KR100918129B1 - 본드 패드를 갖는 상호 결선 구조체 및 본드 패드 상의범프 사이트 형성 방법 - Google Patents

본드 패드를 갖는 상호 결선 구조체 및 본드 패드 상의범프 사이트 형성 방법

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Publication number
KR100918129B1
KR100918129B1 KR1020077018441A KR20077018441A KR100918129B1 KR 100918129 B1 KR100918129 B1 KR 100918129B1 KR 1020077018441 A KR1020077018441 A KR 1020077018441A KR 20077018441 A KR20077018441 A KR 20077018441A KR 100918129 B1 KR100918129 B1 KR 100918129B1
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KR
South Korea
Prior art keywords
layer
dielectric layer
dielectric
workpiece
over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020077018441A
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English (en)
Korean (ko)
Other versions
KR20070096016A (ko
Inventor
산 디. 탕
마크. 이. 터틀
케이쓰 알. 쿡
Original Assignee
마이크론 테크놀로지, 인크
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Publication of KR20070096016A publication Critical patent/KR20070096016A/ko
Application granted granted Critical
Publication of KR100918129B1 publication Critical patent/KR100918129B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020077018441A 2005-01-10 2007-08-10 본드 패드를 갖는 상호 결선 구조체 및 본드 패드 상의범프 사이트 형성 방법 Expired - Lifetime KR100918129B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/032,975 2005-01-10
US11/032,975 US7282433B2 (en) 2005-01-10 2005-01-10 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Publications (2)

Publication Number Publication Date
KR20070096016A KR20070096016A (ko) 2007-10-01
KR100918129B1 true KR100918129B1 (ko) 2009-09-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077018441A Expired - Lifetime KR100918129B1 (ko) 2005-01-10 2007-08-10 본드 패드를 갖는 상호 결선 구조체 및 본드 패드 상의범프 사이트 형성 방법

Country Status (6)

Country Link
US (3) US7282433B2 (https=)
EP (2) EP3220416B1 (https=)
JP (1) JP5321873B2 (https=)
KR (1) KR100918129B1 (https=)
TW (1) TWI387018B (https=)
WO (1) WO2006074470A1 (https=)

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Also Published As

Publication number Publication date
EP3220416B1 (en) 2018-10-03
EP1842233A1 (en) 2007-10-10
US20060151880A1 (en) 2006-07-13
TWI387018B (zh) 2013-02-21
US20080032494A1 (en) 2008-02-07
US7528064B2 (en) 2009-05-05
EP1842233B1 (en) 2017-05-24
JP5321873B2 (ja) 2013-10-23
JP2008527727A (ja) 2008-07-24
EP3220416A1 (en) 2017-09-20
WO2006074470A1 (en) 2006-07-13
US7282433B2 (en) 2007-10-16
WO2006074470B1 (en) 2006-11-16
TW200629451A (en) 2006-08-16
US7939948B2 (en) 2011-05-10
US20090179330A1 (en) 2009-07-16
KR20070096016A (ko) 2007-10-01

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