KR101045156B1 - 기판 어닐링 장치용 차열판 - Google Patents
기판 어닐링 장치용 차열판 Download PDFInfo
- Publication number
- KR101045156B1 KR101045156B1 KR1020087021400A KR20087021400A KR101045156B1 KR 101045156 B1 KR101045156 B1 KR 101045156B1 KR 1020087021400 A KR1020087021400 A KR 1020087021400A KR 20087021400 A KR20087021400 A KR 20087021400A KR 101045156 B1 KR101045156 B1 KR 101045156B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- substrate
- shield plate
- heat shield
- heat insulating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 238000000137 annealing Methods 0.000 title claims abstract description 15
- 239000002131 composite material Substances 0.000 claims abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims description 27
- 239000003575 carbonaceous material Substances 0.000 claims description 8
- 239000002759 woven fabric Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 9
- 239000000835 fiber Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001293 incoloy Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Furnace Details (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
Abstract
Description
Claims (4)
- 수평으로 지지된 평판상의 기판과, 상기 기판의 상방에 위치해 기판 상면을 복사열로 가열하는 히터와, 기판과 히터 사이를 차폐하는 차폐 위치와 그 사이에서 떨어진 개방 위치 사이를 수평 이동 가능한 차열판을 갖는 기판 어닐링 장치용 차열판으로서,상기 차열판은 상기 차폐 위치에서의 온도차에 의해 변형하지 않는 저열 팽창재로 구성된 구조 부재와, 상기 구조 부재의 상면을 덮어 이것을 허용 온도 이하로 유지하는 단열 부재를 구비하는 것을 특징으로 하는 기판 어닐링 장치용 차열판.
- 제1항에 있어서,상기 구조 부재는 복합 탄소 재료(카본 컴퍼짓(carbon composite)재)를 구비하는 것을 특징으로 하는 기판 어닐링 장치용 차열판.
- 제1항에 있어서,상기 구조 부재는 상기 차열판에 필요한 휨강성을 갖는 복수의 수평으로 연장되는 들보 부재와,상기 차열판의 하면을 구성하는 바닥판과,상기 들보 부재와 상기 바닥판을 연결하는 접속 부품을 갖는 것을 특징으로 하는 기판 어닐링 장치용 차열판.
- 제1항에 있어서,상기 단열 부재는 내열성 직포로 이루어지는 주머니 형상의 외측 단열재와, 상기 외측 단열재의 내측에 밀봉된 섬유상의 내측 단열재를 포함하는 것을 특징으로 하는 기판 어닐링 장치용 차열판.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00072201 | 2006-03-16 | ||
JP2006072201A JP5120585B2 (ja) | 2006-03-16 | 2006-03-16 | 基板アニール装置用の遮熱板 |
PCT/JP2007/055236 WO2007105798A1 (ja) | 2006-03-16 | 2007-03-15 | 基板アニール装置用の遮熱板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080113025A KR20080113025A (ko) | 2008-12-26 |
KR101045156B1 true KR101045156B1 (ko) | 2011-07-01 |
Family
ID=38509611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087021400A KR101045156B1 (ko) | 2006-03-16 | 2007-03-15 | 기판 어닐링 장치용 차열판 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8118591B2 (ko) |
JP (1) | JP5120585B2 (ko) |
KR (1) | KR101045156B1 (ko) |
CN (1) | CN101405841B (ko) |
WO (1) | WO2007105798A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104328251A (zh) * | 2013-07-22 | 2015-02-04 | 宝钢新日铁汽车板有限公司 | 一种退火炉隔热板装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007054526A1 (de) | 2007-11-07 | 2009-05-14 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Wärmetransferelement und Anlage zur thermischen Behandlung von Substraten |
JP5612259B2 (ja) * | 2008-11-05 | 2014-10-22 | 大日本スクリーン製造株式会社 | 熱処理装置 |
US8753447B2 (en) * | 2009-06-10 | 2014-06-17 | Novellus Systems, Inc. | Heat shield for heater in semiconductor processing apparatus |
JP2016121380A (ja) | 2014-12-25 | 2016-07-07 | 株式会社神戸製鋼所 | 熱処理装置 |
US10535538B2 (en) * | 2017-01-26 | 2020-01-14 | Gary Hillman | System and method for heat treatment of substrates |
KR102359376B1 (ko) * | 2020-06-03 | 2022-02-08 | 한국고요써모시스템(주) | 기판의 열처리 오븐 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002324764A (ja) | 2001-04-24 | 2002-11-08 | Dainippon Screen Mfg Co Ltd | 基板の熱処理装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4481406A (en) * | 1983-01-21 | 1984-11-06 | Varian Associates, Inc. | Heater assembly for thermal processing of a semiconductor wafer in a vacuum chamber |
JP3380988B2 (ja) * | 1993-04-21 | 2003-02-24 | 東京エレクトロン株式会社 | 熱処理装置 |
US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US5837555A (en) * | 1996-04-12 | 1998-11-17 | Ast Electronik | Apparatus and method for rapid thermal processing |
US5960158A (en) * | 1997-07-11 | 1999-09-28 | Ag Associates | Apparatus and method for filtering light in a thermal processing chamber |
JP4361636B2 (ja) * | 1999-05-26 | 2009-11-11 | 株式会社クレハ | 複合炭素質断熱材及びその製造方法 |
US6450805B1 (en) * | 1999-08-11 | 2002-09-17 | Tokyo Electron Limited | Hot plate cooling method and heat processing apparatus |
JP3595875B2 (ja) * | 2000-03-14 | 2004-12-02 | 光洋サーモシステム株式会社 | 半導体処理装置用電気ヒータ |
JP2003282470A (ja) * | 2002-03-26 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板の熱処理装置 |
JP2004075410A (ja) * | 2002-08-12 | 2004-03-11 | Ishikawajima Harima Heavy Ind Co Ltd | 保護層を有するセラミックス基複合材料とその製造方法 |
JP2004221138A (ja) * | 2003-01-09 | 2004-08-05 | Mitsui Eng & Shipbuild Co Ltd | 半導体熱処理方法および装置 |
JP4542792B2 (ja) * | 2004-01-26 | 2010-09-15 | 財団法人ファインセラミックスセンター | 耐酸化材料及び非酸化物系複合材料 |
CN101813846B (zh) * | 2009-02-20 | 2011-08-10 | 北京京东方光电科技有限公司 | 硬化设备和液晶显示面板的制造方法 |
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2006
- 2006-03-16 JP JP2006072201A patent/JP5120585B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-15 CN CN2007800093432A patent/CN101405841B/zh not_active Expired - Fee Related
- 2007-03-15 WO PCT/JP2007/055236 patent/WO2007105798A1/ja active Application Filing
- 2007-03-15 KR KR1020087021400A patent/KR101045156B1/ko active IP Right Grant
- 2007-03-15 US US12/280,811 patent/US8118591B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002324764A (ja) | 2001-04-24 | 2002-11-08 | Dainippon Screen Mfg Co Ltd | 基板の熱処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104328251A (zh) * | 2013-07-22 | 2015-02-04 | 宝钢新日铁汽车板有限公司 | 一种退火炉隔热板装置 |
Also Published As
Publication number | Publication date |
---|---|
US8118591B2 (en) | 2012-02-21 |
KR20080113025A (ko) | 2008-12-26 |
WO2007105798A1 (ja) | 2007-09-20 |
CN101405841B (zh) | 2011-05-04 |
JP5120585B2 (ja) | 2013-01-16 |
US20090029308A1 (en) | 2009-01-29 |
JP2007250819A (ja) | 2007-09-27 |
CN101405841A (zh) | 2009-04-08 |
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