WO2019163288A1 - 位置決め装置及び位置決め方法 - Google Patents
位置決め装置及び位置決め方法 Download PDFInfo
- Publication number
- WO2019163288A1 WO2019163288A1 PCT/JP2018/048057 JP2018048057W WO2019163288A1 WO 2019163288 A1 WO2019163288 A1 WO 2019163288A1 JP 2018048057 W JP2018048057 W JP 2018048057W WO 2019163288 A1 WO2019163288 A1 WO 2019163288A1
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- WIPO (PCT)
- Prior art keywords
- camera
- marker
- processing unit
- reference marker
- positioning
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
- G05D3/12—Control of position or direction using feedback
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Definitions
- the present invention relates to a positioning device and a positioning method.
- an inspection device that inspects the electrical characteristics of a printed circuit board by pressing an inspection head having a plurality of probes (electrical contacts) against the printed circuit board and bringing the probe into contact with a measurement point of the printed circuit board. It is used.
- An inspection head of such an inspection apparatus has a head main body positioned by a three-dimensional moving mechanism and a plurality of probes and a plurality of probes attached to the head main body in order to inspect various printed boards. And a probe unit having a guide for positioning. That is, in the inspection apparatus, the probe unit of the inspection head is replaced according to the printed circuit board to be inspected.
- a positioning device that positions an inspection head includes a camera, images a printed circuit board by the camera, confirms the position of the printed circuit board by image processing, and positions the inspection head with respect to the substrate.
- the high definition of the printed circuit board has progressed, and it is necessary to precisely position the inspection head with respect to the printed circuit board, so that the mounting error of the probe unit to the head body cannot be ignored. Yes.
- an auxiliary camera is provided on a table that holds the printed circuit board, and an inspection head is photographed by the auxiliary camera and a jig positioning mark provided on the probe unit guide is detected.
- an inspection apparatus that recognizes the exact position of the probe unit by recognizing the position (see JP 2009-113600 A).
- the auxiliary camera is disposed on the table that holds the printed circuit board, so the apparatus configuration is complicated.
- Such a complicated apparatus configuration not only increases the cost of the apparatus, but also has a disadvantage that it is difficult to secure a space for arranging the structure for grasping the accurate position of the probe unit in a small apparatus. is there.
- an auxiliary camera that images the front inspection head guide and an auxiliary camera that images the back inspection head guide are required. It is.
- an object of the present invention is to provide a positioning device and a positioning method capable of accurately positioning a processing unit such as an inspection head with respect to a processing target such as a printed circuit board.
- the positioning device of the present invention made to solve the above-mentioned problem is a positioning device that positions a first processing unit that is a member to be positioned with respect to a processing target that is a positioning target, wherein the first processing unit A first moving mechanism that moves the first processing mechanism, a first camera that is held by the first moving mechanism and that images the object to be processed, and a second camera that images the first processing unit from a direction opposite to the first camera. And a reference marker arranged so as to appear and disappear within the photographing range of the first camera and the second camera facing each other.
- the positioning method of the present invention is a positioning method for positioning the processing unit with respect to the processing object, and includes the first camera and the second camera arranged to face the first camera. And a step of photographing a reference marker appearing in the photographing range of the second camera, a step of photographing a processing unit marker provided in the processing unit by the second camera, and the reference marker photographed by the second camera And calculating the relative position between the reference marker and the processing unit marker from the position of the processing unit marker taken by the second camera, and the calculated reference marker and the processing unit marker. Calculating a relative position between the first camera and the processing unit marker from a relative position between the first camera and the position of the reference marker photographed by the first camera.
- Photographing the processing object with the first camera recognizing the relative position of the processing object with respect to the first camera from the position of the processing object photographed with the first camera, Based on the recognized relative position of the processing object with respect to the first camera and the calculated relative position between the first camera and the processing part marker, the processing unit is positioned with respect to the processing object. And a step of performing.
- a positioning device is a positioning device that positions a first processing unit that is a member to be positioned with respect to a processing target that is a positioning target, and a first movement that moves the first processing unit.
- a first camera that is held by the first moving mechanism and that captures the object to be processed, and a second camera that captures the first processing unit from a direction opposite to the first camera.
- a reference marker arranged so as to appear and disappear within the photographing range of the first camera and the second camera.
- a positioning method is a positioning method for positioning a processing unit with respect to a processing object, and includes a first camera and a second camera arranged to face the first camera.
- the step of photographing a reference marker that appears within the photographing range of the first and second cameras, the step of photographing the processing unit marker provided in the processing unit by the second camera, and the second camera A step of calculating a relative position between the reference marker and the processing unit marker from a position of the captured reference marker and a position of the processing unit marker captured by the second camera; and the calculated reference marker And the relative position between the processing unit marker and the position of the reference marker taken by the first camera, the relative position between the first camera and the processing unit marker
- the relative position of the processing object with respect to the first camera is recognized from the calculating step, the step of photographing the processing object with the first camera, and the position of the processing object photographed with the first camera. Based on the step, the recognized relative position of the processing object with respect to the first camera, and the calculated relative position between the first
- the “shooting range” means an image area required for image processing in an image taken by a camera, and does not include a peripheral area not required for image processing.
- the positioning device and positioning method use a reference marker that appears and disappears within the shooting range of the first and second cameras.
- the reference marker can be photographed by the first camera on the processing unit side and the second camera facing the first camera while the reference marker is in the photographing range of the first and second cameras.
- the processing unit can be photographed by the second camera in a state where the reference marker is retracted from the photographing range of the camera. From these captured images, the relative positional relationship between the processing unit and the reference marker can be derived. For this reason, the processing object side first camera is photographed to calculate the relative position of the first camera with respect to the processing object, and the relative positional relationship between the processing part and the first camera is corrected. Thus, the processing unit can be accurately positioned with respect to the processing object.
- the movable first camera is opposed to the second camera and the accurate position of the processing unit is confirmed, so that the second camera is connected to other components of the positioning device and other It can be placed in any space that does not interfere with the components of the device. Thereby, the apparatus can be reduced in size.
- a positioning apparatus is an apparatus that accurately positions the first processing unit Ha with respect to a processing target (not shown) that is a positioning target.
- Examples of the combination of the object to be processed and the first processing unit Ha include a printed circuit board and an inspection head for inspecting its electrical characteristics, a film and a punching unit for drilling holes, and a product part to be finished. And finishing head.
- the positioning device of FIG. 1 is held by the first moving mechanism 1a so that the relative position between the first moving mechanism 1a for moving the first processing unit Ha and the first processing unit Ha is constant, A first camera (front camera) 2a that shoots from the front side, a second camera (back camera) 2b that shoots the first processing unit Ha from the opposite direction (back side) to the front camera 2a, And a reference marker Mc arranged to appear and disappear within the photographing range of the second camera 2b.
- the first moving mechanism 1a holds the first processing unit Ha and the first camera 2a, and the first processing unit Ha and the first camera 1a are combined by any one or a combination of forward / backward, left / right, up / down movement and rotation.
- the camera 2a is moved.
- the position of the second camera 2b may be fixed, but may be moved and positioned by being held by a second moving mechanism (not shown).
- a first processing unit marker is provided at a position (back surface) where the second camera 2b can take a picture.
- the reference marker Mc is placed in the imaging range of the first and second cameras 2a and 2b, and the first camera 2a on the first processing unit Ha side and the second camera 2b facing the reference camera Mc Each of the markers Mc can be photographed.
- the first processing unit Ha can be photographed by the second camera 2b in a state where the reference marker Mc is retracted from the photographing ranges of the first and second cameras 2a and 2b. From these captured images, the relative positional relationship between the first processing unit Ha and the reference marker Mc can be derived. Therefore, the relative position of the first processing unit Ha and the first camera 2a is calculated by photographing the processing target with the first camera 2a on the first processing unit Ha side and calculating the relative position of the first camera 2a with respect to the processing target. By correcting the positional relationship, the first processing unit Ha can be accurately positioned with respect to the processing object.
- the positioning device makes the movable first camera 2a face the second camera 2b and confirms the exact position of the first processing unit Ha
- the second camera 2b is another component of the positioning device.
- the device can be reduced in size.
- the details of the positioning device and the positioning method will be described below by describing the configuration of the inspection device including the positioning device.
- the inspection apparatus shown in FIG. 2 is an electric inspection apparatus that inspects the electrical characteristics of the printed circuit board P on which circuits are formed on both sides.
- the inspection apparatus of FIG. 2 includes a substrate holding mechanism 3 that horizontally holds a printed circuit board P that is a processing target, a front inspection head Ha that is a first processing unit, and a back inspection head Hb that is a second processing unit. And a positioning device for positioning the front side inspection head Ha and the back side inspection head Hb with respect to the printed circuit board P.
- the positioning device includes a front side moving mechanism 1a that moves the front side inspection head Ha, a back side movement mechanism 1b that moves the back side inspection head Hb, a front side camera 2a that photographs the printed board P from the front side (upper side), and the printed board P.
- a back side camera 2b that captures images from the back side (bottom side)
- a marker moving device 4 that moves the reference marker Mc so as to appear and disappear within the shooting range of the front side camera 2a and the back side camera 2b facing each other, and the operation of each mechanism
- a controller 5 for controlling That is, the positioning device has two processing units and has two moving mechanisms 1a and 1b that individually move the processing units.
- the front side moving mechanism 1a when the front side inspection head Ha is positioned with respect to the printed circuit board P, the front side moving mechanism 1a is a first moving mechanism, the back side moving mechanism 1b is a second moving mechanism, and the front side camera 2a is a first camera.
- the back camera 2b is used as the second camera.
- the front side moving mechanism 1a when positioning the back side inspection head Hb with respect to the printed circuit board P, the front side moving mechanism 1a is the second moving mechanism, the back side moving mechanism 1b is the first moving mechanism, and the front side camera 2a is the second moving mechanism.
- the back camera 2b is used as the first camera.
- the printed circuit board P whose electrical characteristics are inspected by the inspection apparatus of FIG. 2 typically includes a double-sided board in which circuit patterns are formed on both sides.
- the printed board P may be a rigid rigid printed board or a flexible printed board having flexibility.
- the printed circuit board P is an object that becomes a reference point for accurately recognizing the position of the printed circuit board P when the front side inspection head Ha and the back side inspection head Hb are positioned by the front side movement mechanism 1a and the back side movement mechanism 1b.
- the object marker Mp can be, for example, a metal pattern formed simultaneously with the circuit pattern by a metal that forms the circuit pattern on both sides of the printed circuit board P. Further, the object marker Mp may be a feature point (a point that can be recognized by image processing) in the circuit pattern, or may be formed by, for example, printing using a paint other than the metal pattern. . The object marker Mp may be provided individually on the front and back of the printed circuit board P, but here it is assumed that it is a single pattern such as a through-hole that can be recognized from either the front or back. .
- the board holding mechanism 3 holds the printed board P horizontally by holding the outer edge of the printed board P.
- the held printed circuit board P allows the front side inspection head Ha to come into contact with the circuit pattern on the front side from above, and allows the back side inspection head Hb to come into contact with the circuit pattern on the back side of the printed circuit board P from below.
- the substrate holding mechanism 3 includes, for example, a pair of frames that hold the periphery of the printed circuit board P over the entire circumference, four wide clips that respectively hold the four sides of the printed circuit board P, and intervals between the four sides of the printed circuit board P. A large number of clips or the like arranged with a gap can be used.
- the front side inspection head Ha has a head main body 6a that is positioned by the front side moving mechanism 1a of the positioning device, and a probe unit 7a that is detachably attached to the head main body 6a.
- the back side inspection head Hb has a head main body 6b positioned by the back side moving mechanism 1b and a probe unit 7b attached to the head main body 6b.
- the head bodies 6a and 6b are members fixed to the ends of the moving mechanisms 1a and 1b.
- the probe units 7a and 7b are brought into contact with the printed circuit board P at appropriate positions by the operations of the moving mechanisms 1a and 1b. Thus, electrical inspection is performed by positioning accurately.
- the probe units 7a and 7b include a plurality of probes 8a and 8b whose tips are pressed against the front or back surface of the printed circuit board P, and a guide plate 9a having a plurality of guide holes into which the plurality of probes 8a and 8b are respectively inserted. 9b.
- the plurality of probes 8a and 8b are held such that their axial directions are perpendicular to the surfaces of the guide plates 9a and 9b, and their tips protrude slightly from the guide holes of the guide plates 9a and 9b.
- the plurality of probes 8a and 8b are arranged so as to be in contact with predetermined measurement points of the conductive pattern of the printed circuit board P.
- the guide plates 9a and 9b are formed of an insulating material and determine the arrangement of the plurality of probes 8a and 8b.
- Processing section markers Mha and Mhb serving as reference points for accurately positioning the probe units 7a and 7b on the printed circuit board P are provided on the surfaces of the guide plates 9a and 9b facing the printed circuit board P. That is, the front side inspection head Ha and the back side inspection head Hb are positioned so that the processing unit markers Mha and Mhb are arranged at a predetermined relative position with respect to the object marker Mp on the printed circuit board P.
- the front side inspection head Ha and the back side inspection head Hb have a circuit for measuring the electrical characteristics of the printed circuit board P via the plurality of probes 8a and 8b. That is, the front side inspection head Ha and the back side inspection head Hb have measurement circuits that can measure the electrical characteristics of the printed circuit board P and output the measurement results to the controller 5 via a relatively small number of wires. Good.
- the front side moving mechanism 1a is an orthogonal coordinate type moving mechanism that positions the front side inspection head Ha.
- the front side moving mechanism 1a includes a first moving body 10a that moves in a first direction parallel to the printed circuit board P (a direction perpendicular to the paper surface of FIG. 2), and the printed circuit board P on the first moving body 10a.
- a second moving body 11a that moves in a second direction (left and right direction in FIG. 2) that is parallel to the first direction and a rotation mechanism 12a that rotates the front inspection head Ha about an axis perpendicular to the printed circuit board P.
- the front side moving mechanism 1a holds the front side camera 2a by the second moving body 11a.
- the axis perpendicular to the printed circuit board P is an axis parallel to the optical axis of the front camera 2a, and the direction perpendicular to the printed circuit board P is a direction parallel to the optical axis of the front camera 2a.
- the back side moving mechanism 1b is an orthogonal coordinate type moving mechanism that positions the back side inspection head Hb. Specifically, the back side moving mechanism 1b has a configuration in which the configuration of the front side moving mechanism 1a is turned upside down.
- the first moving body 10b moves in a first direction parallel to the printed circuit board P, and the first moving body 10b.
- a second moving body 11b that moves upward in a second direction parallel to the printed circuit board P and perpendicular to the first direction; a rotating mechanism 12b that rotates the back side inspection head Hb about an axis perpendicular to the printed circuit board P; 2 has a lifting mechanism 13b for moving the back side inspection head Hb in a direction perpendicular to the printed circuit board P with respect to the moving body 11b.
- the back side moving mechanism 1b holds the back side camera 2b by the second moving body 11b.
- the back side moving mechanism 1b holds the marker moving device 4 for moving the reference marker Mc by the first moving body 10b.
- the marker moving device 4 is described as being provided on the first moving body 10b of the back side moving mechanism 1b.
- the marker moving device 4 is provided on the first moving body 10a of the front side moving mechanism 1a. May be.
- the marker moving device 4 may be provided on the second moving body 11a of the front side moving mechanism 1a, or may be provided on the second moving body 11b of the back side moving mechanism 1b.
- the first moving bodies 10a and 10b are movably disposed along a pair of rails 14a and 14b extending in the first direction, and are configured to extend in the second direction so as to connect the pair of rails 14a and 14b. .
- the first moving bodies 10a and 10b are positioned in the first direction by, for example, a ball screw.
- the second moving bodies 11a and 11b are provided so as to be movable in the second direction along the first moving bodies 10a and 10b.
- the second moving bodies 11a and 11b are positioned in the second direction on the first moving bodies 10a and 10b by, for example, a ball screw.
- the rotating mechanisms 12a and 12b are attached to the second moving bodies 11a and 11b, and rotate the inspection heads Ha and Hb together with the lifting mechanisms 13a and 13b around the axis perpendicular to the printed circuit board P (here, around the vertical axis). Determine the position (angle).
- the elevating mechanisms 13a and 13b move the inspection heads Ha and Hb in the normal direction of the printed circuit board P, and bring the tips of the plurality of probes 8a and 8b into contact with the printed circuit board P.
- Each of the first and second cameras 2 a and 2 b captures an image including the object marker Mp on the printed circuit board P and provides image data to the controller 5. Based on this image data, the amount of movement of the front side moving mechanism 1a or the back side moving mechanism 1b is calculated, and the front side inspection head Ha or the back side inspection head Hb is moved so as to face the circuit pattern of the printed circuit board P.
- the image data taken by each camera 2a, 2b is analyzed by the controller 5 by a known image processing technique. Although details will be described later, the necessary moving distance of the front side inspection head Ha or the back side inspection head Hb to be moved by the front side movement mechanism 1a or the back side movement mechanism 1b is specified.
- the reference marker Mc is a single mark that can be photographed by the front camera 2 a and the back camera 2 b and is provided on the marker member 15.
- the marking member 15 is not particularly limited, but can be configured as shown in FIG. 3 as an example. That is, the marker member 15 has a plate-like portion 16 that is held in parallel with the printed circuit board P in a state of projecting within the photographing range of the rear camera 2b.
- the plate-like portion 16 has a printed board as a reference marker Mc. Fine pores perpendicular to P can be formed.
- the thickness of the plate-like portion 16 is preferably as small as possible within a range in which a sufficient strength capable of maintaining the shape can be secured, for example, 0.05 mm or more and 0.20 mm or less. By reducing the thickness of the plate-like portion 16, it is easy to accurately check the position of the reference marker Mc even when the reference marker Mc is not arranged in front of the cameras 2a and 2b.
- the planar shape of the reference marker Mc is not particularly limited as long as its position (coordinates) can be specified, and may be a cross shape, for example, but may be circular so that it can be easily formed.
- the diameter of the circular reference marker Mc is preferably as small as possible within a range that can be confirmed by the cameras 2a and 2b, and is, for example, 0.2 mm to 1.0 mm.
- the marker moving device 4 causes the reference marker Mc of the marker member 15 to appear within the photographing range of the front camera 2a and the back camera 2b, and retracts out of the photographing range.
- the front camera 2a and the back camera 2b are opposed to each other by the front side moving mechanism 1a and the back side moving mechanism 1b.
- the reference marker Mc can appear within the imaging range of both the cameras 2a and 2b.
- the relative position between the reference marker Mc and the first moving body 10b of the back side moving mechanism 1b is constant.
- the marker moving device 4 preferably projects the reference marker Mc at a height position where the printed board P is held in a direction perpendicular to the printed board P.
- the relative positions of the front camera 2a and the back camera 2b with respect to the reference marker Mc are the same as when shooting the object marker Mp. Become.
- the relative positional relationship between the front camera 2a and the processing section marker Mha of the inspection head Ha can be grasped more accurately.
- the relative positional relationship between the front camera 2a and the probe 9a can be grasped more accurately.
- the marker moving device 4 preferably holds the reference marker Mc at the center in the second direction of the first moving body 10b. In this way, by holding the reference marker Mc at the center in the second direction, the marker moving device 4 is unlikely to interfere with other components, so that the marker moving device 4 can have a simple configuration and the reference The error of the protruding position of the marker Mc can be reduced.
- the marker moving device 4 may project and retract the reference marker Mc in a direction inclined with respect to the printed circuit board P.
- the reference marker Mc is less likely to interfere with other components of the inspection apparatus, such as a jig for holding the printed circuit board P. Therefore, the reference marker Mc and the marker moving device 4 is easy to design.
- the marker moving device 4 that projects and retracts the reference marker Mc in the inclined direction includes a linear motion guide 17 that guides the marker member 15 in an oblique direction, and the linear motion guide 17.
- a drive cylinder 18 that pushes and pulls the marker member 15 in an inclined direction can be used.
- the drive cylinder 18 can be pivoted up and down around the opposite end (base end) of the cylinder by pushing and pulling the marker member 15 by the piston tip.
- the marker moving device 4 having the linear motion guide 17 and the drive cylinder 18 allows the drive cylinder 18 to be arranged to extend in a direction parallel to the printed circuit board P.
- the marker moving device 4, in particular, the drive cylinder 18 thereof is less likely to interfere with other components, so that the marker moving device 4 can be easily designed.
- the second moving body 11b is disposed on the lower surface of the first moving body 10b of the back side moving mechanism 1b (the surface opposite to the side on which the printed circuit board P is held).
- the marker moving device 4 is disposed on the upper surface (the surface on the side where the printed circuit board P is held). That is, the marker moving device 4 is configured to fit in the gap between the upper surface of the first moving body 10b and the lower surface of the substrate holding mechanism 3 with the marker member 15 retracted. For this reason, the rotation mechanism 12b and the lifting mechanism 13b (not shown) are attached to the second moving body 11b so as to hold the back side inspection head Hb to the side of the first moving body 10b.
- the marker moving device 4 positions the second moving bodies 11a and 11b so that the cameras 2a and 2b are substantially directly opposed to the reference marker Mc, that is, the reference is set at the center of the captured images of the cameras 2a and 2b.
- the marker member 15 is protruded so that the marker Mc can be reflected.
- the marker moving device 4 only needs to be able to cause the reference marker Mc to appear and be retracted at a place where both cameras 2a and 2b can be photographed at the same time, so that the marker moving device 4 is not close to the back camera 2b but close to the front camera 2a. That is, it may be provided in the front side moving mechanism 1a.
- the front side moving mechanism 1a and the back side moving mechanism 1b are provided vertically symmetrically, the front side inspection head Ha and the back side inspection head Hb are positioned using one reference marker Mc. It is possible. For this reason, it is not necessary to provide two marker moving devices 4.
- controller 5 for example, a programmable logic controller, a personal computer, or the like is used.
- Controller 5 performs initial setting control and positioning control.
- This initial setting control and positioning control constitute the positioning method of the present invention.
- the initial setting control is performed when the probe units 7a and 7b are exchanged along with the change (line change) of the printed circuit board P to be inspected, and the relative positions of the cameras 2a and 2b and the probe units 7a and 7b are confirmed.
- the positioning control is control for positioning the probe units 7a and 7b with respect to the printed circuit board P in order to perform electrical inspection. In this positioning control, which will be described in detail later, the probe units 7a, 7b with respect to the actual printed circuit board P are considered in consideration of the relative positions of the cameras 2a, 2b and the probe units 7a, 7b confirmed in the initial setting control. Positioning. Thereby, the electrical characteristics of the printed circuit board P can be inspected by bringing the probes 8a and 8b into contact with the measurement points of the printed circuit board P accurately.
- the initial setting control and positioning control can be realized by software such as a part program or a subroutine.
- the initial setting control and positioning control will be described as control when the front side inspection head Ha is positioned by the front side moving mechanism 1a.
- the control for positioning the back side inspection head Hb by the back side moving mechanism 1b is performed by inverting the same process as the control for positioning the front side inspection head Ha by the front side moving mechanism 1a. For this reason, description of the control when positioning the back side moving mechanism 1b is omitted.
- the initial setting control procedure includes a reference marker photographing step (step S1), a reference marker retracting step (step S2), a processing unit moving step (step S3), and a processing unit marker photographing step (step S2).
- Step S4 a reference marker position calculating step (Step S5), and a camera position calculating step (Step S6).
- the marker moving device 4 uses a front side camera (first camera) 2a and a back side camera (second camera) 2b arranged to face the front side camera 2a.
- the reference marker Mc that appears in the imaging range is imaged.
- FIG. 5 shows a simplified image of the captured image of the back camera 2b in the reference marker imaging step S1. In the figure, an image of the reference marker Mc exists at the coordinates C1.
- the marker moving device 4 retracts the reference marker Mc from the imaging ranges of the first and second cameras 2a and 2b.
- the front side inspection head Ha is moved within the photographing range of the back side camera 2b by the front side moving mechanism 1a.
- the front camera 2a also moves together with the front inspection head Ha so that the relative position between the front inspection head Ha and the front camera 2a is constant.
- the reference marker imaging step S1 when the imaging range of the back camera 2b is sufficiently wide and the processing unit marker Mha appears in the imaging range of the back camera 2b without moving the front inspection head Ha.
- the reference marker photographing step S1 can also serve as the processing unit marker photographing step S4.
- the reference marker retracting step S2 and the processing unit moving step S3 can be omitted.
- S1 and the processing unit marker imaging step S4 for imaging the processing unit marker Mha provided on the front side inspection head Ha by the back camera 2b may be performed separately or simultaneously.
- FIG. 7 shows the relative position X between the reference marker Mc and the processing unit marker Mha as viewed from the back camera 2b in the processing unit marker photographing step S4.
- the processing unit marker Mha exists at the coordinates C3. This coordinate C3 can be located outside the captured image.
- the relative position X between the reference marker Mc and the processing part marker Mha is calculated by setting the moving distance L of the front side inspection head Ha to 0. That is, when the processing unit moving step S3 is unnecessary, only the reference marker Mc and the reference marker Mc and the position of the processing unit marker Mha (coordinate C2) and the position of the processing unit marker Mha (coordinate C2) in the image captured by the back camera 2b are used.
- the relative position X between the processing unit markers Mha can be calculated.
- the relative position X (that is, the reference marker position calculation step S5) is calculated from the position (coordinate C4) of the reference marker Mc in the photographed image of the front camera 2a.
- the position of the relative position X) between the reference marker Mc and the processing unit marker Mha by a distance ⁇ X that is reversed to cancel the difference in camera orientation is the coordinates of the processing unit marker Mha in the photographed image of the front camera 2a.
- the coordinates C1 of the reference marker Mc photographed by the back camera 2b and the coordinates C4 of the reference marker Mc photographed by the front camera 2a are Different.
- the deviation between the two cameras 2a and 2b can be corrected.
- the positional relationship between the front camera 2a and the processing unit Ha can be accurately calculated using the captured image of the back camera 2b.
- the positioning control procedure includes a processing object photographing step (step S11), an object position recognition step (step S12), and a positioning step (step S13).
- the front-side camera 2a photographs the printed board P, that is, the object marker Mp that is a representative point of the processing object.
- the front inspection head Ha moves together with the front camera 2a while maintaining a certain relative position with the front camera 2a.
- step S13 In the positioning step of step S13, the coordinates C6 of the object marker Mp with respect to the front camera 2a recognized in the object position recognition step S12 and the relative position between the front camera 2a and the processing unit marker Mha calculated in the initial setting control. Based on this, the front side inspection head Ha is positioned so as to face the printed circuit board P accurately.
- the power relative position Y is calculated. The calculation of the relative position Y is preferably performed in advance before performing positioning control.
- FIG. 10 there is a processing unit marker Mha at a position shifted by the relative position Y with respect to the coordinates C6 of the object marker Mp in the coordinate system of the image photographed in the object position recognition step S12. It is determined as the power coordinate C7.
- the desired coordinate C7 may also exist outside the captured image of the front camera 2a.
- a moving amount Z for moving the front side inspection head Ha and the front side camera 2a by the front side moving mechanism 1a is calculated so that the processing unit marker Mha matches the desired coordinate C7.
- This movement amount Z is calculated as a difference between the coordinate C7 where the processing unit marker Mha should be and the coordinate C5 of the processing unit marker Mha in the photographed image of the front camera 2a calculated in the camera position calculation step S6 of the initial setting control. Can do.
- the front side inspection mechanism Ha and the front side camera 2a are moved by the calculated movement amount Z by the front side moving mechanism 1a. Thereby, the front side inspection head Ha is in a state of facing the printed circuit board P accurately.
- the inspection apparatus of FIG. 2 has a reference marker Mc that is held by the first moving body 10b and that can appear and retreat outside the imaging range of the back camera 2b, thereby projecting the reference marker Mc to the front side.
- the same reference marker Mc can be photographed by the camera 2a and the back camera 2b. Further, the reference marker Mc can be retracted, and the processing marker Mha of the front side inspection head Ha can be photographed by the back side camera 2b. In this way, the reference marker Mc can appear in front of the camera only when necessary, so that positioning can be performed quickly.
- both the front camera 2a and the back camera 2b can move. Therefore, the initial setting control for positioning can be performed at an arbitrary position. Specifically, the initial setting control can be started immediately by projecting the reference marker Mc at the position of the front camera 2a or the back camera 2b when the initial setting control is required. Alternatively, when the front camera 2a and the back camera 2b are blocked by the board, wiring, or other parts of the inspection device, the initial setting control can be started by moving both cameras to a position where there is no blocking object. There are few restrictions on positioning.
- the inspection apparatus of FIG. 2 is provided with a pair of two moving mechanisms, a front-side moving mechanism 1a and a back-side moving mechanism 1b.
- the cameras 2a and 2b held by one of the moving mechanisms 1a and 1b are used as the first camera. Since the cameras 2b and 2a held by the other of the mechanisms 1a and 1b are mutually used as the second camera to check the positions of the probes 8a and 8b of the inspection heads Ha and Hb, a dedicated camera or the like is not necessary and is configured. Is simple.
- the marker member 15 having the reference marker Mc and the marker moving device 4 for moving the reference marker Mc are provided in the first moving body 10b, thereby comparing the movement of the marker member 15 and the reference marker Mc.
- FIG. 2 shows that the driving portion of the first moving body 10b, which is easy to give a margin to the driving force, is not burdened on the driving portion of the second moving body 11b, the rotating mechanism 12b, and the lifting mechanism 13b. The overall design of the inspection device is facilitated.
- the marker moving device 4 may be provided not on the first moving body 10b of the back side moving mechanism 1b but on the first moving body 10a of the front side moving mechanism 1a.
- the inspection device of FIG. 2 can easily improve the positioning accuracy.
- FIG. 11 shows a marker moving device 4a that can be used in the inspection device of FIG. 2 in place of the marker moving device 4 of FIG.
- the marker moving device 4a causes the reference marker Mc provided on the marker member 15a to appear within the photographing range of the cameras 2a and 2b and to retract outside the photographing range.
- the marker moving device 4a holds the marking member 15a, moves the marking member 15a linearly in a plane in the first direction and the second direction horizontally, and the marking member 15a as the first driving unit 19.
- it has a second drive unit 20 that linearly moves in a direction perpendicular to each of the first direction and the second direction (that is, a direction perpendicular to the printed circuit board P and here a vertical direction).
- 1st drive part 19 and 2nd drive part 20 can be constituted from a cylinder mechanism etc., for example.
- the marker moving device 4a can easily avoid interference with the second moving body 11b of the back side moving mechanism 1b by the combination of linear movement in two directions in which the marker protrudes and retracts. This further facilitates the design of the entire inspection apparatus of FIG.
- the positioning device from the start of the initial setting control to the end of all positioning controls, more specifically, from the time of shooting the reference marker in the reference marker shooting process of the initial setting control to the object position of the last positioning process It is sufficient that the relative position between the processing unit and the first camera can be made constant until the object marker is photographed in the recognition process. That is, the positioning device only needs to have a configuration in which the processing unit and the first camera move in conjunction while performing the control necessary for positioning. Therefore, the second camera is not limited to the one held by the second moving body like the inspection apparatus shown in FIG. 2, and may be held by the elevating mechanism, the rotating mechanism, or directly attached to the processing unit. Good.
- the front side moving mechanism may hold the reference marker, that is, the marker moving device.
- the reference marker may be held by the second moving body of the front side moving mechanism or the back side moving mechanism.
- an elevating mechanism attached to the second moving body may elevate and lower the processing unit together with the rotating mechanism.
- the moving mechanism of the positioning device is not limited to the Cartesian coordinate type moving mechanism, and may include any moving mechanism such as an articulated robot, a delta type (parallel link) robot, and the like. It may be.
- the positioning device according to the present invention can be particularly suitably used for an inspection device for inspecting the electrical characteristics of a printed circuit board having circuit patterns formed on both sides.
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Abstract
Description
図2に示す検査装置は、両面に回路が形成されたプリント基板Pの電気的特性を検査する電気検査装置である。
図2の検査装置によって電気的特性が検査されるプリント基板Pとしては、典型的には両面に回路パターンが形成された両面基板が挙げられる。また、プリント基板Pは、堅固なリジッドプリント基板であってもよく、可撓性を有するフレキシブルプリント基板であってもよい。
基板保持機構3は、プリント基板Pの外縁部を把持することにより、プリント基板Pを水平に保持する。保持されたプリント基板Pは、表面の回路パターンに表側検査ヘッドHaが上側から当接可能となり、且つプリント基板Pの裏面の回路パターンに裏側検査ヘッドHbが下側から当接可能となる。
表側検査ヘッドHaは、当該位置決め装置の表側移動機構1aによって位置決めされるヘッド本体6aと、このヘッド本体6aに着脱可能に取り付けられるプローブユニット7aとを有する。裏側検査ヘッドHbも同様に、裏側移動機構1bによって位置決めされるヘッド本体6bと、このヘッド本体6bに取り付けられるプローブユニット7bとを有する。
ヘッド本体6a、6bは、移動機構1a、1bの末端に固定される部材であり、移動機構1a、1bの動作によって、プローブユニット7a、7bをプリント基板Pに対して適切な位置に当接させるように正確に位置決めされることで電気検査を行う。
プローブユニット7a、7bは、先端がプリント基板Pの表面又は裏面に圧接される複数のプローブ8a、8bと、この複数のプローブ8a、8bがそれぞれ挿入される複数のガイド孔を有するガイドプレート9a、9bとを有する。
表側移動機構1aは、表側検査ヘッドHaを位置決めする直交座標型移動機構である。具体的には、表側移動機構1aは、プリント基板Pに平行な第1方向(図2の紙面に垂直な方向)に移動する第1移動体10aと、第1移動体10a上をプリント基板Pに平行且つ第1方向に垂直な第2方向(図2における左右方向)に移動する第2移動体11aと、表側検査ヘッドHaをプリント基板Pに垂直な軸を中心に回転させる回転機構12aと、第2移動体11aに対して表側検査ヘッドHaをプリント基板Pに垂直な方向に移動させる昇降機構13aとを有する。表側移動機構1aは、第2移動体11aによって表側カメラ2aを保持する。前記プリント基板Pに垂直な軸とは、表側カメラ2aの光軸に平行な軸であり、前記プリント基板Pに垂直な方向とは、表側カメラ2aの光軸に平行な方向である。
第1移動体10a、10bは、第1方向に延びる一対のレール14a、14bに添って移動可能に配設され、一対のレール14a、14b間を接続するよう第2方向に延びるよう構成される。この第1移動体10a、10bは、例えばボールねじ等によって第1方向に位置決めされる。
第2移動体11a、11bは、第1移動体10a、10bに添って第2方向に移動可能に設けられる。この第2移動体11a、11bは、例えばボールねじ等によって、第1移動体10a、10b上における第2方向に位置決めされる。
回転機構12a、12bは、第2移動体11a、11bに取り付けられ、検査ヘッドHa,Hbを昇降機構13a、13bと共にプリント基板Pに垂直な軸廻り(ここでは鉛直軸の周り)に回転させ、位置(角度)を決定する。
昇降機構13a、13bは、検査ヘッドHa,Hbをプリント基板Pの法線方向に移動させ、複数のプローブ8a、8bの先端をプリント基板Pに当接させる。
第1及び第2の各カメラ2a、2bは、プリント基板Pの対象物マーカーMpを含む画像を撮影して、コントローラー5に画像データを提供する。この画像データに基づき、表側移動機構1a又は裏側移動機構1bの移動量が算出され、表側検査ヘッドHa又は裏側検査ヘッドHbがプリント基板Pの回路パターンに正対するよう移動される。
基準マーカーMcは、表側カメラ2a及び裏側カメラ2bによって撮影可能な単一のマークであり、標識部材15に設けられる。
マーカー移動装置4は、標識部材15の基準マーカーMcを、表側カメラ2a及び裏側カメラ2bの撮影範囲内に出現させ、また撮影範囲外に退避させる。図2の検査装置では、表側移動機構1a及び裏側移動機構1bによって、表側カメラ2aと裏側カメラ2bとを対向させる。ついで、裏側カメラ2bに近接して設けられたマーカー移動装置4で基準マーカーMcを突出させることにより、両カメラ2a、2bの撮影範囲内に基準マーカーMcを出現させることができる。基準マーカーMcを両カメラ2a、2bの撮影範囲内に出現させた状態のときには、基準マーカーMcと、裏側移動機構1bの第1移動体10bとの相対位置が一定となる。
コントローラー5としては、例えばプログラマブルロジックコントローラー、パーソナルコンピューター等が用いられる。
以下、本発明における位置決め方法の詳細を説明する。なお、前記初期設定制御及び位置決め制御について、表側移動機構1aによって表側検査ヘッドHaの位置決めを行う場合の制御として説明する。裏側移動機構1bによって裏側検査ヘッドHbの位置決めを行う場合の制御は、表側移動機構1aによって表側検査ヘッドHaの位置決めを行う場合の制御と同様の処理を上下反転して行うものである。このため、裏側移動機構1bの位置決めを行う場合の制御の説明は省略する。
図4に示すように、初期設定制御の手順は、基準マーカー撮影工程(ステップS1)と、基準マーカー退避工程(ステップS2)と、処理部移動工程(ステップS3)と、処理部マーカー撮影工程(ステップS4)と、基準マーカー位置算出工程(ステップS5)と、カメラ位置算出工程(ステップS6)とを備える。
ステップS1の基準マーカー撮影工程では、表側カメラ(第1カメラ)2aと表側カメラ2aに対向するよう配置した裏側カメラ(第2カメラ)2bとによって、マーカー移動装置4がこれらのカメラ2a、2bの撮影範囲に出現させた基準マーカーMcを撮影する。
ステップS2の基準マーカー退避工程では、マーカー移動装置4によって、基準マーカーMcを、第1及び第2カメラ2a、2bの撮影範囲から退避させる。
ステップS3の処理部移動工程では、表側移動機構1aによって、表側検査ヘッドHaを裏側カメラ2bの撮影範囲内に移動させる。この際、表側検査ヘッドHaと表側カメラ2aとの相対位置が一定であるように、表側カメラ2aも表側検査ヘッドHaと共に移動する。
ステップS4の処理部マーカー撮影工程では、裏側カメラ2bによって、表側検査ヘッドHaの処理部マーカーMhaを撮影する。図6に、この処理部マーカー撮影工程S4における裏側カメラ2bの撮影画像を簡略化したイメージを示す。図において、処理部マーカーMhaの像が座標C2に存在する。
ステップS5の基準マーカー位置算出工程では、基準マーカー撮影工程S1で裏側カメラ2bにより撮影した画像中の基準マーカーMcの位置(第1方向の位置と第2方向の位置とを含む座標)C1と、処理部移動工程S3での表側検査ヘッドHaの移動距離(第1方向の移動距離及び第2方向の移動距離を含む2次元データ)Lと、処理部マーカー撮影工程S4で裏側カメラ2bにより撮影した前記処理部マーカーMhaの位置(座標)C2とから、基準マーカーMcと処理部マーカーMhaとの間の相対位置(第1方向の間隔及び第2方向の間隔を含む2次元データ)Xを算出する。図7は、処理部マーカー撮影工程S4において裏側カメラ2bから見た、基準マーカーMcと処理部マーカーMhaとの相対位置Xを示している。図において、処理部マーカーMhaは、座標C3に存在する。この座標C3は、撮影画像の外側に位置し得る。
ステップS6のカメラ位置算出工程では、基準マーカー位置算出工程S5で算出された基準マーカーMcと処理部マーカーMhaとの相対位置Xと、表側カメラ2aで撮影した基準マーカーMcの位置(座標)とから、表側カメラ2a及び処理部マーカーMha間の相対位置(表側カメラ2aの撮影画像における処理部マーカーMhaの位置に対応する座標)を算出する。
図9に示すように、位置決め制御の手順は、処理対象物撮影工程(ステップS11)と、対象物位置認識工程(ステップS12)と、位置決め工程(ステップS13)とを備える。
ステップS11の処理対象物撮影工程では、表側カメラ2aによって、プリント基板P、つまり処理対象物の代表点である対象物マーカーMpを撮影する。対象物マーカーMpの撮影が可能な位置まで表側カメラ2aを移動させる際、表側検査ヘッドHaは、表側カメラ2aと一定の相対位置を保って表側カメラ2aと共に動く。
ステップS12の対象物位置認識工程では、処理対象物撮影工程S11で表側カメラ2aにより撮影した対象物マーカーMpの位置から、表側カメラ2aに対する対象物マーカーMpの位置、つまり表側カメラ2aの撮影画像における対象物マーカーMpの座標C6を認識する。
ステップS13の位置決め工程では、対象物位置認識工程S12で認識した表側カメラ2aに対する対象物マーカーMpの座標C6と、初期設定制御において算出された表側カメラ2a及び処理部マーカーMha間の相対位置とに基づき、表側検査ヘッドHaをプリント基板Pに対して正確に正対させるよう位置決めする。
図2の検査装置は、第1移動体10bに保持され、裏側カメラ2bの撮影範囲内に出現及び撮影範囲外に退避可能な基準マーカーMcを有することにより、基準マーカーMcを突出させて、表側カメラ2a及び裏側カメラ2bで、同一の基準マーカーMcを撮影できる。また、基準マーカーMcを退避させて、裏側カメラ2bで表側検査ヘッドHaの処理部マーカーMhaを撮影できる。このように、必要なときだけ基準マーカーMcをカメラの前に出現させられるので、位置決めが迅速に行える。
図11に、図3のマーカー移動装置4に替えて図2の検査装置に使用することができるマーカー移動装置4aを示す。
前記実施形態は、本発明の構成を限定するものではない。従って、前記実施形態は、本明細書の記載及び技術常識に基づいて前記実施形態各部の構成要素の省略、置換又は追加が可能であり、それらは全て本発明の範囲に属するものと解釈されるべきである。
2a、2b カメラ
3 保持機構
4、4a マーカー移動装置
5 コントローラー
6a、6b ヘッド本体
7a、7b プローブユニット
8a、8b プローブ
9a、9b ガイドプレート
10a、10b 第1移動体
11a、11b 第2移動体
12a、12b 回転機構
13a、13b 昇降機構
14a、14b レール
15、15a 標識部材
16 板状部
17 直動ガイド
18 駆動シリンダー
19 第1駆動部
20 第2駆動部
Ha 表側検査ヘッド(第1処理部)
Hb 裏側検査ヘッド
Mc 基準マーカー
Mp 対象物マーカー
Mha、Mhb 処理部マーカー
P プリント基板
Claims (14)
- 被位置決め部材である第1処理部を位置決め対象物である処理対象物に対して位置決めする位置決め装置であって、
前記第1処理部を移動させる第1移動機構と、
前記第1移動機構に保持され、前記処理対象物を撮影する第1カメラと、
前記第1カメラと反対方向から前記第1処理部を撮影する第2カメラと、
対向し合う前記第1カメラ及び前記第2カメラの撮影範囲内に出現、消滅するよう配設される基準マーカーと
を備える位置決め装置。 - 前記第2カメラを移動可能に保持する第2移動機構をさらに備える、請求項1に記載の位置決め装置。
- 前記第2移動機構が、前記処理対象物に対して位置決めされる第2処理部を、前記第2カメラとの相対位置が一定であるよう保持する請求項2に記載の位置決め装置。
- 前記第1移動機構が、前記第1カメラの光軸に垂直な第1方向に移動する第1移動体と、前記第1カメラの光軸及び前記第1方向に垂直な第2方向に移動する第2移動体とを有する、請求項1、請求項2又は請求項3に記載の位置決め装置。
- 前記基準マーカーが前記第1移動体の前記第2方向中央部に保持される請求項4に記載の位置決め装置。
- 前記第1移動機構が、前記第2移動体に保持され、前記第1処理部を前記第1カメラの光軸に平行な軸周りに回転させる回転機構をさらに有する、請求項4又は請求項5に記載の位置決め装置。
- 前記第1移動機構が、前記第2移動体に保持され、前記第1処理部を前記第1カメラの光軸に平行な方向に移動させる昇降機構をさらに有する、請求項4、請求項5又は請求項6に記載の位置決め装置。
- 前記基準マーカーが、前記第1カメラの光軸方向において前記処理対象物が保持される位置に突出する、請求項1から請求項7のいずれか1項に記載の位置決め装置。
- 前記基準マーカーが前記第1カメラの光軸に対して傾斜する方向に突出及び後退する請求項1から請求項8のいずれか1項に記載の位置決め装置。
- 前記基準マーカーを突出及び後退させる機構が、前記基準マーカーを案内する直動ガイドと、この直動ガイドに傾斜する方向に前記基準マーカーを押し引きする駆動シリンダーとを有する請求項9に記載の位置決め装置。
- 前記基準マーカーを突出させる機構が、前記第1方向及び第2方向の平面内に直線移動させる機構と、前記第1方向及び第2方向に垂直な方向に直線移動させる機構との組み合わせである請求項8に記載の位置決め装置。
- 前記第1処理部が、複数のプローブを有する検査ヘッドである、請求項1から請求項11のいずれか1項に記載の位置決め装置。
- 被位置決め部材である処理部を位置決め対象物である処理対象物に対して位置決めする位置決め方法であって、
第1カメラと、前記第1カメラに対向するよう配置した第2カメラとによって、前記第1及び第2カメラの撮影範囲内に出現した基準マーカーを撮影する工程と、
前記第2カメラで前記処理部に設けられた処理部マーカーを撮影する工程と、
前記第2カメラで撮影した前記基準マーカーの位置と、前記第2カメラで撮影した前記処理部マーカーの位置とから、前記基準マーカー及び前記処理部マーカー間の相対位置を算出する工程と、
前記算出された前記基準マーカー及び前記処理部マーカー間の相対位置と、前記第1カメラで撮影した前記基準マーカーの位置とから、前記第1カメラ及び前記処理部マーカー間の相対位置を算出する工程と、
前記第1カメラで前記処理対象物を撮影する工程と、
前記第1カメラで撮影した前記処理対象物の位置から、前記第1カメラに対する前記処理対象物の相対位置を認識する工程と、
前記認識された前記第1カメラに対する前記処理対象物の相対位置と、前記算出された前記第1カメラ及び前記処理部マーカー間の相対位置とに基づき、前記処理部を前記処理対象物に対して位置決めする工程と
を備える位置決め方法。 - 前記基準マーカーを撮影する工程と、前記処理部マーカーを撮影する工程との間に、
前記基準マーカーを前記第1及び第2カメラの撮影範囲から退避する工程と、
前記処理部を前記第2カメラの撮影範囲まで移動させる工程と、
をさらに備え、
前記基準マーカー及び前記処理部マーカー間の相対位置を算出する工程で、さらに前記処理部の移動距離を考慮して、前記基準マーカー及び前記処理部マーカー間の相対位置を算出する
請求項13に記載の位置決め方法。
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