KR101050901B1 - 반경화체, 경화체, 적층체, 반경화체의 제조 방법 및 경화체의 제조 방법 - Google Patents

반경화체, 경화체, 적층체, 반경화체의 제조 방법 및 경화체의 제조 방법 Download PDF

Info

Publication number
KR101050901B1
KR101050901B1 KR1020117009164A KR20117009164A KR101050901B1 KR 101050901 B1 KR101050901 B1 KR 101050901B1 KR 1020117009164 A KR1020117009164 A KR 1020117009164A KR 20117009164 A KR20117009164 A KR 20117009164A KR 101050901 B1 KR101050901 B1 KR 101050901B1
Authority
KR
South Korea
Prior art keywords
semi
silane
hardening
hardened
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020117009164A
Other languages
English (en)
Korean (ko)
Other versions
KR20110048593A (ko
Inventor
노부히로 고또
마사루 헤이시
준노스께 무라까미
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20110048593A publication Critical patent/KR20110048593A/ko
Application granted granted Critical
Publication of KR101050901B1 publication Critical patent/KR101050901B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
KR1020117009164A 2008-09-24 2009-09-18 반경화체, 경화체, 적층체, 반경화체의 제조 방법 및 경화체의 제조 방법 Active KR101050901B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008244554 2008-09-24
JPJP-P-2008-244554 2008-09-24
PCT/JP2009/004740 WO2010035451A1 (ja) 2008-09-24 2009-09-18 半硬化体、硬化体、積層体、半硬化体の製造方法及び硬化体の製造方法

Publications (2)

Publication Number Publication Date
KR20110048593A KR20110048593A (ko) 2011-05-11
KR101050901B1 true KR101050901B1 (ko) 2011-07-20

Family

ID=42059464

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117009164A Active KR101050901B1 (ko) 2008-09-24 2009-09-18 반경화체, 경화체, 적층체, 반경화체의 제조 방법 및 경화체의 제조 방법

Country Status (6)

Country Link
US (1) US20110223383A1 (cg-RX-API-DMAC10.html)
JP (1) JP4674730B2 (cg-RX-API-DMAC10.html)
KR (1) KR101050901B1 (cg-RX-API-DMAC10.html)
CN (1) CN102164995B (cg-RX-API-DMAC10.html)
TW (1) TW201026734A (cg-RX-API-DMAC10.html)
WO (1) WO2010035451A1 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101765034B1 (ko) * 2016-04-18 2017-08-03 도맥 유한회사 탄성사용 조성물 및 이를 이용한 탄성사
WO2019004494A1 (ko) * 2017-06-28 2019-01-03 도맥 유한회사 탄성사용 조성물 및 이를 이용한 탄성사

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4911795B2 (ja) * 2008-09-01 2012-04-04 積水化学工業株式会社 積層体の製造方法
US20110244183A1 (en) * 2008-09-24 2011-10-06 Sekisui Chemical Co., Ltd. Resin composition, cured body and multilayer body
CN101967264A (zh) * 2010-08-31 2011-02-09 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
JPWO2012070387A1 (ja) * 2010-11-25 2014-05-19 旭化成イーマテリアルズ株式会社 エポキシ樹脂および樹脂組成物
JP5500090B2 (ja) * 2011-01-25 2014-05-21 コニカミノルタ株式会社 金属パターンの製造方法
US20130337229A1 (en) * 2011-02-02 2013-12-19 Sekisui Chemical Co., Ltd. Roughed cured material and laminated
JP2012211269A (ja) * 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 予備硬化物、粗化予備硬化物及び積層体
KR101433556B1 (ko) 2011-05-27 2014-08-22 아지노모토 가부시키가이샤 수지 조성물
JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
JP5857386B2 (ja) * 2011-09-02 2016-02-10 地方独立行政法人 大阪市立工業研究所 無電解めっきの前処理皮膜形成用組成物
US8404764B1 (en) * 2011-09-22 2013-03-26 Elite Material Co., Ltd. Resin composition and prepreg, laminate and circuit board thereof
JP2013082873A (ja) * 2011-09-28 2013-05-09 Sekisui Chem Co Ltd Ｂステージフィルム及び多層基板
US20140342161A1 (en) * 2011-10-18 2014-11-20 Shengyi Technology Co. Ltd. Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same
CN104053721B (zh) 2012-01-23 2016-12-21 味之素株式会社 树脂组合物
JP6343884B2 (ja) 2012-09-03 2018-06-20 味の素株式会社 硬化体、積層体、プリント配線板及び半導体装置
JP6545924B2 (ja) 2012-12-27 2019-07-17 味の素株式会社 粗化硬化体、積層体、プリント配線板及び半導体装置
CN103408904A (zh) * 2013-07-04 2013-11-27 东莞上海大学纳米技术研究院 改性纳米二氧化硅填充环氧树脂组合物、制备方法及制品
CN105408418B (zh) * 2013-09-30 2017-04-26 株式会社Lg化学 用于半导体封装物的热固性树脂组合物以及使用其的半固化片和覆金属层压板
JP2015072984A (ja) * 2013-10-02 2015-04-16 イビデン株式会社 プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ
CN103709747B (zh) * 2013-12-27 2017-01-04 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
CN103756257B (zh) * 2013-12-27 2016-01-13 广东生益科技股份有限公司 一种热固性环氧树脂组合物及其用途
CN103694642B (zh) * 2013-12-27 2015-11-25 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
JP6164113B2 (ja) 2014-02-19 2017-07-19 味の素株式会社 支持体付き樹脂シート
JP6467774B2 (ja) 2014-02-28 2019-02-13 味の素株式会社 プリント配線板の製造方法
JP6358533B2 (ja) * 2014-03-27 2018-07-18 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板
JP6656870B2 (ja) * 2015-07-10 2020-03-04 住友精化株式会社 ベンゾオキサジン樹脂組成物、その製造方法、及び該組成物の用途
JP6712402B2 (ja) * 2015-11-13 2020-06-24 味の素株式会社 被覆粒子
CN110709535A (zh) * 2017-06-01 2020-01-17 株式会社杰希优 树脂表面的多段蚀刻方法以及利用其向树脂镀覆的方法
JP2019038964A (ja) * 2017-08-28 2019-03-14 住友ベークライト株式会社 感光性樹脂組成物および電子装置
JP6919508B2 (ja) 2017-11-07 2021-08-18 味の素株式会社 樹脂組成物
JP7283274B2 (ja) 2019-07-02 2023-05-30 味の素株式会社 樹脂組成物
JP2021042295A (ja) * 2019-09-10 2021-03-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
WO2021108955A1 (zh) * 2019-12-02 2021-06-10 中国科学院深圳先进技术研究院 一种高频低损耗绝缘胶膜材料及其制备方法
CN114650719B (zh) * 2021-02-09 2025-07-18 广州方邦电子股份有限公司 电磁屏蔽膜及线路板
JP7698837B2 (ja) * 2021-03-30 2025-06-26 三井化学株式会社 無電解めっき用プライマー組成物、それを用いた積層体およびその製造方法
CN113831875B (zh) * 2021-09-18 2024-01-09 深圳市纽菲斯新材料科技有限公司 一种绝缘胶膜及其制备方法和应用
CN116217997B (zh) * 2022-12-09 2026-05-19 苏州巨峰电气绝缘系统股份有限公司 一种半固化玻璃布绑扎带及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032424A1 (ja) * 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. 樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板、および多層積層板
JP2008074929A (ja) * 2006-09-20 2008-04-03 Matsushita Electric Works Ltd 難燃性エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225951A (ja) * 1995-02-16 1996-09-03 Hitachi Cable Ltd 熱硬化性樹脂のめっき方法
JP2000313963A (ja) * 1999-04-28 2000-11-14 Sumitomo Metal Ind Ltd 樹脂のめっき方法
JP4729777B2 (ja) * 2000-09-13 2011-07-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2003318499A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Works Ltd 内層回路用プリプレグ、内層回路用金属張積層板及び多層プリント配線板
TWI281924B (en) * 2003-04-07 2007-06-01 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
JP2004307650A (ja) * 2003-04-07 2004-11-04 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
US20070295607A1 (en) * 2005-11-29 2007-12-27 Ajinomoto Co. Inc Resin composition for interlayer insulating layer of multi-layer printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032424A1 (ja) * 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. 樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板、および多層積層板
JP2008074929A (ja) * 2006-09-20 2008-04-03 Matsushita Electric Works Ltd 難燃性エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101765034B1 (ko) * 2016-04-18 2017-08-03 도맥 유한회사 탄성사용 조성물 및 이를 이용한 탄성사
WO2019004494A1 (ko) * 2017-06-28 2019-01-03 도맥 유한회사 탄성사용 조성물 및 이를 이용한 탄성사

Also Published As

Publication number Publication date
KR20110048593A (ko) 2011-05-11
JPWO2010035451A1 (ja) 2012-02-16
WO2010035451A1 (ja) 2010-04-01
CN102164995B (zh) 2013-09-04
TW201026734A (en) 2010-07-16
TWI363071B (cg-RX-API-DMAC10.html) 2012-05-01
JP4674730B2 (ja) 2011-04-20
US20110223383A1 (en) 2011-09-15
CN102164995A (zh) 2011-08-24

Similar Documents

Publication Publication Date Title
KR20110048593A (ko) 반경화체, 경화체, 적층체, 반경화체의 제조 방법 및 경화체의 제조 방법
KR101051873B1 (ko) 경화체 및 적층체
KR101383434B1 (ko) 에폭시 수지 조성물, 프리프레그, 경화체, 시트상 성형체, 적층판 및 다층 적층판
KR101184842B1 (ko) 수지 조성물, 시트형 성형체, 프리프레그, 경화체, 적층판및 다층 적층판
JP2010100803A (ja) エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP5363841B2 (ja) エポキシ系樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板および多層積層板
JP2010229227A (ja) エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体及び積層板
JP4938910B1 (ja) 予備硬化物、粗化予備硬化物及び積層体
JP2010053334A (ja) エポキシ系樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP2010083966A (ja) 樹脂組成物、硬化体及び積層体
JP2010215858A (ja) エポキシ樹脂組成物、シート状成形体、積層板、プリプレグ、硬化体及び多層積層板
JP2010229313A (ja) エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP2012211269A (ja) 予備硬化物、粗化予備硬化物及び積層体
JP2010083965A (ja) 樹脂組成物、硬化体及び積層体
JP2010222391A (ja) エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP2013075440A (ja) 積層体の製造方法及び積層構造体
JP2010229226A (ja) エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体及び積層板
JP2010265415A (ja) エポキシ樹脂組成物及び積層体

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140626

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150618

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160617

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180619

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20190619

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 15