KR100866180B1 - 프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물 - Google Patents

프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물 Download PDF

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Publication number
KR100866180B1
KR100866180B1 KR1020037012448A KR20037012448A KR100866180B1 KR 100866180 B1 KR100866180 B1 KR 100866180B1 KR 1020037012448 A KR1020037012448 A KR 1020037012448A KR 20037012448 A KR20037012448 A KR 20037012448A KR 100866180 B1 KR100866180 B1 KR 100866180B1
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South Korea
Prior art keywords
resin composition
photosensitive resin
wiring board
printed wiring
plating
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Expired - Lifetime
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KR1020037012448A
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English (en)
Korean (ko)
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KR20040030544A (ko
Inventor
아카호리토시히코
사와베켄
나토리미치코
아오키토모아키
카지와라타쿠야
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히다치 가세고교 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020037012448A 2001-03-29 2002-03-29 프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물 Expired - Lifetime KR100866180B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00096367 2001-03-29
JP2001096367 2001-03-29
PCT/JP2002/003147 WO2002079877A1 (en) 2001-03-29 2002-03-29 Method for manufacturing printeed wiring board and photosensitive resin composition to be used for it

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020087009994A Division KR100884438B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조에 사용되는 감광성 수지조성물

Publications (2)

Publication Number Publication Date
KR20040030544A KR20040030544A (ko) 2004-04-09
KR100866180B1 true KR100866180B1 (ko) 2008-10-30

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Application Number Title Priority Date Filing Date
KR1020037012448A Expired - Lifetime KR100866180B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물
KR1020087009994A Expired - Lifetime KR100884438B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조에 사용되는 감광성 수지조성물

Family Applications After (1)

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KR1020087009994A Expired - Lifetime KR100884438B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조에 사용되는 감광성 수지조성물

Country Status (6)

Country Link
US (1) US7338751B2 (enExample)
JP (1) JP4200761B2 (enExample)
KR (2) KR100866180B1 (enExample)
CN (2) CN1282037C (enExample)
TW (1) TWI296738B (enExample)
WO (1) WO2002079877A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2417127A (en) * 2004-08-12 2006-02-15 Vetco Gray Controls Ltd Surface metallization of contact pads
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法
JP4804001B2 (ja) * 2004-12-28 2011-10-26 イビデン株式会社 プリント配線板の製造方法
KR100934046B1 (ko) * 2005-05-23 2009-12-24 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP2007012735A (ja) * 2005-06-29 2007-01-18 Cmk Corp プリント配線板の表面処理方法
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4730071B2 (ja) * 2005-11-29 2011-07-20 凸版印刷株式会社 回路基板の製造方法
JP4919921B2 (ja) * 2007-10-02 2012-04-18 東洋アルミニウム株式会社 Ｉｃカード・タグ用アンテナ回路構成体とその製造方法
KR101040475B1 (ko) * 2008-06-18 2011-06-09 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법
JP2010217903A (ja) * 2010-04-19 2010-09-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びプリント配線板の製造方法
JP5697461B2 (ja) * 2011-01-17 2015-04-08 ユニチカ株式会社 ポリエステルフィルム、および感光性樹脂構造体
CN102413629A (zh) * 2011-07-27 2012-04-11 大唐移动通信设备有限公司 一种印制电路板及其制造方法
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084283A1 (ja) * 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
US20140335350A1 (en) * 2011-12-05 2014-11-13 Hitachi Chemical Company, Ltd. Method for forming protective film on electrode for touch panel, photosensitive resin composition and photosensitive element, and method for manufacturing touch panel
JP5787239B2 (ja) * 2012-06-29 2015-09-30 荒川化学工業株式会社 印刷レジスト用活性エネルギー線硬化性樹脂組成物、これを用いたレジストパターンの形成方法、印刷レジスト積層体およびプリント配線基板
KR20140018016A (ko) * 2012-08-03 2014-02-12 삼성전기주식회사 인쇄회로기판의 제조방법
CN104883808B (zh) * 2015-05-05 2017-12-01 华为技术有限公司 一种印刷电路板及印刷电路板的制造方法
WO2017057584A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
JP6421161B2 (ja) * 2015-11-27 2018-11-07 株式会社タムラ製作所 感光性樹脂組成物
CN108490737B (zh) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 一种感光性树脂组合物及其用途
CN114127205B (zh) * 2019-06-26 2022-10-25 三菱瓦斯化学株式会社 树脂片、覆金属箔层叠板和印刷电路板
CN116745697A (zh) * 2021-01-29 2023-09-12 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282069A (ja) * 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd 厚膜回路用感光性樹脂組成物
EP0623852A1 (en) * 1993-05-07 1994-11-09 Ibiden Co, Ltd. Resist compositions for circuit boards
JPH09265188A (ja) * 1996-03-28 1997-10-07 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH1051107A (ja) * 1996-08-07 1998-02-20 Ibiden Co Ltd プリント配線板の製造方法、感光性組成物、ドライフィルムフォトレジスト
EP0916480A1 (en) * 1996-07-30 1999-05-19 Hitachi Chemical Company, Ltd. Manufacture of laminated film and printed wiring board
JPH11284336A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2000275831A (ja) * 1999-01-21 2000-10-06 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
EP1076262A1 (en) * 1999-08-09 2001-02-14 Mitsubishi Gas Chemical Company, Inc. Photosensitive resin

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DE3482215D1 (de) * 1983-07-01 1990-06-13 Fuji Photo Film Co Ltd Photopolymerisierbare zusammensetzung.
US6703181B1 (en) * 1993-03-12 2004-03-09 Kabushiki Kaisha Toshiba Photosensitive composition having uniform concentration distribution of components and pattern formation method using the same
EP0755803B1 (en) * 1995-02-14 2001-07-25 Toray Industries, Inc. Lithographic form plate
KR0150344B1 (ko) * 1995-12-21 1998-10-01 이웅열 감광성 수지 조성물
JP3055499B2 (ja) 1996-07-30 2000-06-26 日立化成工業株式会社 積層フィルム及びプリント配線板の製造法
US5922509A (en) 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282069A (ja) * 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd 厚膜回路用感光性樹脂組成物
EP0623852A1 (en) * 1993-05-07 1994-11-09 Ibiden Co, Ltd. Resist compositions for circuit boards
JPH09265188A (ja) * 1996-03-28 1997-10-07 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
EP0916480A1 (en) * 1996-07-30 1999-05-19 Hitachi Chemical Company, Ltd. Manufacture of laminated film and printed wiring board
JPH1051107A (ja) * 1996-08-07 1998-02-20 Ibiden Co Ltd プリント配線板の製造方法、感光性組成物、ドライフィルムフォトレジスト
JPH11284336A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2000275831A (ja) * 1999-01-21 2000-10-06 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
EP1076262A1 (en) * 1999-08-09 2001-02-14 Mitsubishi Gas Chemical Company, Inc. Photosensitive resin

Also Published As

Publication number Publication date
KR20080052681A (ko) 2008-06-11
JPWO2002079877A1 (ja) 2004-07-22
CN1282037C (zh) 2006-10-25
US20040086801A1 (en) 2004-05-06
JP4200761B2 (ja) 2008-12-24
CN1828411B (zh) 2010-11-24
CN1500232A (zh) 2004-05-26
KR100884438B1 (ko) 2009-02-19
TWI296738B (enExample) 2008-05-11
CN1828411A (zh) 2006-09-06
US7338751B2 (en) 2008-03-04
WO2002079877A1 (en) 2002-10-10
KR20040030544A (ko) 2004-04-09

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