KR100882178B1 - 밀봉 장치 및 밀봉 방법 - Google Patents

밀봉 장치 및 밀봉 방법 Download PDF

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Publication number
KR100882178B1
KR100882178B1 KR1020077011522A KR20077011522A KR100882178B1 KR 100882178 B1 KR100882178 B1 KR 100882178B1 KR 1020077011522 A KR1020077011522 A KR 1020077011522A KR 20077011522 A KR20077011522 A KR 20077011522A KR 100882178 B1 KR100882178 B1 KR 100882178B1
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KR
South Korea
Prior art keywords
sealing
ultraviolet
resin
chamber
curable resin
Prior art date
Application number
KR1020077011522A
Other languages
English (en)
Korean (ko)
Other versions
KR20070072602A (ko
Inventor
도시오 네기시
Original Assignee
가부시키가이샤 알박
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Publication date
Application filed by 가부시키가이샤 알박 filed Critical 가부시키가이샤 알박
Publication of KR20070072602A publication Critical patent/KR20070072602A/ko
Application granted granted Critical
Publication of KR100882178B1 publication Critical patent/KR100882178B1/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
KR1020077011522A 2005-06-15 2006-06-12 밀봉 장치 및 밀봉 방법 KR100882178B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00175632 2005-06-15
JP2005175632 2005-06-15

Publications (2)

Publication Number Publication Date
KR20070072602A KR20070072602A (ko) 2007-07-04
KR100882178B1 true KR100882178B1 (ko) 2009-02-06

Family

ID=37532225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077011522A KR100882178B1 (ko) 2005-06-15 2006-06-12 밀봉 장치 및 밀봉 방법

Country Status (5)

Country Link
JP (1) JP4827842B2 (ja)
KR (1) KR100882178B1 (ja)
CN (1) CN100514707C (ja)
TW (1) TWI422027B (ja)
WO (1) WO2006134863A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102012581B (zh) * 2010-09-30 2012-08-22 深圳市华星光电技术有限公司 液晶盒成盒装置及其方法
WO2012053532A1 (ja) * 2010-10-20 2012-04-26 株式会社アルバック 有機膜形成装置及び有機膜形成方法
CN102184935B (zh) * 2011-04-02 2012-08-08 东莞宏威数码机械有限公司 Oled显示屏封装设备及压合封装的方法
CN102270742B (zh) * 2011-08-29 2013-04-17 电子科技大学 一种有机光电器件封装器及器件封装方法
JP6066055B2 (ja) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 有機ｅｌ封止装置
JP6066054B2 (ja) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 有機ｅｌ封止装置、封止ロールフィルム製作装置及び有機ｅｌ封止システム
CN104051495B (zh) 2014-05-28 2017-02-15 京东方科技集团股份有限公司 封装装置和封装设备
WO2016147536A1 (ja) * 2015-03-16 2016-09-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US10416231B2 (en) * 2015-03-16 2019-09-17 Seiko Epson Corporation Electronic component transport apparatus and electronic component inspection apparatus
CN104821377B (zh) 2015-05-05 2017-07-21 合肥京东方光电科技有限公司 贴片封装装置及方法
CN106654061B (zh) 2016-12-26 2019-04-02 武汉华星光电技术有限公司 一种用于发光二极管封装的紫外线照射装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027213A (ja) * 2001-07-06 2003-01-29 Nippon Seiki Co Ltd 有機ｅｌパネルの製造方法。
KR20040012723A (ko) * 2001-06-14 2004-02-11 미쓰보시 다이야몬도 고교 가부시키가이샤 유기이엘 디스플레이 제조장치 및 유기이엘 디스플레이의제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4785269B2 (ja) * 2000-05-02 2011-10-05 株式会社半導体エネルギー研究所 発光装置の作製方法及び成膜装置のクリーニング方法
JP2002203682A (ja) * 2000-10-26 2002-07-19 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法
JP2002322556A (ja) * 2001-02-21 2002-11-08 Semiconductor Energy Lab Co Ltd 成膜方法及び成膜装置
JP2003086355A (ja) * 2001-09-05 2003-03-20 Kiko Kenji Kagi Kofun Yugenkoshi 有機ｅｌ素子の封止構造並びに封止方法及び封止装置
JP4450589B2 (ja) * 2003-09-09 2010-04-14 株式会社アルバック 成膜装置
JP4327544B2 (ja) * 2003-09-24 2009-09-09 株式会社アルバック 成膜装置
KR100558558B1 (ko) * 2004-01-26 2006-03-10 삼성전자주식회사 멀티챔버 프로세스장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040012723A (ko) * 2001-06-14 2004-02-11 미쓰보시 다이야몬도 고교 가부시키가이샤 유기이엘 디스플레이 제조장치 및 유기이엘 디스플레이의제조방법
JP2003027213A (ja) * 2001-07-06 2003-01-29 Nippon Seiki Co Ltd 有機ｅｌパネルの製造方法。

Also Published As

Publication number Publication date
TWI422027B (zh) 2014-01-01
CN101069453A (zh) 2007-11-07
JPWO2006134863A1 (ja) 2009-01-08
TW200707721A (en) 2007-02-16
WO2006134863A1 (ja) 2006-12-21
KR20070072602A (ko) 2007-07-04
CN100514707C (zh) 2009-07-15
JP4827842B2 (ja) 2011-11-30

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