KR100970048B1 - 절연막의 제조방법, 반응장치, 발전장치 및 전자기기 - Google Patents
절연막의 제조방법, 반응장치, 발전장치 및 전자기기 Download PDFInfo
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- KR100970048B1 KR100970048B1 KR1020070083183A KR20070083183A KR100970048B1 KR 100970048 B1 KR100970048 B1 KR 100970048B1 KR 1020070083183 A KR1020070083183 A KR 1020070083183A KR 20070083183 A KR20070083183 A KR 20070083183A KR 100970048 B1 KR100970048 B1 KR 100970048B1
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- film
- metal substrate
- insulating film
- rare earth
- forming
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02192—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
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- C01B3/02—Production of hydrogen or of gaseous mixtures containing a substantial proportion of hydrogen
- C01B3/32—Production of hydrogen or of gaseous mixtures containing a substantial proportion of hydrogen by reaction of gaseous or liquid organic compounds with gasifying agents, e.g. water, carbon dioxide, air
- C01B3/323—Catalytic reaction of gaseous or liquid organic compounds other than hydrocarbons with gasifying agents
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
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- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
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- Combustion & Propulsion (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
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- Hydrogen, Water And Hydrids (AREA)
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Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2006-00233849 | 2006-08-30 | ||
| JP2006233849A JP4254823B2 (ja) | 2006-08-30 | 2006-08-30 | 反応装置及び電子機器 |
| JPJP-P-2006-00267832 | 2006-09-29 | ||
| JP2006267832A JP4466629B2 (ja) | 2006-08-30 | 2006-09-29 | 絶縁膜の製造方法 |
| JP2007133587A JP4508212B2 (ja) | 2006-08-30 | 2007-05-21 | 反応装置及び電子機器 |
| JPJP-P-2007-00133587 | 2007-05-21 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090026504A Division KR100924185B1 (ko) | 2006-08-30 | 2009-03-27 | 절연막의 제조방법, 반응장치, 발전장치 및 전자기기 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080020487A KR20080020487A (ko) | 2008-03-05 |
| KR100970048B1 true KR100970048B1 (ko) | 2010-07-16 |
Family
ID=39151965
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070083183A Expired - Fee Related KR100970048B1 (ko) | 2006-08-30 | 2007-08-20 | 절연막의 제조방법, 반응장치, 발전장치 및 전자기기 |
| KR1020090026504A Expired - Fee Related KR100924185B1 (ko) | 2006-08-30 | 2009-03-27 | 절연막의 제조방법, 반응장치, 발전장치 및 전자기기 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090026504A Expired - Fee Related KR100924185B1 (ko) | 2006-08-30 | 2009-03-27 | 절연막의 제조방법, 반응장치, 발전장치 및 전자기기 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8097301B2 (enExample) |
| JP (3) | JP4254823B2 (enExample) |
| KR (2) | KR100970048B1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1017086A3 (fr) * | 2006-03-29 | 2008-02-05 | Ct Rech Metallurgiques Asbl | Procede de recuit et preparation en continu d'une bande en acier a haute resistance en vue de sa galvanisation au trempe. |
| JP4254823B2 (ja) | 2006-08-30 | 2009-04-15 | カシオ計算機株式会社 | 反応装置及び電子機器 |
| PL2106195T3 (pl) * | 2008-03-28 | 2010-09-30 | Braun Gmbh | Element grzewczy z czujnikiem temperatury |
| US8203105B2 (en) * | 2008-07-18 | 2012-06-19 | Advanced Materials Enterprises Company Limited | Nano thickness heating material coated food warmer devices for hospital and elsewhere daily usage |
| JP5157740B2 (ja) * | 2008-08-12 | 2013-03-06 | カシオ計算機株式会社 | サーミスタ兼電熱ヒータの製造方法 |
| DE102009037148B4 (de) | 2009-08-06 | 2014-02-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Festoxid-Brennstoffzellen-System |
| JP5729572B2 (ja) * | 2011-01-31 | 2015-06-03 | Toto株式会社 | 固体電解質材料およびこれを備えた固体酸化物形燃料電池 |
| GB201101862D0 (en) | 2011-02-03 | 2011-03-23 | Univ Muenster Wilhelms | Method and device |
| KR101818681B1 (ko) * | 2011-07-25 | 2018-01-16 | 한국전자통신연구원 | 게터 내장형 전계방출 엑스선관 장치 |
| JP6845143B2 (ja) * | 2015-09-16 | 2021-03-17 | Koa株式会社 | 水素センサ |
| US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
| US12406741B2 (en) | 2022-08-10 | 2025-09-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor memory devices with backside heater structure |
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2007
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2009
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2008088462A (ja) | 2008-04-17 |
| JP2008056521A (ja) | 2008-03-13 |
| US20080057196A1 (en) | 2008-03-06 |
| KR20090046764A (ko) | 2009-05-11 |
| KR20080020487A (ko) | 2008-03-05 |
| KR100924185B1 (ko) | 2009-10-28 |
| US8097301B2 (en) | 2012-01-17 |
| JP4254823B2 (ja) | 2009-04-15 |
| JP2008284503A (ja) | 2008-11-27 |
| JP4466629B2 (ja) | 2010-05-26 |
| JP4508212B2 (ja) | 2010-07-21 |
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