KR100904197B1 - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

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Publication number
KR100904197B1
KR100904197B1 KR1020070085468A KR20070085468A KR100904197B1 KR 100904197 B1 KR100904197 B1 KR 100904197B1 KR 1020070085468 A KR1020070085468 A KR 1020070085468A KR 20070085468 A KR20070085468 A KR 20070085468A KR 100904197 B1 KR100904197 B1 KR 100904197B1
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KR
South Korea
Prior art keywords
integrated circuit
semiconductor integrated
pattern
semiconductor
semiconductor device
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KR1020070085468A
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English (en)
Korean (ko)
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KR20080022041A (ko
Inventor
유키히로 다네무라
Original Assignee
미쓰미덴기가부시기가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
    • H10W20/494—Fuses, i.e. interconnections changeable from conductive to non-conductive changeable by the use of an external beam, e.g. laser beam or ion beam
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H10W46/503—Located in scribe lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laser Beam Processing (AREA)
KR1020070085468A 2006-09-05 2007-08-24 반도체 장치 및 그 제조 방법 Expired - Fee Related KR100904197B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006240324A JP5076407B2 (ja) 2006-09-05 2006-09-05 半導体装置及びその製造方法
JPJP-P-2006-00240324 2006-09-05

Publications (2)

Publication Number Publication Date
KR20080022041A KR20080022041A (ko) 2008-03-10
KR100904197B1 true KR100904197B1 (ko) 2009-06-23

Family

ID=39288840

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070085468A Expired - Fee Related KR100904197B1 (ko) 2006-09-05 2007-08-24 반도체 장치 및 그 제조 방법

Country Status (4)

Country Link
US (1) US7781901B2 (https=)
JP (1) JP5076407B2 (https=)
KR (1) KR100904197B1 (https=)
TW (1) TW200818292A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006019911A1 (en) * 2004-07-26 2006-02-23 Sun Microsystems, Inc. Multi-chip module and single-chip module for chips and proximity connectors
JP5263918B2 (ja) * 2007-07-24 2013-08-14 日本電気株式会社 半導体装置及びその製造方法
JP5353035B2 (ja) * 2008-03-17 2013-11-27 富士電機株式会社 半導体装置およびその製造方法
JP5266857B2 (ja) * 2008-04-24 2013-08-21 ミツミ電機株式会社 チップのアライメント方法
JP2010074106A (ja) * 2008-09-22 2010-04-02 Nec Electronics Corp 半導体チップ、半導体ウェーハおよびそのダイシング方法
JP2013157385A (ja) * 2012-01-27 2013-08-15 Semiconductor Components Industries Llc 半導体装置及びその自動外観検査方法
WO2017027505A1 (en) * 2015-08-10 2017-02-16 Delta Design, Inc. Ic device-in-pocket detection with angular mounted lasers and a camera
KR102403730B1 (ko) 2018-01-22 2022-05-30 삼성전자주식회사 반도체 칩 및 이를 포함하는 반도체 패키지
CN113394193B (zh) * 2020-03-13 2022-03-22 长鑫存储技术有限公司 半导体结构及其形成方法、激光熔丝的熔断方法
KR102507592B1 (ko) * 2021-05-24 2023-03-09 한국과학기술원 Mems 소자의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000001960A (ko) * 1998-06-16 2000-01-15 김영환 반도체 장치
KR20000026310A (ko) * 1998-10-20 2000-05-15 김영환 반도체장치
KR20030073378A (ko) * 2002-03-11 2003-09-19 삼성전자주식회사 반도체 장치의 퓨즈 박스 및 그 제조방법
KR20060043788A (ko) * 2004-03-05 2006-05-15 산요덴키가부시키가이샤 반도체 장치 및 그 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01243419A (ja) * 1988-03-25 1989-09-28 Hitachi Ltd 位置合わせ方法
JPH1012527A (ja) * 1996-06-26 1998-01-16 Hitachi Ltd 半導体チップおよび半導体製造用レチクル
JP3566133B2 (ja) 1999-05-11 2004-09-15 セイコーインスツルメンツ株式会社 半導体装置の製造方法
US6441504B1 (en) * 2000-04-25 2002-08-27 Amkor Technology, Inc. Precision aligned and marked structure
US7053495B2 (en) * 2001-09-17 2006-05-30 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit device and method for fabricating the same
US6815838B2 (en) * 2002-02-20 2004-11-09 International Business Machines Corporation Laser alignment target and method
JP2005109145A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 半導体装置
JP4673569B2 (ja) * 2004-03-31 2011-04-20 株式会社リコー 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000001960A (ko) * 1998-06-16 2000-01-15 김영환 반도체 장치
KR20000026310A (ko) * 1998-10-20 2000-05-15 김영환 반도체장치
KR20030073378A (ko) * 2002-03-11 2003-09-19 삼성전자주식회사 반도체 장치의 퓨즈 박스 및 그 제조방법
KR20060043788A (ko) * 2004-03-05 2006-05-15 산요덴키가부시키가이샤 반도체 장치 및 그 제조 방법

Also Published As

Publication number Publication date
KR20080022041A (ko) 2008-03-10
US20080251950A1 (en) 2008-10-16
TWI344175B (https=) 2011-06-21
JP2008066381A (ja) 2008-03-21
JP5076407B2 (ja) 2012-11-21
TW200818292A (en) 2008-04-16
US7781901B2 (en) 2010-08-24

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