KR100885013B1 - 박막 트랜지스터 및 액정 표시 장치 - Google Patents
박막 트랜지스터 및 액정 표시 장치 Download PDFInfo
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- KR100885013B1 KR100885013B1 KR1020020000179A KR20020000179A KR100885013B1 KR 100885013 B1 KR100885013 B1 KR 100885013B1 KR 1020020000179 A KR1020020000179 A KR 1020020000179A KR 20020000179 A KR20020000179 A KR 20020000179A KR 100885013 B1 KR100885013 B1 KR 100885013B1
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- thin film
- crystal grains
- growth direction
- driving circuit
- film transistor
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- 239000010409 thin film Substances 0.000 title claims abstract description 85
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 25
- 239000013078 crystal Substances 0.000 claims abstract description 29
- 238000002425 crystallisation Methods 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000007787 solid Substances 0.000 claims abstract description 9
- 239000010408 film Substances 0.000 claims abstract description 5
- 238000009413 insulation Methods 0.000 claims 2
- 230000008025 crystallization Effects 0.000 abstract description 18
- 239000007790 solid phase Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 25
- 229910021417 amorphous silicon Inorganic materials 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/10—Materials and properties semiconductor
- G02F2202/104—Materials and properties semiconductor poly-Si
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
- H01L21/0268—Shape of mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
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- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (6)
- 절연 기판,상기 절연 기판 위에 상기 기판 면과 평행한 방향으로 결정립이 성장하여 형성된 다결정 규소의 박막으로 이루어지고, 채널 영역과 상기 채널 영역의 양쪽에 위치하는 소스 영역 및 드레인 영역을 포함하는 반도체 패턴,상기 반도체 패턴을 덮는 게이트 절연막,상기 게이트 절연막 위에 상기 채널 영역에 중첩하여 형성되고,상기 결정립의 성장 방향과 교차하는 교차 부분 및 상기 결정립의 성장 방향과 평행하고 상기 교차 부분의 끝단에 연결된 평행 부분을 가지는 게이트 전극을 포함하는 박막 트랜지스터.
- 제1항에서,상기 교차 부분은 상기 결정립의 성장 방향과 수직으로 교차하는 박막 트랜지스터.
- 제2항에서,상기 교차부분은 상기 평행 부분의 양측에 연결되어 있는 제1 및 제2 교차 부분으로 이루어지는 박막 트랜지스터.
- 제2항에서,상기 평행 부분은 상기 교차 영역의 양측에 연결되어 있는 제1 및 제2 평행 부분으로 이루어지는 박막 트랜지스터.
- 절연 기판,상기 절연 기판 위에 정의되어 있고, 화면을 표시하는 표시 영역,상기 절연 기판 위에 정의되어 있고, 상기 표시 영역에 데이터 신호를 전송하는 데이터 구동회로부,상기 절연 기판 위에 정의되어 있고, 상기 표시 영역에 게이트 신호를 전송하는 게이트 구동회로부를 포함하며,상기 데이터 구동회로부를 구성하는 다수개의 박막 트랜지스터는 순차적 측면 고상 결정화법에 의하여 형성된 다결정 규소의 박막으로 형성되고, 상기 박막 트랜지스터의 채널 길이 방향은 상기 결정립의 성장 방향과 교차하는 제1 부분과 상기 결정립의 성장 방향과 평행하고 상기 제1 부분의 끝단에 연결된 제2 부분을 가지는 액정 표시 장치.
- 제5항에서,상기 게이트 구동회로부를 구성하는 다수개의 박막 트랜지스터는 순차적 측면 고상 결정화법에 의하여 형성된 다결정 규소의 박막으로 형성되고, 상기 박막 트랜지스터의 채널 길이 방향은 상기 결정립의 성장 방향과 교차하는 제1 방향과, 상기 결정립의 성장 방향과 평행한 제2 방향을 가지는 액정 표시 장치.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020000179A KR100885013B1 (ko) | 2002-01-03 | 2002-01-03 | 박막 트랜지스터 및 액정 표시 장치 |
US10/500,514 US7183574B2 (en) | 2002-01-03 | 2003-01-03 | Thin film transistor with gate electrode portion crossing grain growing direction and liquid crystal display comprising the same |
CN038042479A CN1636162B (zh) | 2002-01-03 | 2003-01-03 | 薄膜晶体管和液晶显示器 |
JP2003560639A JP2005515622A (ja) | 2002-01-03 | 2003-01-03 | 薄膜トランジスタ及び液晶表示装置 |
AU2003201767A AU2003201767A1 (en) | 2002-01-03 | 2003-01-03 | Thin film transistor and liquid crystal display |
PCT/KR2003/000008 WO2003060602A1 (en) | 2002-01-03 | 2003-01-03 | Thin film transistor and liquid crystal display |
US11/621,277 US7538349B2 (en) | 2002-01-03 | 2007-01-09 | Thin film transistor having a three-portion gate electrode and liquid crystal display using the same |
JP2009005777A JP4394737B2 (ja) | 2002-01-03 | 2009-01-14 | 薄膜トランジスタ及び液晶表示装置 |
US12/469,256 US7791076B2 (en) | 2002-01-03 | 2009-05-20 | Thin film transistor having a three-portion gate electrode and liquid crystal display using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020000179A KR100885013B1 (ko) | 2002-01-03 | 2002-01-03 | 박막 트랜지스터 및 액정 표시 장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080126769A Division KR20080110978A (ko) | 2008-12-12 | 2008-12-12 | 박막 트랜지스터 및 액정 표시 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030059593A KR20030059593A (ko) | 2003-07-10 |
KR100885013B1 true KR100885013B1 (ko) | 2009-02-20 |
Family
ID=19718119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020000179A KR100885013B1 (ko) | 2002-01-03 | 2002-01-03 | 박막 트랜지스터 및 액정 표시 장치 |
Country Status (6)
Country | Link |
---|---|
US (3) | US7183574B2 (ko) |
JP (2) | JP2005515622A (ko) |
KR (1) | KR100885013B1 (ko) |
CN (1) | CN1636162B (ko) |
AU (1) | AU2003201767A1 (ko) |
WO (1) | WO2003060602A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100767380B1 (ko) * | 2001-12-05 | 2007-10-17 | 삼성전자주식회사 | 박막 트랜지스터 |
KR100831227B1 (ko) * | 2001-12-17 | 2008-05-21 | 삼성전자주식회사 | 다결정 규소를 이용한 박막 트랜지스터의 제조 방법 |
KR100885013B1 (ko) * | 2002-01-03 | 2009-02-20 | 삼성전자주식회사 | 박막 트랜지스터 및 액정 표시 장치 |
CN1324540C (zh) | 2003-06-05 | 2007-07-04 | 三星Sdi株式会社 | 具有多晶硅薄膜晶体管的平板显示装置 |
KR101136311B1 (ko) * | 2005-06-21 | 2012-04-19 | 엘지디스플레이 주식회사 | 액정표시장치 |
US7573104B2 (en) * | 2006-03-06 | 2009-08-11 | International Business Machines Corporation | CMOS device on hybrid orientation substrate comprising equal mobility for perpendicular devices of each type |
TWI361492B (en) * | 2008-07-25 | 2012-04-01 | Au Optronics Corp | Thin film transistor substrate, electric apparatus, and method for fabricating the same |
EP2804350B1 (en) | 2009-04-01 | 2019-07-24 | Nicira, Inc. | Method and apparatus for implementing and managing virtual switches |
KR101443153B1 (ko) * | 2011-07-12 | 2014-09-19 | 엘지디스플레이 주식회사 | 유기전계 발광소자 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349735A (ja) * | 1993-06-12 | 1994-12-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
KR0183063B1 (ko) * | 1993-05-26 | 1999-03-20 | 야마자끼 순페이 | 반도체장치 및 그 제조방법 |
JPH11289096A (ja) * | 1993-05-26 | 1999-10-19 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ |
KR20010071526A (ko) * | 1998-07-06 | 2001-07-28 | 모리시타 요이찌 | 박막 트랜지스터와 액정표시장치 |
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JP2594983B2 (ja) * | 1987-11-10 | 1997-03-26 | カシオ計算機株式会社 | 薄膜トランジスタの製造方法 |
JPH07321328A (ja) * | 1994-05-27 | 1995-12-08 | Hitachi Ltd | 薄膜トランジスタ駆動液晶表示装置およびその製法 |
WO1997045827A1 (en) * | 1996-05-28 | 1997-12-04 | The Trustees Of Columbia University In The City Of New York | Crystallization processing of semiconductor film regions on a substrate, and devices made therewith |
KR100244467B1 (ko) * | 1997-05-07 | 2000-02-01 | 김영환 | 박막트랜지스터 및 그 제조방법 |
US5811855A (en) * | 1997-12-29 | 1998-09-22 | United Technologies Corporation | SOI combination body tie |
KR100292048B1 (ko) * | 1998-06-09 | 2001-07-12 | 구본준, 론 위라하디락사 | 박막트랜지스터액정표시장치의제조방법 |
JP2000243970A (ja) * | 1999-02-24 | 2000-09-08 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタとその製造方法及びそれを用いた液晶表示装置とその製造方法 |
JP4366732B2 (ja) * | 1998-09-30 | 2009-11-18 | ソニー株式会社 | 電気光学装置の製造方法及び電気光学装置用の駆動基板の製造方法 |
TWI243432B (en) * | 1999-10-29 | 2005-11-11 | Hitachi Ltd | Semiconductor device, method of making the same and liquid crystal display device |
KR100885013B1 (ko) * | 2002-01-03 | 2009-02-20 | 삼성전자주식회사 | 박막 트랜지스터 및 액정 표시 장치 |
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2002
- 2002-01-03 KR KR1020020000179A patent/KR100885013B1/ko active IP Right Grant
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2003
- 2003-01-03 CN CN038042479A patent/CN1636162B/zh not_active Expired - Lifetime
- 2003-01-03 US US10/500,514 patent/US7183574B2/en not_active Expired - Lifetime
- 2003-01-03 WO PCT/KR2003/000008 patent/WO2003060602A1/en active Application Filing
- 2003-01-03 AU AU2003201767A patent/AU2003201767A1/en not_active Abandoned
- 2003-01-03 JP JP2003560639A patent/JP2005515622A/ja active Pending
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2007
- 2007-01-09 US US11/621,277 patent/US7538349B2/en active Active
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2009
- 2009-01-14 JP JP2009005777A patent/JP4394737B2/ja not_active Expired - Lifetime
- 2009-05-20 US US12/469,256 patent/US7791076B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0183063B1 (ko) * | 1993-05-26 | 1999-03-20 | 야마자끼 순페이 | 반도체장치 및 그 제조방법 |
JPH11289096A (ja) * | 1993-05-26 | 1999-10-19 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ |
JPH06349735A (ja) * | 1993-06-12 | 1994-12-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
KR20010071526A (ko) * | 1998-07-06 | 2001-07-28 | 모리시타 요이찌 | 박막 트랜지스터와 액정표시장치 |
Also Published As
Publication number | Publication date |
---|---|
US7183574B2 (en) | 2007-02-27 |
CN1636162A (zh) | 2005-07-06 |
KR20030059593A (ko) | 2003-07-10 |
WO2003060602A1 (en) | 2003-07-24 |
US20070108447A1 (en) | 2007-05-17 |
US7538349B2 (en) | 2009-05-26 |
US20090224262A1 (en) | 2009-09-10 |
JP4394737B2 (ja) | 2010-01-06 |
US20050083445A1 (en) | 2005-04-21 |
JP2005515622A (ja) | 2005-05-26 |
CN1636162B (zh) | 2010-05-26 |
AU2003201767A1 (en) | 2003-07-30 |
US7791076B2 (en) | 2010-09-07 |
JP2009124163A (ja) | 2009-06-04 |
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