KR100980510B1 - 기판 처리 장치의 제어 장치, 제어 방법 및 제어프로그램을 기억한 기억 매체 - Google Patents

기판 처리 장치의 제어 장치, 제어 방법 및 제어프로그램을 기억한 기억 매체 Download PDF

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KR100980510B1
KR100980510B1 KR1020070121461A KR20070121461A KR100980510B1 KR 100980510 B1 KR100980510 B1 KR 100980510B1 KR 1020070121461 A KR1020070121461 A KR 1020070121461A KR 20070121461 A KR20070121461 A KR 20070121461A KR 100980510 B1 KR100980510 B1 KR 100980510B1
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substrate
unit
processing
processing chamber
lot
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Korean (ko)
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KR20080048410A (ko
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마사히로 누마쿠라
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020070121461A 2006-11-28 2007-11-27 기판 처리 장치의 제어 장치, 제어 방법 및 제어프로그램을 기억한 기억 매체 Active KR100980510B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00319832 2006-11-28
JP2006319832A JP2008135517A (ja) 2006-11-28 2006-11-28 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体

Publications (2)

Publication Number Publication Date
KR20080048410A KR20080048410A (ko) 2008-06-02
KR100980510B1 true KR100980510B1 (ko) 2010-09-06

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KR1020070121461A Active KR100980510B1 (ko) 2006-11-28 2007-11-27 기판 처리 장치의 제어 장치, 제어 방법 및 제어프로그램을 기억한 기억 매체

Country Status (4)

Country Link
JP (1) JP2008135517A (https=)
KR (1) KR100980510B1 (https=)
CN (1) CN101192055B (https=)
TW (1) TWI496230B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232212B2 (en) * 2008-07-11 2012-07-31 Applied Materials, Inc. Within-sequence metrology based process tuning for adaptive self-aligned double patterning
JP5469015B2 (ja) * 2009-09-30 2014-04-09 東京エレクトロン株式会社 基板処理装置および基板搬送方法
JP5374462B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
WO2015107955A1 (ja) 2014-01-20 2015-07-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6089082B1 (ja) 2015-09-29 2017-03-01 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
JP6600588B2 (ja) 2016-03-17 2019-10-30 東京エレクトロン株式会社 基板搬送機構の洗浄方法及び基板処理システム
JP6403722B2 (ja) * 2016-07-21 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、プログラム
JP6723110B2 (ja) 2016-08-18 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6625098B2 (ja) 2017-07-20 2019-12-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法およびプログラム
CN109950187B (zh) 2017-12-20 2024-04-12 株式会社国际电气 基板处理装置、半导体装置的制造方法以及记录介质
JP6704008B2 (ja) * 2018-03-26 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7137976B2 (ja) * 2018-07-04 2022-09-15 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP7174581B2 (ja) * 2018-09-20 2022-11-17 株式会社Ｓｃｒｅｅｎホールディングス レシピ表示装置、レシピ表示方法、およびレシピ表示プログラム
CN118658815A (zh) * 2024-08-20 2024-09-17 中微半导体(上海)有限公司 用于半导体处理的装置、物理气相沉积设备及使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000003307A (ko) * 1998-06-27 2000-01-15 윤종용 반도체 제조설비 관리시스템의 로트 플로우 제어방법
KR20010067234A (ko) * 1999-12-28 2001-07-12 다니구찌 이찌로오, 기타오카 다카시 프로세스 제어장치
JP2002237507A (ja) * 2000-12-08 2002-08-23 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2739858B2 (ja) * 1996-03-25 1998-04-15 日本電気株式会社 生産制御システム及びその装置
JP2001257141A (ja) * 2000-03-10 2001-09-21 Mitsubishi Electric Corp プロセス制御装置およびプロセス制御方法
JP4334817B2 (ja) * 2002-05-15 2009-09-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4566574B2 (ja) * 2004-02-13 2010-10-20 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000003307A (ko) * 1998-06-27 2000-01-15 윤종용 반도체 제조설비 관리시스템의 로트 플로우 제어방법
KR20010067234A (ko) * 1999-12-28 2001-07-12 다니구찌 이찌로오, 기타오카 다카시 프로세스 제어장치
JP2002237507A (ja) * 2000-12-08 2002-08-23 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法

Also Published As

Publication number Publication date
CN101192055A (zh) 2008-06-04
TW200841412A (en) 2008-10-16
JP2008135517A (ja) 2008-06-12
KR20080048410A (ko) 2008-06-02
CN101192055B (zh) 2010-12-01
TWI496230B (zh) 2015-08-11

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