KR20070072602A - 밀봉 장치 및 밀봉 방법 - Google Patents
밀봉 장치 및 밀봉 방법 Download PDFInfo
- Publication number
- KR20070072602A KR20070072602A KR1020077011522A KR20077011522A KR20070072602A KR 20070072602 A KR20070072602 A KR 20070072602A KR 1020077011522 A KR1020077011522 A KR 1020077011522A KR 20077011522 A KR20077011522 A KR 20077011522A KR 20070072602 A KR20070072602 A KR 20070072602A
- Authority
- KR
- South Korea
- Prior art keywords
- sealing
- ultraviolet
- chamber
- resin
- curable resin
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims abstract description 20
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 35
- 239000011521 glass Substances 0.000 abstract description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 5
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 4
- 239000005394 sealing glass Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 5
- 238000009489 vacuum treatment Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
Description
Claims (7)
- 밀봉용 불활성 가스를 도입 가능한 진공 처리조와,상기 진공 처리조 내에 있어서 자외선 경화 수지에 의해 접합된 한 쌍의 밀봉 대상물을 당해 진공 처리조로부터 반출하여 자외선 조사 위치에 이동시키는 반송 기구와,상기 진공 처리조로부터 반출된 상기 밀봉 대상물의 상기 자외선 경화 수지에 대해서 자외선을 조사하는 자외선 조사 수단을 갖는, 밀봉 장치.
- 제 1 항에 있어서,상기 반송 기구 상에 상기 밀봉 대상물을 탑재하여 가압 접합을 실시하도록 구성되어 있는, 밀봉 장치.
- 제 2 항에 있어서,상기 반송 기구에, 자외선 투과용의 창부가 형성되어 있는, 밀봉 장치.
- 제 1 항에 있어서,상기 자외선 조사 수단을 배치한 UV 조사실을 가지고, 상기 진공 처리조로부터 반출된 상기 밀봉 대상물을 상기 UV 조사실 내에 반입하여 자외선의 조사를 실시하도록 구성되어 있는, 밀봉 장치.
- 진공인 밀봉용 불활성 가스 분위기에서, 한 쌍의 밀봉 대상물을 자외선 경화 수지에 의해 접합시켜 밀봉 대상 부분의 주위를 밀봉하는 공정과,당해 밀봉된 구조의 상기 밀봉 대상물을 이동시켜 대기압 하에 배치하고, 상기 밀봉 대상물의 상기 자외선 경화 수지에 대해서 자외선을 조사하여 경화시키는 공정을 갖는, 밀봉 방법.
- 진공인 밀봉용 불활성 가스 분위기에서, 한 쌍의 밀봉 대상물을 자외선 경화 수지에 의해 접합시켜 밀봉 대상 부분의 주위를 밀봉하는 공정과,당해 밀봉된 구조의 상기 밀봉 대상물을 이동시켜 가압 하에 배치하고, 상기 밀봉 대상물의 상기 자외선 경화 수지에 대해서 자외선을 조사하여 경화시키는 공정을 갖는, 밀봉 방법.
- 제 5 항에 있어서,상기 밀봉 대상 부분이 유기 EL 소자인, 밀봉 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00175632 | 2005-06-15 | ||
JP2005175632 | 2005-06-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070072602A true KR20070072602A (ko) | 2007-07-04 |
KR100882178B1 KR100882178B1 (ko) | 2009-02-06 |
Family
ID=37532225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077011522A KR100882178B1 (ko) | 2005-06-15 | 2006-06-12 | 밀봉 장치 및 밀봉 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4827842B2 (ko) |
KR (1) | KR100882178B1 (ko) |
CN (1) | CN100514707C (ko) |
TW (1) | TWI422027B (ko) |
WO (1) | WO2006134863A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102012581B (zh) * | 2010-09-30 | 2012-08-22 | 深圳市华星光电技术有限公司 | 液晶盒成盒装置及其方法 |
WO2012053532A1 (ja) * | 2010-10-20 | 2012-04-26 | 株式会社アルバック | 有機膜形成装置及び有機膜形成方法 |
CN102184935B (zh) * | 2011-04-02 | 2012-08-08 | 东莞宏威数码机械有限公司 | Oled显示屏封装设备及压合封装的方法 |
CN102270742B (zh) * | 2011-08-29 | 2013-04-17 | 电子科技大学 | 一种有机光电器件封装器及器件封装方法 |
JP6066055B2 (ja) * | 2012-12-06 | 2017-01-25 | Aiメカテック株式会社 | 有機el封止装置 |
JP6066054B2 (ja) * | 2012-12-06 | 2017-01-25 | Aiメカテック株式会社 | 有機el封止装置、封止ロールフィルム製作装置及び有機el封止システム |
CN104051495B (zh) | 2014-05-28 | 2017-02-15 | 京东方科技集团股份有限公司 | 封装装置和封装设备 |
WO2016147536A1 (ja) * | 2015-03-16 | 2016-09-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
US10416231B2 (en) * | 2015-03-16 | 2019-09-17 | Seiko Epson Corporation | Electronic component transport apparatus and electronic component inspection apparatus |
CN104821377B (zh) | 2015-05-05 | 2017-07-21 | 合肥京东方光电科技有限公司 | 贴片封装装置及方法 |
CN106654061B (zh) | 2016-12-26 | 2019-04-02 | 武汉华星光电技术有限公司 | 一种用于发光二极管封装的紫外线照射装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4785269B2 (ja) * | 2000-05-02 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法及び成膜装置のクリーニング方法 |
JP2002203682A (ja) * | 2000-10-26 | 2002-07-19 | Semiconductor Energy Lab Co Ltd | 発光装置及びその作製方法 |
JP2002322556A (ja) * | 2001-02-21 | 2002-11-08 | Semiconductor Energy Lab Co Ltd | 成膜方法及び成膜装置 |
JP3602847B2 (ja) * | 2001-06-14 | 2004-12-15 | 三星ダイヤモンド工業株式会社 | 有機elディスプレイ製造装置及び有機elディスプレイの製造方法 |
JP3811943B2 (ja) * | 2001-07-06 | 2006-08-23 | 日本精機株式会社 | 有機elパネルの製造方法。 |
JP2003086355A (ja) * | 2001-09-05 | 2003-03-20 | Kiko Kenji Kagi Kofun Yugenkoshi | 有機el素子の封止構造並びに封止方法及び封止装置 |
JP4450589B2 (ja) * | 2003-09-09 | 2010-04-14 | 株式会社アルバック | 成膜装置 |
JP4327544B2 (ja) * | 2003-09-24 | 2009-09-09 | 株式会社アルバック | 成膜装置 |
KR100558558B1 (ko) * | 2004-01-26 | 2006-03-10 | 삼성전자주식회사 | 멀티챔버 프로세스장치 |
-
2006
- 2006-06-12 WO PCT/JP2006/311738 patent/WO2006134863A1/ja active Application Filing
- 2006-06-12 CN CNB2006800013289A patent/CN100514707C/zh not_active Expired - Fee Related
- 2006-06-12 JP JP2007521270A patent/JP4827842B2/ja active Active
- 2006-06-12 KR KR1020077011522A patent/KR100882178B1/ko active IP Right Grant
- 2006-06-14 TW TW095121270A patent/TWI422027B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI422027B (zh) | 2014-01-01 |
CN101069453A (zh) | 2007-11-07 |
JPWO2006134863A1 (ja) | 2009-01-08 |
TW200707721A (en) | 2007-02-16 |
KR100882178B1 (ko) | 2009-02-06 |
WO2006134863A1 (ja) | 2006-12-21 |
CN100514707C (zh) | 2009-07-15 |
JP4827842B2 (ja) | 2011-11-30 |
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