 2013-03-21
JP2008177541A (ja) 2008-07-31
JP5348277B2 (ja) 2013-11-20
TW201250771A (en) 2012-12-16
JP2014017499A (ja) 2014-01-30
CN100580871C (zh) 2010-01-13
KR20080058223A (ko) 2008-06-25

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