CN101657883B - 用于形成精细图形的方法 - Google Patents
用于形成精细图形的方法 Download PDFInfo
- Publication number
- CN101657883B CN101657883B CN2008800119102A CN200880011910A CN101657883B CN 101657883 B CN101657883 B CN 101657883B CN 2008800119102 A CN2008800119102 A CN 2008800119102A CN 200880011910 A CN200880011910 A CN 200880011910A CN 101657883 B CN101657883 B CN 101657883B
- Authority
- CN
- China
- Prior art keywords
- forming
- master
- film
- fine patterns
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 54
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 230000000295 complement effect Effects 0.000 claims description 14
- 229920001971 elastomer Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- -1 polyethylene Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 description 10
- 238000007645 offset printing Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F3/00—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
- B41F3/02—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed with impression cylinder or cylinders rotating unidirectionally
- B41F3/06—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed with impression cylinder or cylinders rotating unidirectionally continuously
- B41F3/10—Two-revolution presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F3/00—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
- B41F3/18—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed of special construction or for particular purposes
- B41F3/36—Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed of special construction or for particular purposes for intaglio or heliogravure printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/003—Preparing for use and conserving printing surfaces of intaglio formes, e.g. application of a wear-resistant coating, such as chrome, on the already-engraved plate or cylinder; Preparing for reuse, e.g. removing of the Ballard shell; Correction of the engraving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Printing Methods (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0036402 | 2007-04-13 | ||
| KR1020070036402 | 2007-04-13 | ||
| KR1020070036402A KR100957703B1 (ko) | 2007-04-13 | 2007-04-13 | 미세패턴 형성 방법 |
| PCT/KR2008/002094 WO2008127055A1 (en) | 2007-04-13 | 2008-04-14 | Method for forming fine patterns |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101657883A CN101657883A (zh) | 2010-02-24 |
| CN101657883B true CN101657883B (zh) | 2012-06-06 |
Family
ID=39864104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800119102A Expired - Fee Related CN101657883B (zh) | 2007-04-13 | 2008-04-14 | 用于形成精细图形的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9365025B2 (enExample) |
| JP (1) | JP5044691B2 (enExample) |
| KR (1) | KR100957703B1 (enExample) |
| CN (1) | CN101657883B (enExample) |
| TW (1) | TWI388433B (enExample) |
| WO (1) | WO2008127055A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101733585B1 (ko) * | 2009-07-28 | 2017-05-11 | 삼성디스플레이 주식회사 | 잉크 패턴 형성 방법 및 잉크 패턴 인쇄 장치 |
| TWI519425B (zh) * | 2011-02-24 | 2016-02-01 | Lg化學股份有限公司 | 滾輪印刷設備及使用其之滾輪印刷方法 |
| CN103443214B (zh) | 2011-03-15 | 2016-01-20 | Lg化学株式会社 | 导电墨水组合物,使用该导电墨水组合物的印刷方法及由该导电墨水组合物制备的导电图案 |
| KR101324493B1 (ko) * | 2011-03-22 | 2013-11-01 | (주)뉴옵틱스 | 원통 금형에 패턴을 복제하는 방법 |
| TWI481510B (zh) * | 2011-06-10 | 2015-04-21 | Au Optronics Corp | 移印方法 |
| KR101094864B1 (ko) * | 2011-07-07 | 2011-12-15 | 한국기계연구원 | 일회용 클리쉐를 이용한 리버스 그라비아 옵셋 인쇄 방법 및 장치 |
| US20140198270A1 (en) * | 2011-12-23 | 2014-07-17 | Lg Chem, Ltd. | Touch panel and display device including same |
| TWI508279B (zh) * | 2012-01-19 | 2015-11-11 | Joled Inc | 顯示器及其製造方法,單元,轉印方法,有機電致發光單元及其製造方法,以及電子裝置 |
| CN102778715B (zh) * | 2012-05-11 | 2015-01-21 | 深圳市华星光电技术有限公司 | 彩色滤光片及其制作方法 |
| WO2013180546A1 (ko) | 2012-05-31 | 2013-12-05 | 주식회사 엘지화학 | 반전 오프셋 인쇄 장치 및 방법 |
| WO2014025164A1 (ko) * | 2012-08-07 | 2014-02-13 | 주식회사 엘지화학 | 인쇄물 및 인쇄물의 제조방법 |
| EP2973114A4 (en) | 2013-03-15 | 2016-11-02 | United Technologies Corp | COMPACT AERO-THERMOMODEL-BASED DEGRADED MODEL CONTROL |
| US10434809B2 (en) * | 2013-10-16 | 2019-10-08 | Lg Chem, Ltd. | Blanket manufacturing apparatus and blanket manufacturing method |
| KR102761503B1 (ko) * | 2024-05-02 | 2025-02-04 | (주)서린 | 수용성 바인더를 이용한 세라믹 소재의 제조방법 및 이에 따라 제조된 세라믹 물품 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0929927A (ja) | 1995-07-21 | 1997-02-04 | Sumitomo Rubber Ind Ltd | オフセット印刷機 |
| JPH11135916A (ja) | 1997-08-29 | 1999-05-21 | Corning Inc | 電極および電子回路パターンの印刷方法 |
| JP2006179215A (ja) * | 2004-12-21 | 2006-07-06 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子の製造方法及び凸版反転オフセット法用凸刷版 |
| JP2006272606A (ja) * | 2005-03-28 | 2006-10-12 | Toppan Printing Co Ltd | 反転オフセット印刷用凸版及び有機エレクトロルミネッセンス素子 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4034671A (en) * | 1975-01-13 | 1977-07-12 | A. B. Dick Company | Method of using an offset lithographic combination master blanket sheet |
| US5272980A (en) * | 1990-08-31 | 1993-12-28 | Dai Nippon Printing Co. Ltd. | Alignment method for transfer and alignment device |
| JPH04312889A (ja) * | 1991-04-12 | 1992-11-04 | Toppan Printing Co Ltd | 印刷用凹版およびその製造方法 |
| JPH04332694A (ja) * | 1991-05-08 | 1992-11-19 | Matsushita Electric Ind Co Ltd | 凹版およびその製造方法 |
| EP0730937B1 (en) * | 1994-11-21 | 1998-02-18 | Apic Yamada Corporation | A resin molding machine with release film |
| US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| JP2000221664A (ja) * | 1999-01-29 | 2000-08-11 | Yokodo:Kk | フレキソ印刷用樹脂版の製造方法 |
| SG97168A1 (en) * | 1999-12-15 | 2003-07-18 | Ciba Sc Holding Ag | Photosensitive resin composition |
| EP1122793A2 (en) * | 2000-02-01 | 2001-08-08 | Canon Kabushiki Kaisha | Production of organic luminescence device |
| US6584743B2 (en) * | 2000-04-20 | 2003-07-01 | Masonite Corporation | Decorative skirting (base) board or crown molding |
| US7595017B2 (en) * | 2002-01-31 | 2009-09-29 | Stmicroelectronics, Inc. | Method for using a pre-formed film in a transfer molding process for an integrated circuit |
| US6566039B1 (en) * | 2002-06-04 | 2003-05-20 | Gary Ganghui Teng | Variable data lithographic printing device and method |
| KR100914200B1 (ko) * | 2002-12-27 | 2009-08-27 | 엘지디스플레이 주식회사 | 액정 표시 소자의 제조 방법 |
| KR100631017B1 (ko) * | 2004-04-30 | 2006-10-04 | 엘지.필립스 엘시디 주식회사 | 인쇄방식을 이용한 패턴 형성방법 |
| KR100641006B1 (ko) * | 2004-11-04 | 2006-11-02 | 엘지.필립스 엘시디 주식회사 | 인쇄판 |
| JP2006327116A (ja) * | 2005-05-30 | 2006-12-07 | Meiji Rubber & Chem Co Ltd | 印刷用ブランケット |
| JP2006337952A (ja) * | 2005-06-06 | 2006-12-14 | Hitachi Chem Co Ltd | カラーフィルタの製造方法 |
| US20070178237A1 (en) | 2005-08-02 | 2007-08-02 | Shin Dong M | Method for patterning coatings |
| KR101147079B1 (ko) * | 2005-08-25 | 2012-05-17 | 엘지디스플레이 주식회사 | 인쇄판의 제조방법 |
-
2007
- 2007-04-13 KR KR1020070036402A patent/KR100957703B1/ko active Active
-
2008
- 2008-04-11 TW TW097113176A patent/TWI388433B/zh active
- 2008-04-14 US US12/595,683 patent/US9365025B2/en active Active
- 2008-04-14 WO PCT/KR2008/002094 patent/WO2008127055A1/en not_active Ceased
- 2008-04-14 JP JP2010502950A patent/JP5044691B2/ja not_active Expired - Fee Related
- 2008-04-14 CN CN2008800119102A patent/CN101657883B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0929927A (ja) | 1995-07-21 | 1997-02-04 | Sumitomo Rubber Ind Ltd | オフセット印刷機 |
| JPH11135916A (ja) | 1997-08-29 | 1999-05-21 | Corning Inc | 電極および電子回路パターンの印刷方法 |
| JP2006179215A (ja) * | 2004-12-21 | 2006-07-06 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子の製造方法及び凸版反転オフセット法用凸刷版 |
| JP2006272606A (ja) * | 2005-03-28 | 2006-10-12 | Toppan Printing Co Ltd | 反転オフセット印刷用凸版及び有機エレクトロルミネッセンス素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008127055A1 (en) | 2008-10-23 |
| JP5044691B2 (ja) | 2012-10-10 |
| US20100139513A1 (en) | 2010-06-10 |
| KR20080092707A (ko) | 2008-10-16 |
| CN101657883A (zh) | 2010-02-24 |
| KR100957703B1 (ko) | 2010-05-12 |
| US9365025B2 (en) | 2016-06-14 |
| JP2010523378A (ja) | 2010-07-15 |
| TW200848267A (en) | 2008-12-16 |
| TWI388433B (zh) | 2013-03-11 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120606 |