KR101010789B1 - 멀티 펑션 카드 디바이스 - Google Patents
멀티 펑션 카드 디바이스 Download PDFInfo
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- KR101010789B1 KR101010789B1 KR1020067000155A KR20067000155A KR101010789B1 KR 101010789 B1 KR101010789 B1 KR 101010789B1 KR 1020067000155 A KR1020067000155 A KR 1020067000155A KR 20067000155 A KR20067000155 A KR 20067000155A KR 101010789 B1 KR101010789 B1 KR 101010789B1
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- G—PHYSICS
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Description
Claims (75)
- 외부 접속 단자가 형성된 배선 기판에 복수 개의 반도체 칩이 실장되고, 하나의 반도체 칩은 상기 외부 접속 단자에 접속된 인터페이스 컨트롤러를 구성하고, 다른 반도체 칩은 상기 인터페이스 컨트롤러에 접속된 메모리를 구성하고,상기 인터페이스 컨트롤러는 외부 인터페이스 동작과 메모리에 대한 메모리 인터페이스 동작을 제어하는 인터페이스 제어 양태로서 복수의 인터페이스 제어 양태를 갖고, 외부로부터의 지시에 따른 소망의 인터페이스 제어 양태로 외부 인터페이스 동작과 메모리 인터페이스 동작을 제어하고,상기 복수의 인터페이스 제어 양태는, 제1 내지 제3 인터페이스 제어 양태를 포함하고,외부 접속 단자는 상기 제1 내지 제3 인터페이스 제어 양태마다 개별화된 개별 단자와, 복수의 인터페이스 제어 양태마다 공통화된 공통 단자를 갖고,상기 공통 단자에는 1개의 클럭 입력 단자, 1개의 전원 단자 및 1개의 접지 단자를 포함하고,상기 제1 인터페이스 제어 양태에서의 상기 개별 단자에는, 4개의 데이터 단자와 1개의 커맨드 입력 단자를 포함하고,상기 제2 인터페이스 제어 양태에서의 상기 개별 단자에는, 8개의 데이터 단자와 1개의 커맨드 입력 단자를 포함하고,상기 제3 인터페이스 제어 양태에서의 상기 개별 단자에는, 4개의 데이터 단자와 1개의 삽입 발출 검출용 단자와 1개의 버스 스테이터스 단자를 포함하는 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제1항에 있어서,상기 인터페이스 컨트롤러와 동일 또는 별도의 반도체 칩으로 구성된 시큐리티 컨트롤러를 더 갖고,상기 시큐리티 컨트롤러는 상기 인터페이스 컨트롤러 및 외부 접속 단자에 접속되고,상기 개별 단자에는 상기 시큐리티 컨트롤러의 전용 단자를 더 포함하는 것 을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제2항에 있어서,상기 시큐리티 컨트롤러의 전용 단자로서 클럭 단자, 데이터 입출력 단자, 리셋 단자, 전원 단자 및 접지 단자를 갖는 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제2항에 있어서,상기 시큐리티 컨트롤러는 상기 외부 단자의 신호 상태 또는 인터페이스 컨트롤러로부터 주어지는 동작 커맨드에 따라서 시큐리티 처리를 행하는 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제4항에 있어서,내부 안테나를 더 갖고, 상기 시큐리티 컨트롤러는 상기 안테나를 이용하여 비접촉 인터페이스 가능한 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제1항 또는 제2항에 있어서,상기 외부 접속 단자를 노출시켜 전체가 캡으로 덮이고,상기 캡은, 페라이트 혼입 캡 또는 금속 캡인 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제2항에 있어서,안테나를 더 갖고, 상기 시큐리티 컨트롤러를 구성하는 반도체 칩은 안테나에 접속되어 비접촉 인터페이스 가능하게 되고, 상기 외부 접속 단자를 노출시켜 전체가 케이싱으로 덮이고,상기 안테나는 반도체 칩의 외측 영역에 형성되고, 반도체 칩은 페라이트 플레이트 상에 스택되고,안테나에 의한 수신 면과는 반대측에 전자(電磁) 시일드를 형성한 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제7항에 있어서,상기 전자 시일드는, 케이싱의 페라이트 혼입층, 케이싱의 금속 혼입층, 케이싱에 도포한 페라이트 혼입 도료의 도포면, 케이싱에 도포한 금속 혼입 도료의 도포면, 또는 케이싱에 접합한 금속 증착 라벨인 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제8항에 있어서,상기 케이싱은 캡 또는 수지 몰드인 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제7항에 있어서,안테나의 접속 단자 사이에 외부 부착한 동조용 콘덴서를 갖는 것을 특징으로 하는 멀티 펑션 카드 디바이스.
- 제10항에 있어서,상기 동조용 콘덴서는, 칩 콘덴서, 가변 캡 콘덴서 또는 불휘발성 MOS 용량인 것을 특징으로 하는 멀티 펑션 카드 디바이스.
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CN101271538A (zh) | 2008-09-24 |
TW200739429A (en) | 2007-10-16 |
KR20100107057A (ko) | 2010-10-04 |
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CN100390818C (zh) | 2008-05-28 |
US20060151614A1 (en) | 2006-07-13 |
WO2005004047A1 (ja) | 2005-01-13 |
JPWO2005004047A1 (ja) | 2006-08-17 |
KR20060059252A (ko) | 2006-06-01 |
US20110227234A1 (en) | 2011-09-22 |
CN1802655A (zh) | 2006-07-12 |
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