CN101192055B - 基板处理装置的控制装置和控制方法 - Google Patents

基板处理装置的控制装置和控制方法 Download PDF

Info

Publication number
CN101192055B
CN101192055B CN2007101946059A CN200710194605A CN101192055B CN 101192055 B CN101192055 B CN 101192055B CN 2007101946059 A CN2007101946059 A CN 2007101946059A CN 200710194605 A CN200710194605 A CN 200710194605A CN 101192055 B CN101192055 B CN 101192055B
Authority
CN
China
Prior art keywords
substrate
process chamber
conveyance
processing
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101946059A
Other languages
English (en)
Chinese (zh)
Other versions
CN101192055A (zh
Inventor
沼仓雅博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101192055A publication Critical patent/CN101192055A/zh
Application granted granted Critical
Publication of CN101192055B publication Critical patent/CN101192055B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN2007101946059A 2006-11-28 2007-11-27 基板处理装置的控制装置和控制方法 Expired - Fee Related CN101192055B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-319832 2006-11-28
JP2006319832 2006-11-28
JP2006319832A JP2008135517A (ja) 2006-11-28 2006-11-28 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体

Publications (2)

Publication Number Publication Date
CN101192055A CN101192055A (zh) 2008-06-04
CN101192055B true CN101192055B (zh) 2010-12-01

Family

ID=39487093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101946059A Expired - Fee Related CN101192055B (zh) 2006-11-28 2007-11-27 基板处理装置的控制装置和控制方法

Country Status (4)

Country Link
JP (1) JP2008135517A (https=)
KR (1) KR100980510B1 (https=)
CN (1) CN101192055B (https=)
TW (1) TWI496230B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232212B2 (en) * 2008-07-11 2012-07-31 Applied Materials, Inc. Within-sequence metrology based process tuning for adaptive self-aligned double patterning
JP5469015B2 (ja) * 2009-09-30 2014-04-09 東京エレクトロン株式会社 基板処理装置および基板搬送方法
JP5374462B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
WO2015107955A1 (ja) 2014-01-20 2015-07-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6089082B1 (ja) 2015-09-29 2017-03-01 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
JP6600588B2 (ja) 2016-03-17 2019-10-30 東京エレクトロン株式会社 基板搬送機構の洗浄方法及び基板処理システム
JP6403722B2 (ja) * 2016-07-21 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、プログラム
JP6723110B2 (ja) 2016-08-18 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6625098B2 (ja) 2017-07-20 2019-12-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法およびプログラム
CN109950187B (zh) 2017-12-20 2024-04-12 株式会社国际电气 基板处理装置、半导体装置的制造方法以及记录介质
JP6704008B2 (ja) * 2018-03-26 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7137976B2 (ja) * 2018-07-04 2022-09-15 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP7174581B2 (ja) * 2018-09-20 2022-11-17 株式会社Ｓｃｒｅｅｎホールディングス レシピ表示装置、レシピ表示方法、およびレシピ表示プログラム
CN118658815A (zh) * 2024-08-20 2024-09-17 中微半导体(上海)有限公司 用于半导体处理的装置、物理气相沉积设备及使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655322A (zh) * 2004-02-13 2005-08-17 大日本网目版制造株式会社 基板处理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2739858B2 (ja) * 1996-03-25 1998-04-15 日本電気株式会社 生産制御システム及びその装置
KR20000003307A (ko) * 1998-06-27 2000-01-15 윤종용 반도체 제조설비 관리시스템의 로트 플로우 제어방법
JP4524720B2 (ja) * 1999-12-28 2010-08-18 ルネサスエレクトロニクス株式会社 プロセス制御装置
JP2001257141A (ja) * 2000-03-10 2001-09-21 Mitsubishi Electric Corp プロセス制御装置およびプロセス制御方法
JP2002237507A (ja) * 2000-12-08 2002-08-23 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法
JP4334817B2 (ja) * 2002-05-15 2009-09-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655322A (zh) * 2004-02-13 2005-08-17 大日本网目版制造株式会社 基板处理装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP特开2000-208589A 2000.07.28
JP特开2004-119635A 2004.04.15
JP特开2006-222328A 2006.08.24
JP特开2006-245416A 2006.09.14

Also Published As

Publication number Publication date
CN101192055A (zh) 2008-06-04
TW200841412A (en) 2008-10-16
JP2008135517A (ja) 2008-06-12
KR20080048410A (ko) 2008-06-02
KR100980510B1 (ko) 2010-09-06
TWI496230B (zh) 2015-08-11

Similar Documents

Publication Publication Date Title
CN101192055B (zh) 基板处理装置的控制装置和控制方法
TWI489520B (zh) Control device and control method of substrate processing device
US7738987B2 (en) Device and method for controlling substrate processing apparatus
JP5575507B2 (ja) 基板処理装置、基板搬送方法、半導体装置の製造方法および基板処理装置のメンテナンス方法
JP5901978B2 (ja) 基板処理装置、基板処理装置制御プログラム、及び半導体装置の製造方法
CN107924811B (zh) 基板处理系统、基板处理装置的文件管理方法及存储介质
WO2020241599A1 (ja) 基板処理システム及び基板処理システムの制御方法
CN101213640B (zh) 基板处理装置的控制装置及基板处理装置的控制方法
JP5571122B2 (ja) 基板処理装置および基板処理装置の制御方法
WO2008059921A1 (en) Host control device, slave control device, screen operation right giving method, and storage medium containing screen operation right giving program
CN101046691B (zh) 基板处理装置的控制装置、方法
JP2008124191A (ja) 真空処理装置
US20190139804A1 (en) Substrate processing apparatus and notification method
JP2011054679A (ja) 基板処理装置
US11823877B2 (en) Substrate processing system, substrate processing method, and controller
KR102292904B1 (ko) 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체
JP2012174764A (ja) 基板処理装置及び半導体装置の製造方法
JP4839019B2 (ja) 基板処理システム、基板処理方法、プログラム及び記憶媒体
JP2011096719A (ja) 基板処理装置
JP5269548B2 (ja) 基板処理装置及び基板処理装置の基板搬送方法
JP2012094599A (ja) 基板処理装置
JP2004146418A (ja) 基板処理容器およびこれを用いた基板処理方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101201

Termination date: 20161127

CF01 Termination of patent right due to non-payment of annual fee