CN100514707C - 密封装置及密封方法 - Google Patents

密封装置及密封方法 Download PDF

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Publication number
CN100514707C
CN100514707C CNB2006800013289A CN200680001328A CN100514707C CN 100514707 C CN100514707 C CN 100514707C CN B2006800013289 A CNB2006800013289 A CN B2006800013289A CN 200680001328 A CN200680001328 A CN 200680001328A CN 100514707 C CN100514707 C CN 100514707C
Authority
CN
China
Prior art keywords
mentioned
sealing
transport mechanism
sealed object
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006800013289A
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English (en)
Chinese (zh)
Other versions
CN101069453A (zh
Inventor
根岸敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN101069453A publication Critical patent/CN101069453A/zh
Application granted granted Critical
Publication of CN100514707C publication Critical patent/CN100514707C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
CNB2006800013289A 2005-06-15 2006-06-12 密封装置及密封方法 Expired - Fee Related CN100514707C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005175632 2005-06-15
JP175632/2005 2005-06-15

Publications (2)

Publication Number Publication Date
CN101069453A CN101069453A (zh) 2007-11-07
CN100514707C true CN100514707C (zh) 2009-07-15

Family

ID=37532225

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006800013289A Expired - Fee Related CN100514707C (zh) 2005-06-15 2006-06-12 密封装置及密封方法

Country Status (5)

Country Link
JP (1) JP4827842B2 (ja)
KR (1) KR100882178B1 (ja)
CN (1) CN100514707C (ja)
TW (1) TWI422027B (ja)
WO (1) WO2006134863A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102012581B (zh) * 2010-09-30 2012-08-22 深圳市华星光电技术有限公司 液晶盒成盒装置及其方法
WO2012053532A1 (ja) * 2010-10-20 2012-04-26 株式会社アルバック 有機膜形成装置及び有機膜形成方法
CN102184935B (zh) * 2011-04-02 2012-08-08 东莞宏威数码机械有限公司 Oled显示屏封装设备及压合封装的方法
CN102270742B (zh) * 2011-08-29 2013-04-17 电子科技大学 一种有机光电器件封装器及器件封装方法
JP6066055B2 (ja) * 2012-12-06 2017-01-25 Aiメカテック株式会社 有機el封止装置
JP6066054B2 (ja) * 2012-12-06 2017-01-25 Aiメカテック株式会社 有機el封止装置、封止ロールフィルム製作装置及び有機el封止システム
CN104051495B (zh) 2014-05-28 2017-02-15 京东方科技集团股份有限公司 封装装置和封装设备
WO2016147536A1 (ja) * 2015-03-16 2016-09-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US10416231B2 (en) * 2015-03-16 2019-09-17 Seiko Epson Corporation Electronic component transport apparatus and electronic component inspection apparatus
CN104821377B (zh) 2015-05-05 2017-07-21 合肥京东方光电科技有限公司 贴片封装装置及方法
CN106654061B (zh) 2016-12-26 2019-04-02 武汉华星光电技术有限公司 一种用于发光二极管封装的紫外线照射装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4785269B2 (ja) * 2000-05-02 2011-10-05 株式会社半導体エネルギー研究所 発光装置の作製方法及び成膜装置のクリーニング方法
JP2002203682A (ja) * 2000-10-26 2002-07-19 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法
JP2002322556A (ja) * 2001-02-21 2002-11-08 Semiconductor Energy Lab Co Ltd 成膜方法及び成膜装置
JP3602847B2 (ja) * 2001-06-14 2004-12-15 三星ダイヤモンド工業株式会社 有機elディスプレイ製造装置及び有機elディスプレイの製造方法
JP3811943B2 (ja) * 2001-07-06 2006-08-23 日本精機株式会社 有機elパネルの製造方法。
JP2003086355A (ja) * 2001-09-05 2003-03-20 Kiko Kenji Kagi Kofun Yugenkoshi 有機el素子の封止構造並びに封止方法及び封止装置
JP4450589B2 (ja) * 2003-09-09 2010-04-14 株式会社アルバック 成膜装置
JP4327544B2 (ja) * 2003-09-24 2009-09-09 株式会社アルバック 成膜装置
KR100558558B1 (ko) * 2004-01-26 2006-03-10 삼성전자주식회사 멀티챔버 프로세스장치

Also Published As

Publication number Publication date
TWI422027B (zh) 2014-01-01
CN101069453A (zh) 2007-11-07
JPWO2006134863A1 (ja) 2009-01-08
TW200707721A (en) 2007-02-16
KR100882178B1 (ko) 2009-02-06
WO2006134863A1 (ja) 2006-12-21
KR20070072602A (ko) 2007-07-04
JP4827842B2 (ja) 2011-11-30

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Granted publication date: 20090715

Termination date: 20210612