KR101013110B1 - 피검사기판의 얼라인먼트 장치 - Google Patents

피검사기판의 얼라인먼트 장치 Download PDF

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Publication number
KR101013110B1
KR101013110B1 KR1020090090814A KR20090090814A KR101013110B1 KR 101013110 B1 KR101013110 B1 KR 101013110B1 KR 1020090090814 A KR1020090090814 A KR 1020090090814A KR 20090090814 A KR20090090814 A KR 20090090814A KR 101013110 B1 KR101013110 B1 KR 101013110B1
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South Korea
Prior art keywords
axis
substrate
stage
axis direction
inspected
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English (en)
Korean (ko)
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KR20100055321A (ko
Inventor
타카요시 쿠도
타카유키 코모리
사토루 이마무라
준 시라토
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가부시키가이샤 니혼 마이크로닉스
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Publication of KR20100055321A publication Critical patent/KR20100055321A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Optics & Photonics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Automatic Assembly (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020090090814A 2008-11-17 2009-09-25 피검사기판의 얼라인먼트 장치 Active KR101013110B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-293669 2008-11-17
JP2008293669A JP5300431B2 (ja) 2008-11-17 2008-11-17 被検査基板のアライメント装置

Publications (2)

Publication Number Publication Date
KR20100055321A KR20100055321A (ko) 2010-05-26
KR101013110B1 true KR101013110B1 (ko) 2011-02-14

Family

ID=42279817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090090814A Active KR101013110B1 (ko) 2008-11-17 2009-09-25 피검사기판의 얼라인먼트 장치

Country Status (4)

Country Link
JP (1) JP5300431B2 (https=)
KR (1) KR101013110B1 (https=)
CN (1) CN101739923B (https=)
TW (1) TWI396246B (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416144B (zh) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
KR101155961B1 (ko) * 2011-11-17 2012-06-18 에스엔티코리아 주식회사 컨베이어가 1축을 대체한 2축 구동 검사장치
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
KR101616564B1 (ko) * 2014-09-24 2016-04-29 주식회사 디이엔티 프로브 이동장치
CN104459439B (zh) * 2014-12-08 2019-02-19 昆山精讯电子技术有限公司 触摸屏的自动检测设备
CN106370656B (zh) * 2015-07-23 2019-03-05 旭东机械工业股份有限公司 自动化显微取像设备及取像方法
CN108780122B (zh) 2015-12-28 2019-09-03 塞莱敦系统股份有限公司 用于受测试器件的模块化轨道系统、轨道系统、机构以及设备
US10324112B2 (en) * 2016-08-11 2019-06-18 Intel Corporation Package testing system and method with contact alignment
CN106249449B (zh) * 2016-08-29 2019-07-23 武汉华星光电技术有限公司 防夹碎基板对位装置
CN108242410B (zh) * 2018-01-04 2020-05-19 苏州德睿联自动化科技有限公司 电池串检测校正装置及方法
WO2019163288A1 (ja) * 2018-02-26 2019-08-29 ヤマハファインテック株式会社 位置決め装置及び位置決め方法
JP6956030B2 (ja) * 2018-02-28 2021-10-27 東京エレクトロン株式会社 検査システム
US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
IT201800010440A1 (it) * 2018-11-20 2020-05-20 Nuova Sima Spa Dispositivo di raddrizzamento per raddrizzare un articolo lastriforme rispetto ad una direzione di movimentazione
CN110320686B (zh) * 2019-07-15 2023-07-25 中导光电设备股份有限公司 Uled屏幕基板检测/测量设备的预对位装置及其使用方法
CN111999919B (zh) * 2020-08-31 2023-05-05 晟光科技股份有限公司 一种lcd显示屏定位检测机构
CN112720384B (zh) * 2020-12-21 2022-08-26 苏州科韵激光科技有限公司 显示面板对准装置和显示面板对准方法
KR102591202B1 (ko) * 2021-03-26 2023-10-19 (주)지엠더블유 자동 위치설정 기능을 구비한 무선기기 검사장치
CN114536480B (zh) * 2022-03-02 2023-05-23 重庆天荣日盛家居科技有限公司 多工位木质家居板材切割设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990016830A (ko) * 1997-08-20 1999-03-15 윤종용 액정 표시판의 위치 결정 장치
KR20040008966A (ko) * 2002-07-20 2004-01-31 주식회사 탑 엔지니어링 액정토출장치 및 토출방법
JP2008122145A (ja) 2006-11-09 2008-05-29 Micronics Japan Co Ltd プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817194B2 (ja) * 1987-09-29 1996-02-21 東京エレクトロン株式会社 液晶表示体プローブ装置及び液晶表示体の位置合わせ方法
JPH11304884A (ja) * 1998-04-24 1999-11-05 Micronics Japan Co Ltd 大型回路板用プローバ
JP2001050858A (ja) * 1999-08-04 2001-02-23 Micronics Japan Co Ltd 表示用パネル基板の検査装置
KR20010109212A (ko) * 2000-05-31 2001-12-08 시마무라 테루오 평가방법, 위치검출방법, 노광방법 및 디바이스 제조방법,및 노광장치
KR100960472B1 (ko) * 2003-12-16 2010-05-28 엘지디스플레이 주식회사 액정 표시패널의 제조장치 및 그 제조방법
JP4715749B2 (ja) * 2004-08-19 2011-07-06 株式会社ニコン アライメント情報表示方法とそのプログラム、アライメント方法、露光方法、デバイス製造方法、表示システム、表示装置
JP4395429B2 (ja) * 2004-10-20 2010-01-06 日本発條株式会社 コンタクトユニットおよびコンタクトユニットを用いた検査システム
JP2006245174A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd 位置決めステージ、パターン形成装置、検査装置、位置補正方法、基板支持部
JP2006240015A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd パターン形成装置、アライメント装置、基板処理装置、パターン形成方法、基板処理方法
JP5061904B2 (ja) * 2005-10-28 2012-10-31 株式会社ニコン デバイス製造処理装置間の接続装置及び接続方法、プログラム、デバイス製造処理システム、露光装置及び露光方法、並びに測定検査装置及び測定検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990016830A (ko) * 1997-08-20 1999-03-15 윤종용 액정 표시판의 위치 결정 장치
KR20040008966A (ko) * 2002-07-20 2004-01-31 주식회사 탑 엔지니어링 액정토출장치 및 토출방법
JP2008122145A (ja) 2006-11-09 2008-05-29 Micronics Japan Co Ltd プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置

Also Published As

Publication number Publication date
KR20100055321A (ko) 2010-05-26
JP2010121969A (ja) 2010-06-03
CN101739923A (zh) 2010-06-16
CN101739923B (zh) 2012-10-03
TWI396246B (zh) 2013-05-11
TW201025477A (en) 2010-07-01
JP5300431B2 (ja) 2013-09-25

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