KR100957703B1 - 미세패턴 형성 방법 - Google Patents

미세패턴 형성 방법 Download PDF

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Publication number
KR100957703B1
KR100957703B1 KR1020070036402A KR20070036402A KR100957703B1 KR 100957703 B1 KR100957703 B1 KR 100957703B1 KR 1020070036402 A KR1020070036402 A KR 1020070036402A KR 20070036402 A KR20070036402 A KR 20070036402A KR 100957703 B1 KR100957703 B1 KR 100957703B1
Authority
KR
South Korea
Prior art keywords
cliché
hard mold
fine pattern
disposable
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070036402A
Other languages
English (en)
Korean (ko)
Other versions
KR20080092707A (ko
Inventor
성지현
홍영준
이승헌
김지수
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to KR1020070036402A priority Critical patent/KR100957703B1/ko
Priority to TW097113176A priority patent/TWI388433B/zh
Priority to CN2008800119102A priority patent/CN101657883B/zh
Priority to JP2010502950A priority patent/JP5044691B2/ja
Priority to PCT/KR2008/002094 priority patent/WO2008127055A1/en
Priority to US12/595,683 priority patent/US9365025B2/en
Publication of KR20080092707A publication Critical patent/KR20080092707A/ko
Application granted granted Critical
Publication of KR100957703B1 publication Critical patent/KR100957703B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F3/00—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
    • B41F3/02—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed with impression cylinder or cylinders rotating unidirectionally
    • B41F3/06—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed with impression cylinder or cylinders rotating unidirectionally continuously
    • B41F3/10—Two-revolution presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F3/00—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
    • B41F3/18—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed of special construction or for particular purposes
    • B41F3/36—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed of special construction or for particular purposes for intaglio or heliogravure printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F35/00—Cleaning arrangements or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00—Preparing for use and conserving printing surfaces
    • B41N3/003—Preparing for use and conserving printing surfaces of intaglio formes, e.g. application of a wear-resistant coating, such as chrome, on the already-engraved plate or cylinder; Preparing for reuse, e.g. removing of the Ballard shell; Correction of the engraving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Methods (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
KR1020070036402A 2007-04-13 2007-04-13 미세패턴 형성 방법 Expired - Fee Related KR100957703B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020070036402A KR100957703B1 (ko) 2007-04-13 2007-04-13 미세패턴 형성 방법
TW097113176A TWI388433B (zh) 2007-04-13 2008-04-11 精密圖樣形成用之方法
CN2008800119102A CN101657883B (zh) 2007-04-13 2008-04-14 用于形成精细图形的方法
JP2010502950A JP5044691B2 (ja) 2007-04-13 2008-04-14 微細パターン形成方法
PCT/KR2008/002094 WO2008127055A1 (en) 2007-04-13 2008-04-14 Method for forming fine patterns
US12/595,683 US9365025B2 (en) 2007-04-13 2008-04-14 Method for forming fine patterns on a substrate with a disposable cliche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070036402A KR100957703B1 (ko) 2007-04-13 2007-04-13 미세패턴 형성 방법

Publications (2)

Publication Number Publication Date
KR20080092707A KR20080092707A (ko) 2008-10-16
KR100957703B1 true KR100957703B1 (ko) 2010-05-12

Family

ID=39864104

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070036402A Expired - Fee Related KR100957703B1 (ko) 2007-04-13 2007-04-13 미세패턴 형성 방법

Country Status (6)

Country Link
US (1) US9365025B2 (enExample)
JP (1) JP5044691B2 (enExample)
KR (1) KR100957703B1 (enExample)
CN (1) CN101657883B (enExample)
TW (1) TWI388433B (enExample)
WO (1) WO2008127055A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101733585B1 (ko) * 2009-07-28 2017-05-11 삼성디스플레이 주식회사 잉크 패턴 형성 방법 및 잉크 패턴 인쇄 장치
CN103391847B (zh) * 2011-02-24 2015-05-13 Lg化学株式会社 滚筒印刷设备以及使用该设备的滚筒印刷方法
US9449733B2 (en) 2011-03-15 2016-09-20 Lg Chem, Ltd. Conductive ink composition, printing method using the same and conductive pattern manufactured by the same
KR101324493B1 (ko) * 2011-03-22 2013-11-01 (주)뉴옵틱스 원통 금형에 패턴을 복제하는 방법
TWI481510B (zh) * 2011-06-10 2015-04-21 Au Optronics Corp 移印方法
KR101094864B1 (ko) * 2011-07-07 2011-12-15 한국기계연구원 일회용 클리쉐를 이용한 리버스 그라비아 옵셋 인쇄 방법 및 장치
WO2013095079A1 (ko) * 2011-12-23 2013-06-27 주식회사 엘지화학 터치패널 및 이를 포함하는 디스플레이 장치
TWI508279B (zh) * 2012-01-19 2015-11-11 Joled Inc 顯示器及其製造方法，單元，轉印方法，有機電致發光單元及其製造方法，以及電子裝置
CN102778715B (zh) * 2012-05-11 2015-01-21 深圳市华星光电技术有限公司 彩色滤光片及其制作方法
WO2013180546A1 (ko) 2012-05-31 2013-12-05 주식회사 엘지화학 반전 오프셋 인쇄 장치 및 방법
US20150218394A1 (en) * 2012-08-07 2015-08-06 Lg Chem, Ltd. Printed matter and method for manufacturing such printed matter
JP6628250B2 (ja) 2013-03-15 2020-01-08 ユナイテッド テクノロジーズ コーポレイションＵｎｉｔｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 制御システム、制御されるデバイスを制御する方法、及びガスタービンエンジン
CN105451996B (zh) * 2013-10-16 2019-04-19 Lg化学株式会社 橡皮布及其制造设备和方法、反向平版印刷辊和印刷设备
KR102761503B1 (ko) * 2024-05-02 2025-02-04 (주)서린 수용성 바인더를 이용한 세라믹 소재의 제조방법 및 이에 따라 제조된 세라믹 물품

Citations (1)

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KR20050105048A (ko) * 2004-04-30 2005-11-03 엘지.필립스 엘시디 주식회사 인쇄방식을 이용한 패턴 형성방법

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US5272980A (en) * 1990-08-31 1993-12-28 Dai Nippon Printing Co. Ltd. Alignment method for transfer and alignment device
JPH04312889A (ja) * 1991-04-12 1992-11-04 Toppan Printing Co Ltd 印刷用凹版およびその製造方法
JPH04332694A (ja) * 1991-05-08 1992-11-19 Matsushita Electric Ind Co Ltd 凹版およびその製造方法
EP0730937B1 (en) * 1994-11-21 1998-02-18 Apic Yamada Corporation A resin molding machine with release film
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US20020001026A1 (en) * 2000-02-01 2002-01-03 Nobuyuki Ishikawa Production of organic luminescence device
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Also Published As

Publication number Publication date
WO2008127055A1 (en) 2008-10-23
TW200848267A (en) 2008-12-16
CN101657883A (zh) 2010-02-24
TWI388433B (zh) 2013-03-11
JP5044691B2 (ja) 2012-10-10
JP2010523378A (ja) 2010-07-15
KR20080092707A (ko) 2008-10-16
US20100139513A1 (en) 2010-06-10
CN101657883B (zh) 2012-06-06
US9365025B2 (en) 2016-06-14

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