KR100998279B1 - 땜납볼 인쇄장치 - Google Patents

땜납볼 인쇄장치 Download PDF

Info

Publication number
KR100998279B1
KR100998279B1 KR1020080045068A KR20080045068A KR100998279B1 KR 100998279 B1 KR100998279 B1 KR 100998279B1 KR 1020080045068 A KR1020080045068 A KR 1020080045068A KR 20080045068 A KR20080045068 A KR 20080045068A KR 100998279 B1 KR100998279 B1 KR 100998279B1
Authority
KR
South Korea
Prior art keywords
solder ball
printing
screen
substrate
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080045068A
Other languages
English (en)
Korean (ko)
Other versions
KR20080102963A (ko
Inventor
마코토 혼마
이사오 아베
노리아키 무카이
아키오 이가라시
Original Assignee
가부시키가이샤 히타치플랜트테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히타치플랜트테크놀로지 filed Critical 가부시키가이샤 히타치플랜트테크놀로지
Publication of KR20080102963A publication Critical patent/KR20080102963A/ko
Application granted granted Critical
Publication of KR100998279B1 publication Critical patent/KR100998279B1/ko
Assigned to 가부시키가이샤 히타치세이사쿠쇼 reassignment 가부시키가이샤 히타치세이사쿠쇼 권리의 전부이전등록 Assignors: 가부시키가이샤 히타치플랜트테크놀로지
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020080045068A 2007-05-21 2008-05-15 땜납볼 인쇄장치 Expired - Fee Related KR100998279B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00134257 2007-05-21
JP2007134257A JP5098434B2 (ja) 2007-05-21 2007-05-21 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
KR20080102963A KR20080102963A (ko) 2008-11-26
KR100998279B1 true KR100998279B1 (ko) 2010-12-03

Family

ID=40100695

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080045068A Expired - Fee Related KR100998279B1 (ko) 2007-05-21 2008-05-15 땜납볼 인쇄장치

Country Status (4)

Country Link
JP (1) JP5098434B2 (https=)
KR (1) KR100998279B1 (https=)
CN (1) CN101312136B (https=)
TW (1) TW200922422A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101442350B1 (ko) * 2012-11-22 2014-09-17 삼성전기주식회사 솔더볼 리페어 장치
US20220190219A1 (en) * 2020-12-14 2022-06-16 Lumileds Llc Stencil Printing Flux For Attaching Light Emitting Diodes

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5141521B2 (ja) * 2008-12-03 2013-02-13 株式会社日立プラントテクノロジー ハンダボール印刷機
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法
JP5206572B2 (ja) * 2009-04-23 2013-06-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
DE102009053575B4 (de) * 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
CN106985564B (zh) * 2011-06-13 2019-03-08 千住金属工业株式会社 焊膏的印刷方法
CN102990183B (zh) * 2011-09-09 2014-10-01 中国航天科工集团第三研究院第八三五七研究所 一种bga器件返修过程中转移膏状助焊剂的方法
JP5808229B2 (ja) * 2011-11-14 2015-11-10 株式会社日立製作所 ハンダボール印刷機
CN103418872A (zh) * 2012-05-15 2013-12-04 深圳市木森科技有限公司 一种焊接微型引脚的方法和装置
JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
KR101388787B1 (ko) * 2012-07-25 2014-04-23 삼성전기주식회사 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법
CN103687328A (zh) * 2012-09-26 2014-03-26 光宝电子(广州)有限公司 焊锡检测及自动修补系统及其方法
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
JP2014165455A (ja) * 2013-02-27 2014-09-08 Shibuya Kogyo Co Ltd 導電性ボールの搭載状態検査装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
KR101452963B1 (ko) * 2013-05-02 2014-10-22 (주) 피토 반도체 리볼링 장치
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
JP6286729B2 (ja) * 2014-11-11 2018-03-07 株式会社新川 フラックス溜め装置
CN104668695B (zh) * 2015-02-03 2017-01-18 河北科瑞达仪器科技股份有限公司 一种对电子产品整机进行焊点检测并进行焊锡的方法
CN104889520B (zh) * 2015-04-14 2017-08-22 东莞市合易自动化科技有限公司 一种智能化aoi选焊系统及其方法
JP6616981B2 (ja) * 2015-08-05 2019-12-04 アスリートＦａ株式会社 ボール検査リペア装置
JP6545085B2 (ja) * 2015-11-13 2019-07-17 アスリートＦａ株式会社 導電性ボールを搭載するシステム
TWI555601B (zh) * 2015-12-21 2016-11-01 矽品精密工業股份有限公司 打線裝置及排除不良銲線之方法
JP6813772B2 (ja) * 2016-10-14 2021-01-13 澁谷工業株式会社 微小ボール搭載装置
WO2018109807A1 (ja) * 2016-12-12 2018-06-21 株式会社Ｆｕｊｉ 部品装着機
US10973161B2 (en) * 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device
US10879102B2 (en) * 2017-08-07 2020-12-29 Boston Process Technologies, Inc Flux-free solder ball mount arrangement
KR102004824B1 (ko) * 2017-11-08 2019-07-29 (주)비와이텍 터치스크린용 고효율 인쇄장치
EP3482934B1 (de) * 2017-11-10 2021-06-30 Exentis Group AG 3d-siebdrucksystem zum drucken dreidimensional geformter strukturen
CN109014553A (zh) * 2018-06-26 2018-12-18 江苏米研工业设备有限公司 一种锂电池全自动超声波焊接机用定位识别焊接系统
JP7109076B2 (ja) * 2018-09-26 2022-07-29 アスリートＦａ株式会社 基板吸着固定ステージ及びボール搭載装置
KR102012977B1 (ko) * 2018-10-30 2019-10-21 위재우 미세 솔더볼 리워크 피커 모듈
CN109413889A (zh) * 2018-12-17 2019-03-01 东莞市凯格精密机械有限公司 一种pcb板印刷的装置及其控制方法
JP6939950B1 (ja) * 2020-06-01 2021-09-22 住友金属鉱山株式会社 検査装置および検査方法
KR102856076B1 (ko) 2020-10-15 2025-09-05 코모리 가부시키가이샤 볼 탑재방법 및 볼 탑재장치
CN112338307B (zh) * 2021-01-08 2021-03-19 四川赛狄信息技术股份公司 一种高精密电路板封装芯片中心引脚补差焊接方法及装置
JP7107601B1 (ja) 2021-01-27 2022-07-27 Ａｉメカテック株式会社 バンプ形成装置、バンプ形成方法、ハンダボールリペア装置、及び、ハンダボールリペア方法
KR102606828B1 (ko) * 2021-08-30 2023-11-29 에스케이하이닉스 주식회사 검사 및 리페어 장치를 포함하는 반도체 제조 시스템, 그 구동 방법 및 이를 이용한 반도체 패키지의 제조방법
CN113766823B (zh) * 2021-09-10 2023-06-02 上海无线电设备研究所 一种基于smt返修台的bga植球装置及方法
JP2023062354A (ja) * 2021-10-21 2023-05-08 Ａｉメカテック株式会社 ハンダボール印刷機
WO2023177347A1 (en) * 2022-03-15 2023-09-21 Capcon Holdings (Beijing) Limited A system and method for placement of at least one conductor pin
JP7285604B1 (ja) * 2022-09-22 2023-06-02 アスリートＦａ株式会社 ボール搭載装置及びボール搭載方法
WO2024189904A1 (ja) * 2023-03-16 2024-09-19 株式会社Fuji 対象物検出装置および対象物検出方法
CN117440677A (zh) * 2023-10-25 2024-01-23 南京大学 一种贴装检测修补系统及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3254459B2 (ja) * 1994-03-04 2002-02-04 株式会社日立製作所 微小ハンダ供給方法及び微小ハンダ供給装置
JP3360435B2 (ja) * 1994-10-14 2002-12-24 株式会社日立製作所 電子回路装置の製造方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP3770496B2 (ja) * 2003-03-10 2006-04-26 日立金属株式会社 導電性ボールの搭載方法および搭載装置
JP4560683B2 (ja) * 2005-05-10 2010-10-13 澁谷工業株式会社 導電性ボール配列装置
JP5018062B2 (ja) * 2006-12-15 2012-09-05 株式会社日立プラントテクノロジー ハンダボール印刷装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101442350B1 (ko) * 2012-11-22 2014-09-17 삼성전기주식회사 솔더볼 리페어 장치
US20220190219A1 (en) * 2020-12-14 2022-06-16 Lumileds Llc Stencil Printing Flux For Attaching Light Emitting Diodes
US11949053B2 (en) * 2020-12-14 2024-04-02 Lumileds Llc Stencil printing flux for attaching light emitting diodes

Also Published As

Publication number Publication date
JP5098434B2 (ja) 2012-12-12
TW200922422A (en) 2009-05-16
CN101312136A (zh) 2008-11-26
CN101312136B (zh) 2011-09-21
TWI351905B (https=) 2011-11-01
KR20080102963A (ko) 2008-11-26
JP2008288515A (ja) 2008-11-27

Similar Documents

Publication Publication Date Title
KR100998279B1 (ko) 땜납볼 인쇄장치
KR101027491B1 (ko) 땜납볼 인쇄장치
KR101095931B1 (ko) 땜납볼 검사 리페어장치 및 땜납볼 검사 리페어방법
US6460755B1 (en) Bump forming method and apparatus therefor
CN101743480B (zh) 改进的球植入装置和方法
CN103515274B (zh) 焊球印刷搭载装置
CN107443879B (zh) 印刷装置、焊料管理系统以及焊料管理方法
JP2001047600A (ja) マスク印刷方法およびマスク印刷装置
JP2013031940A (ja) パネルの印刷装置
US8091767B2 (en) Substrate manufacturing apparatus, substrate manufacturing method, ball-mounted substrate, and electronic component-mounted substrate
JP2006108200A (ja) はんだ印刷システム
JP2017092342A (ja) 導電性ボールを搭載するシステム
US8302838B2 (en) Micro-bump forming apparatus
JPH1044370A (ja) スクリーン印刷機及びその制御方法
JPH1058649A (ja) はんだペースト認識方法及びスクリーン印刷機
JP4560683B2 (ja) 導電性ボール配列装置
JP6506244B2 (ja) ボール搭載装置
JP7005868B2 (ja) ボール供給装置及びボール搭載装置
KR20070057060A (ko) 도전성 볼의 배열 장치
JP5185806B2 (ja) スクリーン印刷機
JP2010125716A (ja) スクリーン印刷機
WO2016208019A1 (ja) 基板検査機

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20131011

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

FPAY Annual fee payment

Payment date: 20141008

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20151030

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20161130

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161130

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000